Chia‐Ming Hsu

50 total papers · 826 total citations
32 papers, 655 citations indexed

Chia‐Ming Hsu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Chia‐Ming Hsu has authored 32 papers receiving a total of 655 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 6 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Chia‐Ming Hsu’s work include Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (6 papers) and Semiconductor materials and interfaces (5 papers). Chia‐Ming Hsu is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (6 papers) and Semiconductor materials and interfaces (5 papers). Chia‐Ming Hsu collaborates with scholars based in Taiwan, Japan and United States. Chia‐Ming Hsu's co-authors include H.C. Shih, Y. Y. Chen, J.W. Yeh, Sinn-wen Chen, Y.Y. Chen, Jien‐Wei Yeh, Chih Chen, D. J. Yao, T. L. Shao and Yih Ho and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.