S.-S. Yang

534 total citations
20 papers, 402 citations indexed

About

S.-S. Yang is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Biotechnology. According to data from OpenAlex, S.-S. Yang has authored 20 papers receiving a total of 402 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 8 papers in Mechanics of Materials and 4 papers in Biotechnology. Recurrent topics in S.-S. Yang's work include Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Adhesion, Friction, and Surface Interactions (7 papers). S.-S. Yang is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Adhesion, Friction, and Surface Interactions (7 papers). S.-S. Yang collaborates with scholars based in Taiwan, United States and China. S.-S. Yang's co-authors include Yuxun Zhou, Anil Pahwa, Shuo‐Fu Yuan, Steven G. Nelson, Yi‐Ming Chiang, Μ. Y. Tsai, Chien‐Shun Chiou, Pei‐Hui Lin, Chen‐Yu Huang and Hsien‐Chie Cheng and has published in prestigious journals such as IEEE Transactions on Power Systems, Environment International and Renewable Energy.

In The Last Decade

S.-S. Yang

20 papers receiving 360 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
S.-S. Yang Taiwan	10	138	103	65	49	48	20	402
Ziyue Li China	12	40 0.3×	41 0.4×	12 0.2×	13 0.3×	21 0.4×	33	484
Jianghua Li China	15	9 0.1×	39 0.4×	82 1.3×	41 0.8×	11 0.2×	61	567
Yali Duan China	16	97 0.7×	14 0.1×	24 0.4×	3 0.1×	33 0.7×	42	576
Dou Dou China	9	26 0.2×	43 0.4×	109 1.7×	5 0.1×	9 0.2×	68	375
Xi Xia China	15	48 0.3×	92 0.9×	57 0.9×	17 0.3×	8 0.2×	71	832
Guijin Zhang China	13	13 0.1×	31 0.3×	182 2.8×	43 0.9×	4 0.1×	33	717
Haiying Wang China	10	157 1.1×	7 0.1×	10 0.2×	6 0.1×	38 0.8×	39	392
Mohammad Reza Zareifard Iran	21	21 0.2×	369 3.6×	23 0.4×	117 2.4×	15 0.3×	36	1.0k
Lei Xing China	9	22 0.2×	13 0.1×	152 2.3×	29 0.6×	4 0.1×	59	541

Countries citing papers authored by S.-S. Yang

Since Specialization

Citations

This map shows the geographic impact of S.-S. Yang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S.-S. Yang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S.-S. Yang more than expected).

Fields of papers citing papers by S.-S. Yang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S.-S. Yang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S.-S. Yang. The network helps show where S.-S. Yang may publish in the future.

Co-authorship network of co-authors of S.-S. Yang

This figure shows the co-authorship network connecting the top 25 collaborators of S.-S. Yang. A scholar is included among the top collaborators of S.-S. Yang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S.-S. Yang. S.-S. Yang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Cheng, Wangjun, et al.. (2025). Enhanced strength and ductility of pure copper at liquid nitrogen temperature. Journal of Alloys and Compounds. 1024. 180080–180080. 1 indexed citations

Chiou, Chien‐Shun, et al.. (2009). Application ofrecAandrpoBsequence analysis on phylogeny and molecular identification ofGeobacillusspecies. Journal of Applied Microbiology. 107(2). 452–464. 27 indexed citations

Cheng, Hsien‐Chie, et al.. (2009). Thermal-Mechanical Process Simulation of an Advanced NCF Technology. IEEE Transactions on Electronics Packaging Manufacturing. 32(4). 301–310. 2 indexed citations

Tsai, Μ. Y., et al.. (2008). Transient Stress Distributions in NCF-Bonded COG Packages due to Moisture Diffusion. IEEE Transactions on Advanced Packaging. 31(3). 454–462. 3 indexed citations

Tsai, Μ. Y., et al.. (2007). An Approach to Determining Residual Strains and Moisture Diffusion Coefficients of Cured Adhesives in Electronic Packaging. 711–717. 2 indexed citations

Tsai, Μ. Y., et al.. (2007). Moisture Ingression Effect on Stress Distributions in NCF-Bonded COG Packages. 26. 467–474. 3 indexed citations

Tsai, Μ. Y., Chengyu Wu, Chen‐Yu Huang, Wei‐Chung Cheng, & S.-S. Yang. (2006). Study of Some Parameter Effects on Warpage and Bump-Joint Stresses of COG Packages. IEEE Transactions on Advanced Packaging. 29(3). 587–598. 21 indexed citations

Tsai, Μ. Y., et al.. (2006). Temperature- and Moisture-Induced Warpages of COG Package with Non-Conductive Paste Adhesive. 1928–1934. 4 indexed citations

Zhou, Yuxun, Anil Pahwa, & S.-S. Yang. (2006). Modeling Weather-Related Failures of Overhead Distribution Lines. IEEE Transactions on Power Systems. 21(4). 1683–1690. 160 indexed citations

10.

Cheng, Hsien‐Chie, et al.. (2006). A Study of Process-Induced Deformations of Anisotropic Conductive Film (ACF) Assembly. IEEE Transactions on Components and Packaging Technologies. 29(3). 577–588. 21 indexed citations

11.

Tsai, Μ. Y., et al.. (2005). Effects of some parameters on warpage and bump-joint stresses of COG packages. 21. 182–190. 1 indexed citations

12.

Yang, S.-S., et al.. (2001). Microbial ecology of soils surrounding nuclear and thermal power plants in Taiwan. Environment International. 26(5-6). 315–322. 9 indexed citations

13.

Zhang, Hao, et al.. (2001). [A sinorhizobium fredll strain that effectively nodulate Medicago sativa].. PubMed. 41(2). 127–32. 1 indexed citations

14.

Yang, S.-S., et al.. (2001). Methane emission from paddy fields in Taiwan. Biology and Fertility of Soils. 33(2). 157–165. 25 indexed citations

15.

Yang, S.-S., et al.. (1996). Oxytetracycline production by Streptomyces rimosus in solid-state fermentation of corncob. World Journal of Microbiology and Biotechnology. 12(1). 43–46. 24 indexed citations

16.

Yang, S.-S.. (1996). Antibiotics production of cellulosic waste with solid state fermentation by Streptomyces. Renewable Energy. 9(1-4). 976–979. 9 indexed citations

17.

Yang, S.-S., et al.. (1993). Protein enrichment of sweet potato residue by solid-state cultivation with mono- and co-cultures of amylolytic fungi. World Journal of Microbiology and Biotechnology. 9(2). 258–264. 20 indexed citations

18.

Yang, S.-S. & Shuo‐Fu Yuan. (1990). Oxytetracycline production byStreptomyces rimosus in solid state fermentation of sweet potato residue. World Journal of Microbiology and Biotechnology. 6(3). 236–244. 29 indexed citations

19.

Yang, S.-S., et al.. (1986). Protease production with sweet potato residue by solid state fermentation.. PubMed. 19(4). 276–88. 11 indexed citations

20.

Nelson, Steven G., S.-S. Yang, & Yi‐Ming Chiang. (1983). Yield and Quality of Agar from Species of Gracilaria (Rhodophyta) Collected from Taiwan and Micronesia. Botanica Marina. 26(8). 361–366. 29 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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