V. Hoffman
Impact in
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- Supercapacitor Materials and Fabrication
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- Graphene research and applications
- Diamond and Carbon-based Materials Research
- Carbon Nanotubes in Composites
- 2D Materials and Applications
Papers in
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- Semiconductor materials and devices 3
- 3D IC and TSV technologies 2
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- Copper Interconnects and Reliability 6
- Co-authors
- Felix Börrnert (1 shared paper)Alicja Bachmatiuk (1 shared paper)Jamie H. Warner (1 shared paper)B. Büchner (1 shared paper)A.J. Scott (1 shared paper)Gianaurelio Cuniberti (1 shared paper)Jarrn‐Horng Lin (1 shared paper)Tianyi Lin (1 shared paper)
- Journals
- Thin Solid Films (2 papers)ACS Nano (1 paper)Physical Review A (1 paper)Review of Scientific Instruments (1 paper)IEEE Electron Device Letters (1 paper)
- Partner nations
- United StatesGermanySweden
In The Last Decade
V. Hoffman
11 papers receiving 358 citations
Peers
Comparison fields: 5 of 52
- Electronic, Optical and Magnetic Materials 104
- Materials Chemistry 256
- Electrical and Electronic Engineering 181
- Biomedical Engineering 95
- Surfaces, Coatings and Films 14
Countries citing papers authored by V. Hoffman
This map shows the geographic impact of V. Hoffman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Hoffman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Hoffman more than expected).
Fields of papers citing papers by V. Hoffman
This network shows the impact of papers produced by V. Hoffman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Hoffman. The network helps show where V. Hoffman may publish in the future.
Co-authors
The 25 scholars most cited alongside V. Hoffman, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 293 | |
| 2 | 2003 | 24 | |
| 3 | 1987 | 12 | |
| 4 | 1987 | 11 | |
| 5 | 1977 | 10 | |
| 6 | 1997 | 4 | |
| 7 | 1997 | 4 | |
| 8 | 2000 | 4 | |
| 9 | 2002 | 3 | |
| 10 | 2002 | 3 | |
| 11 | 1974 | 2 | |
| 12 | 2002 | 0 |
About V. Hoffman
V. Hoffman is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Biomedical Engineering and Computational Mechanics, having authored 12 papers that have together received 370 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (6 papers), Semiconductor materials and devices (3 papers), Semiconductor materials and interfaces (2 papers), 3D IC and TSV technologies (2 papers), Advanced Surface Polishing Techniques (2 papers), Synthesis of Organic Compounds (1 paper), Metal and Thin Film Mechanics (1 paper) and Atomic and Molecular Physics (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (104 citations), Materials Chemistry (256 citations), Electrical and Electronic Engineering (181 citations), Biomedical Engineering (95 citations) and Surfaces, Coatings and Films (14 citations). V. Hoffman has collaborated with scholars based in United States, Germany and Sweden. Frequent co-authors include Felix Börrnert, Alicja Bachmatiuk, Jamie H. Warner, B. Büchner, A.J. Scott, Gianaurelio Cuniberti, Jarrn‐Horng Lin, Tianyi Lin, Michael Speitling and Ratnakar N. Asolkar. Their work appears in journals such as Thin Solid Films, ACS Nano, Physical Review A, Review of Scientific Instruments and IEEE Electron Device Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.