Todd R. Salamon
Impact in
- Surfaces, Coatings and Films top 0.5%
- Surface Modification and Superhydrophobicity
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- Rheology and Fluid Dynamics Studies
Papers in
-
- Surface Modification and Superhydrophobicity 11
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- Heat Transfer and Boiling Studies 24
- Heat Transfer and Optimization 3
- Co-authors
- Paul R. Kolodner (11 shared papers)Tom N. Krupenkin (6 shared papers)J. Ashley Taylor (2 shared papers)Edgar J. Lobaton (2 shared papers)Marc S. Hodes (11 shared papers)Evelyn N. Wang (6 shared papers)Robert A. Brown (6 shared papers)Robert C. Armstrong (6 shared papers)
- Journals
- Physics of Fluids (4 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (4 papers)Journal of Electronic Packaging (2 papers)International Journal of Heat and Mass Transfer (2 papers)Langmuir (2 papers)
- Partner nations
- United StatesSwitzerlandIreland
In The Last Decade
Todd R. Salamon
53 papers receiving 1.4k citations
Peers
Comparison fields: 5 of 36
- Surfaces, Coatings and Films 512
- Fluid Flow and Transfer Processes 73
- Computational Mechanics 148
- Mechanical Engineering 251
- Electrical and Electronic Engineering 80
Countries citing papers authored by Todd R. Salamon
This map shows the geographic impact of Todd R. Salamon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Todd R. Salamon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Todd R. Salamon more than expected).
Fields of papers citing papers by Todd R. Salamon
This network shows the impact of papers produced by Todd R. Salamon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Todd R. Salamon. The network helps show where Todd R. Salamon may publish in the future.
Co-authors
The 25 scholars most cited alongside Todd R. Salamon, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 57 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 312 | |
| 2 | 2007 | 238 | |
| 3 | 2018 | 160 | |
| 4 | 1994 | 114 | |
| 5 | 1995 | 74 | |
| 6 | 2007 | 74 | |
| 7 | 2016 | 67 | |
| 8 | 2020 | 61 | |
| 9 | 2013 | 58 | |
| 10 | 2010 | 56 | |
| 11 | 1995 | 29 | |
| 12 | 2006 | 19 | |
| 13 | 2022 | 18 | |
| 14 | 2012 | 17 | |
| 15 | 2005 | 16 | |
| 16 | 1997 | 15 | |
| 17 | 2017 | 13 | |
| 18 | 1997 | 12 | |
| 19 | 2020 | 11 | |
| 20 | 2017 | 10 |
About Todd R. Salamon
Todd R. Salamon is a scholar working on Surfaces, Coatings and Films, Mechanical Engineering, Fluid Flow and Transfer Processes, Computational Mechanics and Electrical and Electronic Engineering, having authored 57 papers that have together received 1.5k indexed citations. Recurring topics across this work include Heat Transfer and Boiling Studies (24 papers), Surface Modification and Superhydrophobicity (11 papers), Optical Network Technologies (3 papers), Heat Transfer and Optimization (3 papers), Rheology and Fluid Dynamics Studies (2 papers), Fluid Dynamics and Thin Films (2 papers), Advanced Numerical Methods in Computational Mathematics (1 paper) and Advanced Thermoelectric Materials and Devices (1 paper). The work is most often cited by research in Surfaces, Coatings and Films (512 citations), Fluid Flow and Transfer Processes (73 citations), Computational Mechanics (148 citations), Mechanical Engineering (251 citations) and Electrical and Electronic Engineering (80 citations). Todd R. Salamon has collaborated with scholars based in United States, Switzerland and Ireland. Frequent co-authors include Paul R. Kolodner, Tom N. Krupenkin, J. Ashley Taylor, Edgar J. Lobaton, Marc S. Hodes, Evelyn N. Wang, Robert A. Brown, Robert C. Armstrong, Victor A. Lifton and Alexander Sidorenko. Their work appears in journals such as Physics of Fluids, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electronic Packaging, International Journal of Heat and Mass Transfer and Langmuir.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.