Per Øhlckers
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- Advanced MEMS and NEMS Technologies 18
- Advanced Electrical Measurement Techniques 10
- 3D IC and TSV technologies 9
- Photonic and Optical Devices 7
- Electrical and Thermal Properties of Materials 6
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- Supercapacitor Materials and Fabrication 10
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- Mechanical and Optical Resonators 6
- Biophysics top 10%
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- Advanced Sensor and Energy Harvesting Materials 8
- Co-authors
- Xuyuan ChenA. HanneborgMartin NeseMuhammad Nadeem AkramXiaofeng FanRuilin ZhengPai LuZhaochu Yang
- Cited by
- Electrical and Electronic EngineeringElectronic, Optical and Magnetic MaterialsAtomic and Molecular Physics, and Optics
In The Last Decade
Per Øhlckers
59 papers receiving 700 citations
Peers
Comparison fields: 5 of 78
- Electrical and Electronic Engineering 493
- Electronic, Optical and Magnetic Materials 136
- Atomic and Molecular Physics, and Optics 151
- Biophysics 27
- Bioengineering 25
Countries citing papers authored by Per Øhlckers
This map shows the geographic impact of Per Øhlckers's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Per Øhlckers with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Per Øhlckers more than expected).
Fields of papers citing papers by Per Øhlckers
This network shows the impact of papers produced by Per Øhlckers. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Per Øhlckers. The network helps show where Per Øhlckers may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Per Øhlckers, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2025 | 0 | |
| 3 | 2024 | 0 | |
| 4 | 2023 | 5 | |
| 5 | 2022 | 3 | |
| 6 | 2021 | 4 | |
| 7 | 2021 | 4 | |
| 8 | 2020 | 2 | |
| 9 | 2020 | 2 | |
| 10 | 2019 | 10 | |
| 11 | 2019 | 20 | |
| 12 | 2019 | 2 | |
| 13 | 2014 | 1 | |
| 14 | 2011 | 41 | |
| 15 | 2011 | 109 | |
| 16 | A clover shaped silicon piezoresistive microphone for miniaturiz Photoacoustic Gas sensors | 2009 | 2 |
| 17 | 2009 | 2 | |
| 18 | Advantages and Limitations of Diamond-Like Carbon as a MEMS Thin Film Material | 2008 | 3 |
| 19 | Electronic components, packaging and production | 1995 | 7 |
| 20 | 1995 | 6 |
About Per Øhlckers
Per Øhlckers is a scholar working on Electrical and Electronic Engineering, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics and Renewable Energy, Sustainability and the Environment, having authored 65 papers that have together received 746 indexed citations. Recurring topics across this work include Advanced MEMS and NEMS Technologies (18 papers), Advanced Electrical Measurement Techniques (10 papers), Supercapacitor Materials and Fabrication (10 papers), 3D IC and TSV technologies (9 papers), Advanced Sensor and Energy Harvesting Materials (8 papers), Photonic and Optical Devices (7 papers), Mechanical and Optical Resonators (6 papers) and Electrical and Thermal Properties of Materials (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (493 citations), Electronic, Optical and Magnetic Materials (136 citations), Atomic and Molecular Physics, and Optics (151 citations), Biophysics (27 citations) and Bioengineering (25 citations). Per Øhlckers has collaborated with scholars based in Norway, Germany and Finland. Frequent co-authors include Xuyuan Chen, A. Hanneborg, Martin Nese, Muhammad Nadeem Akram, Xiaofeng Fan, Ruilin Zheng, Pai Lu, Zhaochu Yang, Jouni Ahopelto and Mika Prunnila. Their work appears in journals such as Sensors and Actuators A Physical, Journal of Micromechanics and Microengineering, Applied Sciences, Microelectronics Reliability and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.