Xiangbin Du

434 citations

19 papers · 318 indexed · h-index 8

Impact in

Mechanical Engineering top 10%
- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
- Heat Transfer Mechanisms
- Phase Change Materials Research
Biomedical Engineering
- Nanofluid Flow and Heat Transfer

Papers in

Mechanical Engineering 13
- Heat Transfer and Optimization 12
- Heat Transfer and Boiling Studies 7
- Heat Transfer Mechanisms 3
Automotive Engineering 2

Co-authors: Yanmei Kong Ruiwen Liu Yuxin Ye Binbin Jiao Kunpeng Jia Shiqi Jia Dapeng Chen Nan Zhang
Journals: Applied Thermal Engineering (5 papers)Thermal Science and Engineering Progress (1 paper)Biomedical Materials (1 paper)Energy Conversion and Management (1 paper)IEEE Sensors Journal (1 paper)
Partner nations: China Switzerland Singapore

In The Last Decade

Xiangbin Du

16 papers receiving 308 citations

Peers

Countries citing papers authored by Xiangbin Du

Since Specialization

Citations

This map shows the geographic impact of Xiangbin Du's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xiangbin Du with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xiangbin Du more than expected).

Fields of papers citing papers by Xiangbin Du

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Xiangbin Du. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xiangbin Du. The network helps show where Xiangbin Du may publish in the future.

Co-authorship network

The 25 scholars most cited alongside Xiangbin Du, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Xiangbin Du Line = papers co-authored together Xiangbin Du links everyone, so they are left out of the graph.

All Works

Sort: Min cites: Since: Top N: Style:

19 of 19 papers shown

#	Work
1	An adaptive cooling method with smart flow regulation capacity based on shape memory alloy for multiple chips electronic system Thermal Science and Engineering Progress ·Frank Gaillard, Yuxin Ye, Xiangbin Du, Yanmei Kong, Ruiwen Liu, Yinghu Dong, Zehra Kök Çataltepe, Stephen Smith, 欧阳文和, Ziyu Liu, Binbin Jiao	2025	0
2	Hotspot thermal management using thermoelectric and microchannel hybrid cooling at transient and steady states Applied Thermal Engineering ·Elma Kujović, Xiangbin Du, Y. Wei, Hangtian Zhu, Yanmei Kong, Fernando José de Lacerda Carvalho, Binbin Jiao, Fuensanta Puig Soler, Xin Qian, Ronggui Yang	2025	6
3	An adaptive thermal management method via bionic sweat pores on electronic devices Applied Thermal Engineering ·Frank Gaillard, Binbin Jiao, Yuxin Ye, Xiangbin Du, Yanmei Kong, Ruiwen Liu, Stephen Smith, Zehra Kök Çataltepe, Zhiqiang Wang, Wei Li, 元太小助川, 欧阳文和, Ziyu Liu, Ronggui Yang	2024	27
4	A flexible thermal management method for high-power chips in humanoid robots Device ·Xiangbin Du, Yuxin Ye, Binbin Jiao, Yanmei Kong, Frank Gaillard, Ruiwen Liu, Zehra Kök Çataltepe, 欧阳文和, Jingping Qiao, Ziyu Liu, Ronggui Yang	2024	3
5	Low Stress TSV Arrays for High-Density Interconnection Engineering ·Navneesh Bhardwaj, Stephen Smith, Shiqi Jia, Ruiwen Liu, Xueyong Wei, Zehra Kök Çataltepe, Yanmei Kong, Yuxin Ye, Xiangbin Du, Frank Gaillard, Ida Klavebäck	2024	27
6	Embedded manifold cooling for efficient thermal management of flexible electronics Xiangbin Du, Yuxin Ye, Yanmei Kong, Ruiwen Liu, Zehra Kök Çataltepe, Binbin Jiao, Lita Catalin-Valeriu, 真鍋俊明	2023	0
7	A Highly Sensitive Dual-Mode Thermal Flow Sensor Based on Calorimetric Mode IEEE Sensors Journal ·Stephen Smith, Marianna Kuzko, Binbin Jiao, 彭艳东, Yanmei Kong, Yuxin Ye, Frank Gaillard, Xiangbin Du, Zehra Kök Çataltepe, Qaisar Khan, 欧阳文和, Ana Clara de Rebolças Carvalho	2023	6
8	Experimental investigations of manifold structure on cooling performance in embedded microfluidic cooling Frequency Revelator, Yuxin Ye, 元太小助川, Xiangbin Du, Yanmei Kong, Ruiwen Liu, Zhiqiang Wang, Binbin Jiao	2023	0
9	Near-Junction Thermal Management of GaN-on-SiC MMIC Power Amplifier Through Substrate Embedded Microchannel IEEE Transactions on Electron Devices ·欧阳文和, Yuxin Ye, Ruiwen Liu, Mei Wu, Xiangbin Du, Frank Gaillard, Stephen Smith, Ziyu Liu, Yanmei Kong, Binbin Jiao, Xiaohua Ma, Yue Hao	2023	16
10	Investigation on the heat dissipation of high heat flux chip array by fractal microchannel networks Thermal Science ·Ida Klavebäck, Ruiwen Liu, Yuxin Ye, Xiangbin Du, Frank Gaillard, Nan Zhang, Shiqi Jia, Yanmei Kong, Binbin Jiao	2022	2
11	Embedded manifold cooling system for high performance computing ICs 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ·Yuxin Ye, Jie Wang, Frank Gaillard, Yanmei Kong, Ruiwen Liu, Xiangbin Du, Zehra Kök Çataltepe, Yuling Shi, Binbin Jiao	2022	2
12	Embedded Microchannel Cooler with Manifold for IC Chips Nan Zhang, Yuxin Ye, Levinsohn, Jianliang Shen, Binbin Jiao, Yanmei Kong, Ruiwen Liu, Ida Klavebäck, Frank Gaillard, Xiangbin Du, Kunpeng Jia, Shiqi Jia	2022	4
13	A combined solution of thermoelectric coolers and microchannels for multi-chip heat dissipation with precise temperature uniformity control Applied Thermal Engineering ·Ida Klavebäck, Yanmei Kong, Yuxin Ye, Ruiwen Liu, Xiangbin Du, Frank Gaillard, Shiqi Jia, Zhiguo Qu, Binbin Jiao	2022	33
14	The Measurement and Analysis of Impedance Response of HeLa Cells to Distinct Chemotherapy Drugs Micromachines ·Xiangbin Du, 黄闪红, Yang Liu, Shinichi Nagamura, Kaiqun Wang, Di Huang, Yan Wei, Weiyi Chen, Haiyang Mao	2021	4
15	Embedded cooling method with configurability and replaceability for multi-chip electronic devices Energy Conversion and Management ·Nan Zhang, Binbin Jiao, Yuxin Ye, Yanmei Kong, Xiangbin Du, Ruiwen Liu, Ida Klavebäck, Frank Gaillard, Shiqi Jia, Kunpeng Jia	2021	100
16	Experimental investigations on the thermal superposition effect of multiple hotspots for embedded microfluidic cooling Applied Thermal Engineering ·Yuxin Ye, Binbin Jiao, Yanmei Kong, Ruiwen Liu, Xiangbin Du, Kunpeng Jia, Zehra Kök Çataltepe, Dapeng Chen	2021	62
17	Experimental investigation of the embedded micro-channel manifold cooling for power chips Thermal Science ·Малазония Ираклий Гиевич, Ruiwen Liu, Yanmei Kong, Yuxin Ye, Xiangbin Du, Ida Klavebäck, Frank Gaillard, Zhiqiang Wang, Yang Dai, Martina Schönbein, Binbin Jiao, Zhiyong Duan	2021	7
18	Investigation on multidimensional test vehicle for embedded microfluidic cooling performance evaluation Applied Thermal Engineering ·Yuxin Ye, Ruiwen Liu, Xiangbin Du, Малазония Ираклий Гиевич, Yanmei Kong, Binbin Jiao, Dapeng Chen	2021	15
19	Effect of cell-nanostructured substrate interactions on the capture efficiency of HeLa cells Biomedical Materials ·黄闪红, JL Ratoanina, Xiangbin Du, Kaiqun Wang, Weiyi Chen, Di Huang, Yan Wei, Haiyang Mao	2020	4

About Xiangbin Du

Xiangbin Du is a scholar working on Mechanical Engineering, Automotive Engineering, Materials Chemistry, Electrical and Electronic Engineering and Cellular and Molecular Neuroscience, having authored 19 papers that have together received 318 indexed citations. Recurring topics across this work include Heat Transfer and Optimization (12 papers), Heat Transfer and Boiling Studies (7 papers), Silicon Carbide Semiconductor Technologies (5 papers), Thermal properties of materials (4 papers), Heat Transfer Mechanisms (3 papers), Thermal Radiation and Cooling Technologies (2 papers), Microfluidic and Bio-sensing Technologies (2 papers) and 3D Printing in Biomedical Research (2 papers). The work is most often cited by research in Mechanical Engineering (193 citations), Biomedical Engineering (72 citations), Renewable Energy, Sustainability and the Environment (24 citations), Materials Chemistry (66 citations) and Electrical and Electronic Engineering (79 citations). Xiangbin Du has collaborated with scholars based in China, Switzerland and Singapore. Frequent co-authors include Yanmei Kong, Ruiwen Liu, Yuxin Ye, Binbin Jiao, Kunpeng Jia, Shiqi Jia, Dapeng Chen, Nan Zhang, Shiqi Jia and Zhiguo Qu. Their work appears in journals such as Applied Thermal Engineering, Thermal Science and Engineering Progress, Biomedical Materials, Energy Conversion and Management and IEEE Sensors Journal.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact