Michael C. Hamilton
- Electrical and Electronic Engineering top 5%
- Materials Chemistry top 10%
- Biomedical Engineering top 10%
- Mechanical Engineering top 5%
- Atomic and Molecular Physics, and Optics top 10%
- Co-authors
- Jerzy KanickiSandrine MartinWayne JohnsonFang YuDaniel K. HarrisRoy W. KnightMasoud Mahjouri‐SamaniNurul Azam
- Topics
- Electronic Packaging and Soldering Technologies (23 papers)3D IC and TSV technologies (21 papers)Thin-Film Transistor Technologies (20 papers)
- Partner nations
- United StatesQatarSouth Korea
In The Last Decade
Michael C. Hamilton
142 papers receiving 2.1k citations
Peers
Comparison fields: 5 of 87
- Electrical and Electronic Engineering 1.4k
- Materials Chemistry 476
- Biomedical Engineering 475
- Mechanical Engineering 341
- Atomic and Molecular Physics, and Optics 300
Countries citing papers authored by Michael C. Hamilton
This map shows the geographic impact of Michael C. Hamilton's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael C. Hamilton with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael C. Hamilton more than expected).
Fields of papers citing papers by Michael C. Hamilton
This network shows the impact of papers produced by Michael C. Hamilton. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael C. Hamilton. The network helps show where Michael C. Hamilton may publish in the future.
Co-authorship network of co-authors of Michael C. Hamilton
This figure shows the co-authorship network connecting the top 25 collaborators of Michael C. Hamilton. A scholar is included among the top collaborators of Michael C. Hamilton based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Michael C. Hamilton. Michael C. Hamilton is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 3 | |
| 3 | 4 | |
| 4 | 4 | |
| 5 | 0 | |
| 6 | 1 | |
| 7 | 5 | |
| 8 | 2 | |
| 9 | 0 | |
| 10 | 1 | |
| 11 | 2 | |
| 12 | 9 | |
| 13 | 2 | |
| 14 | 5 | |
| 15 | 3 | |
| 16 | 16 | |
| 17 | 7 | |
| 18 | 4 | |
| 19 | 6 | |
| 20 | Broad frequency LTCC vertical interconnect transition for multichip modules and system on package applications | 5 |
About Michael C. Hamilton
Michael C. Hamilton is a scholar working on Electrical and Electronic Engineering, Condensed Matter Physics and Atomic and Molecular Physics, and Optics, having authored 158 papers that have together received 2.2k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (21 papers) and Thin-Film Transistor Technologies (20 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.4k citations), Polymers and Plastics (254 citations) and Biomedical Engineering (475 citations). Michael C. Hamilton has collaborated with scholars based in United States, Qatar and South Korea. Frequent co-authors include Jerzy Kanicki, Sandrine Martin, Wayne Johnson, Fang Yu, Daniel K. Harris, Roy W. Knight, Masoud Mahjouri‐Samani, Nurul Azam, Ran Cheng and Marcelo A. Kuroda. Their work appears in journals such as Nano Letters, ACS Nano and Applied Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.