Anmin Hu
Impact in
- Ceramics and Composites top 2%
- Glass properties and applications
- Surfaces, Coatings and Films top 2%
- Surface Modification and Superhydrophobicity
Papers in
-
- Electronic Packaging and Soldering Technologies 98
- 3D IC and TSV technologies 75
- Electrodeposition and Electroless Coatings 16
- Nanomaterials and Printing Technologies 11
-
- Advanced Welding Techniques Analysis 35
- Intermetallics and Advanced Alloy Properties 15
- Co-authors
- Dali Mao (31 shared papers)Ming Li (55 shared papers)Tao Hang (39 shared papers)Ming Li (8 shared papers)Huiqin Ling (11 shared papers)Huiqin Ling (25 shared papers)Ming Li (18 shared papers)Fei Peng (5 shared papers)
- Journals
- Applied Surface Science (15 papers)Materials Letters (10 papers)Materials Characterization (9 papers)Electronic Materials Letters (9 papers)Journal of Materials Science Materials in Electronics (7 papers)
- Partner nations
- ChinaUnited StatesSouth Korea
In The Last Decade
Anmin Hu
145 papers receiving 2.5k citations
Peers
Comparison fields: 5 of 80
- Ceramics and Composites 266
- Surfaces, Coatings and Films 321
- Electrical and Electronic Engineering 1.6k
- Mechanical Engineering 791
- Renewable Energy, Sustainability and the Environment 335
Countries citing papers authored by Anmin Hu
This map shows the geographic impact of Anmin Hu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Anmin Hu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Anmin Hu more than expected).
Fields of papers citing papers by Anmin Hu
This network shows the impact of papers produced by Anmin Hu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Anmin Hu. The network helps show where Anmin Hu may publish in the future.
Co-authors
The 25 scholars most cited alongside Anmin Hu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 154 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 166 | |
| 2 | 2006 | 102 | |
| 3 | 2007 | 96 | |
| 4 | 2012 | 76 | |
| 5 | 2020 | 69 | |
| 6 | 2019 | 62 | |
| 7 | 2002 | 61 | |
| 8 | 2019 | 60 | |
| 9 | 2007 | 58 | |
| 10 | 2004 | 57 | |
| 11 | 2006 | 55 | |
| 12 | 2012 | 49 | |
| 13 | 2018 | 47 | |
| 14 | 2011 | 45 | |
| 15 | 2010 | 44 | |
| 16 | 2018 | 44 | |
| 17 | 2010 | 41 | |
| 18 | 2004 | 38 | |
| 19 | 2021 | 38 | |
| 20 | 2015 | 36 |
About Anmin Hu
Anmin Hu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering and Materials Chemistry, having authored 154 papers that have together received 2.6k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (98 papers), 3D IC and TSV technologies (75 papers), Advanced Welding Techniques Analysis (35 papers), Copper Interconnects and Reliability (21 papers), Electrodeposition and Electroless Coatings (16 papers), Intermetallics and Advanced Alloy Properties (15 papers), Surface Modification and Superhydrophobicity (13 papers) and Nanomaterials and Printing Technologies (11 papers). The work is most often cited by research in Ceramics and Composites (266 citations), Surfaces, Coatings and Films (321 citations), Electrical and Electronic Engineering (1.6k citations), Mechanical Engineering (791 citations) and Renewable Energy, Sustainability and the Environment (335 citations). Anmin Hu has collaborated with scholars based in China, United States and South Korea. Frequent co-authors include Dali Mao, Ming Li, Tao Hang, Ming Li, Huiqin Ling, Huiqin Ling, Ming Li, Fei Peng, Xi Chen and M. Li. Their work appears in journals such as Applied Surface Science, Materials Letters, Materials Characterization, Electronic Materials Letters and Journal of Materials Science Materials in Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.