Chia‐Ming Hsu
Impact in
- Aerospace Engineering top 5%
- High-Temperature Coating Behaviors
- Mechanical Engineering top 5%
- High Entropy Alloys Studies
- Advanced materials and composites
- Intermetallics and Advanced Alloy Properties
- Additive Manufacturing Materials and Processes
Papers in ⓘ
-
- Electronic Packaging and Soldering Technologies 17
- 3D IC and TSV technologies 6
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- Intermetallics and Advanced Alloy Properties 5
- Advanced Welding Techniques Analysis 4
- Co-authors
- H.C. Shih (2 shared papers)J.W. Yeh (1 shared paper)Y. Y. Chen (1 shared paper)Sinn-wen Chen (17 shared papers)Jien‐Wei Yeh (2 shared papers)Y.Y. Chen (2 shared papers)Chih Chen (1 shared paper)D. J. Yao (1 shared paper)
- Journals
- Materials Chemistry and Physics (6 papers)Journal of Electronic Materials (3 papers)Metallurgical and Materials Transactions A (3 papers)European Journal of Medicinal Chemistry (2 papers)The International Journal of Advanced Manufacturing Technology (2 papers)
- Partner nations
- TaiwanJapanUnited States
In The Last Decade
Chia‐Ming Hsu
34 papers receiving 672 citations
Peers
Comparison fields: 5 of 61
- Aerospace Engineering 318
- Mechanical Engineering 475
- General Materials Science 31
- Metals and Alloys 19
- Electrical and Electronic Engineering 218
Countries citing papers authored by Chia‐Ming Hsu
This map shows the geographic impact of Chia‐Ming Hsu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chia‐Ming Hsu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chia‐Ming Hsu more than expected).
Fields of papers citing papers by Chia‐Ming Hsu
This network shows the impact of papers produced by Chia‐Ming Hsu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chia‐Ming Hsu. The network helps show where Chia‐Ming Hsu may publish in the future.
Co-authors
The 25 scholars most cited alongside Chia‐Ming Hsu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 36 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 208 | |
| 2 | 2008 | 121 | |
| 3 | 2006 | 74 | |
| 4 | 2011 | 36 | |
| 5 | 2016 | 32 | |
| 6 | 2017 | 20 | |
| 7 | 2003 | 18 | |
| 8 | 2012 | 17 | |
| 9 | 2012 | 13 | |
| 10 | 2007 | 13 | |
| 11 | 2011 | 12 | |
| 12 | 2011 | 11 | |
| 13 | 2007 | 11 | |
| 14 | 2011 | 11 | |
| 15 | 2013 | 10 | |
| 16 | 2003 | 9 | |
| 17 | 2013 | 9 | |
| 18 | 2013 | 9 | |
| 19 | 2003 | 9 | |
| 20 | 2024 | 7 |
About Chia‐Ming Hsu
Chia‐Ming Hsu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Atomic and Molecular Physics, and Optics, Aerospace Engineering and Molecular Biology, having authored 36 papers that have together received 693 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (6 papers), Intermetallics and Advanced Alloy Properties (5 papers), Semiconductor materials and interfaces (5 papers), Advanced Welding Techniques Analysis (4 papers), Metallurgical and Alloy Processes (4 papers), High-Temperature Coating Behaviors (3 papers) and Aluminum Alloy Microstructure Properties (3 papers). The work is most often cited by research in Aerospace Engineering (318 citations), Mechanical Engineering (475 citations), General Materials Science (31 citations), Metals and Alloys (19 citations) and Electrical and Electronic Engineering (218 citations). Chia‐Ming Hsu has collaborated with scholars based in Taiwan, Japan and United States. Frequent co-authors include H.C. Shih, J.W. Yeh, Y. Y. Chen, Sinn-wen Chen, Jien‐Wei Yeh, Y.Y. Chen, Chih Chen, D. J. Yao, T. L. Shao and Shih‐kang Lin. Their work appears in journals such as Materials Chemistry and Physics, Journal of Electronic Materials, Metallurgical and Materials Transactions A, European Journal of Medicinal Chemistry and The International Journal of Advanced Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.