Michael C. Hamilton

4.9k total citations
158 papers, 2.2k citations indexed

About

Michael C. Hamilton is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Michael C. Hamilton has authored 158 papers receiving a total of 2.2k indexed citations (citations by other indexed papers that have themselves been cited), including 110 papers in Electrical and Electronic Engineering, 31 papers in Materials Chemistry and 26 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Michael C. Hamilton's work include Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (21 papers) and Thin-Film Transistor Technologies (20 papers). Michael C. Hamilton is often cited by papers focused on Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (21 papers) and Thin-Film Transistor Technologies (20 papers). Michael C. Hamilton collaborates with scholars based in United States, Qatar and South Korea. Michael C. Hamilton's co-authors include Jerzy Kanicki, Sandrine Martin, Wayne Johnson, Fang Yu, Daniel K. Harris, Roy W. Knight, Masoud Mahjouri‐Samani, Nurul Azam, Ran Cheng and Marcelo A. Kuroda and has published in prestigious journals such as Nano Letters, ACS Nano and Applied Physics Letters.

In The Last Decade

Michael C. Hamilton

142 papers receiving 2.1k citations

Peers

Michael C. Hamilton

EEE

AMPO

Kenichi Takahata Canada

Jun Mizuno Japan

Jordan M. Berg United States

Jin Luo United Kingdom

Van Thanh Dau Australia

Ian G. Foulds Canada

J. Andrew Yeh Taiwan

Yutaka Yamagata Japan

Massood Tabib‐Azar United States

Susumu Sugiyama Japan

Kenichi Takahata Canada

Michael C. Hamilton

1.7k ×1.2

EEE

449 ×0.9

1.4k ×2.9

474 ×1.4

376 ×1.3

AMPO

Citations per year, relative to Michael C. Hamilton Michael C. Hamilton (= 1×) peers Kenichi Takahata

Countries citing papers authored by Michael C. Hamilton

Since Specialization

Citations

This map shows the geographic impact of Michael C. Hamilton's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael C. Hamilton with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael C. Hamilton more than expected).

Fields of papers citing papers by Michael C. Hamilton

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Michael C. Hamilton. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael C. Hamilton. The network helps show where Michael C. Hamilton may publish in the future.

Co-authorship network of co-authors of Michael C. Hamilton

This figure shows the co-authorship network connecting the top 25 collaborators of Michael C. Hamilton. A scholar is included among the top collaborators of Michael C. Hamilton based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Michael C. Hamilton. Michael C. Hamilton is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Gupta, Vaibhav, et al.. (2025). Bonding of Multiple Fine Pitch Flexible Cables to a Single Multi-Chip Module for Cryogenic/Superconductive Computing Applications. IEEE Transactions on Applied Superconductivity. 35(5). 1–6.

Hamilton, Michael C., et al.. (2024). Increasing Chip-to-Substrate Spacing Using in Capped SnPb Pillars as Flip Chip Interconnects for Physical Isolation in Superconducting Applications. IEEE Transactions on Applied Superconductivity. 34(3). 1–6. 3 indexed citations

Hamilton, Michael C., et al.. (2024). DC-biased Suzuki stack circuit for Josephson-CMOS memory applications. Superconductor Science and Technology. 37(8). 85023–85023. 4 indexed citations

Xiong, Yuzan, Andrew G. Christy, Junming Wu, et al.. (2024). Hybrid magnonics with localized spoof surface-plasmon polaritons. Physical Review Applied. 22(3). 4 indexed citations

Xiong, Yuzan, et al.. (2024). Tailored Multi-mode, High-Q Superconducting Nb Resonators: Unique Platform for Magnon-Photon Coupling. 2244–2249.

Köse, Selçuk, et al.. (2024). Signal Integrity Simulations of 4JL Gate Pulses From 4 K to 50 K. IEEE Transactions on Applied Superconductivity. 35(5). 1–6. 1 indexed citations

Li, Hao, Han Cai, Ran Cheng, et al.. (2023). Transport Properties of NbN Thin Films Patterned With a Focused Helium Ion Beam. IEEE Transactions on Applied Superconductivity. 33(5). 1–4. 5 indexed citations

Kar, Soumen, Stephen C. Olson, Jakub Nalaskowski, et al.. (2023). Copper Encapsulated Ultra-Thin NbN Films and Damascene Structures on 300 mm Si Wafers. IEEE Transactions on Applied Superconductivity. 33(5). 1–5. 2 indexed citations

Hamilton, Michael C., et al.. (2023). Al/AlOx/Al Josephson Junctions Fabricated by Shadow Evaporation Employing Multiple Symmetric Angled Depositions Per Channel. IEEE Transactions on Applied Superconductivity. 33(5). 1–5.

10.

Ward, Jacob, et al.. (2023). Influence of Laser Processing Proximity on Superconducting Film Performance. IEEE Transactions on Applied Superconductivity. 33(5). 1–5. 1 indexed citations

11.

Ward, Jacob, et al.. (2022). Additive manufacturing and characterization of microstructures using two-photon polymerization for use in cryogenic applications. Journal of materials research/Pratt's guide to venture capital sources. 37(12). 1978–1985. 2 indexed citations

12.

Cheng, Ran, et al.. (2021). High-Speed and Low-Power Superconducting Neuromorphic Circuits Based on Quantum Phase-Slip Junctions. IEEE Transactions on Applied Superconductivity. 31(5). 1–8. 9 indexed citations

13.

Gupta, Vaibhav, et al.. (2021). Radiation Effects on Thin Flexible Superconducting Cables. IEEE Transactions on Applied Superconductivity. 31(5). 1–5. 2 indexed citations

14.

Gupta, Vaibhav, et al.. (2021). Towards Cable-to-Cable Connectors for Flexible Thin-Film Superconducting Transmission Lines. IEEE Transactions on Applied Superconductivity. 31(5). 1–6. 5 indexed citations

15.

Gupta, Vaibhav, et al.. (2019). Distinguishing Dielectric Loss From Superconductor Loss Using Flexible Thin-Film Superconducting Resonator Structures. IEEE Transactions on Applied Superconductivity. 29(5). 1–5. 3 indexed citations

16.

Gupta, Vaibhav, et al.. (2019). Thin-Film Nb/Polyimide Superconducting Stripline Flexible Cables. IEEE Transactions on Applied Superconductivity. 29(5). 1–5. 16 indexed citations

17.

Gupta, Vaibhav, et al.. (2019). Low-loss cable-to-cable parallel connection method for thin-film superconducting flexible microwave transmission lines. Superconductor Science and Technology. 32(7). 75006–75006. 7 indexed citations

18.

Cao, Yang, et al.. (2016). Microwave Loss Measurements of Copper-Clad Superconducting Niobium Microstrip Resonators on Flexible Polyimide Substrates. IEEE Transactions on Applied Superconductivity. 27(4). 1–7. 4 indexed citations

19.

Gupta, Vaibhav, et al.. (2016). Influence of Fatigue and Bending Strain on Critical Currents of Niobium Superconducting Flexible Cables Containing Ti and Cu Interfacial Layers. IEEE Transactions on Applied Superconductivity. 27(4). 1–5. 6 indexed citations

20.

Decrossas, Emmanuel, et al.. (2013). Broad frequency LTCC vertical interconnect transition for multichip modules and system on package applications. European Microwave Conference. 104–107. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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