Anmin Hu

3.0k total citations
153 papers, 2.5k citations indexed

About

Anmin Hu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Anmin Hu has authored 153 papers receiving a total of 2.5k indexed citations (citations by other indexed papers that have themselves been cited), including 127 papers in Electrical and Electronic Engineering, 63 papers in Mechanical Engineering and 25 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Anmin Hu's work include Electronic Packaging and Soldering Technologies (98 papers), 3D IC and TSV technologies (75 papers) and Advanced Welding Techniques Analysis (35 papers). Anmin Hu is often cited by papers focused on Electronic Packaging and Soldering Technologies (98 papers), 3D IC and TSV technologies (75 papers) and Advanced Welding Techniques Analysis (35 papers). Anmin Hu collaborates with scholars based in China, United States and Japan. Anmin Hu's co-authors include Dali Mao, Ming Li, Tao Hang, Ming Li, Huiqin Ling, Ming Li, Huiqin Ling, Qiang Cai, Fei Peng and Xi Chen and has published in prestigious journals such as SHILAP Revista de lepidopterología, ACS Nano and Journal of The Electrochemical Society.

In The Last Decade

Anmin Hu

141 papers receiving 2.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Anmin Hu China 30 1.5k 783 744 372 327 153 2.5k
Dali Mao China 34 1.3k 0.8× 566 0.7× 1.6k 2.2× 400 1.1× 263 0.8× 103 2.8k
Yongchun Zou China 28 451 0.3× 727 0.9× 1.1k 1.4× 155 0.4× 124 0.4× 111 2.4k
Ravi Kumar India 30 716 0.5× 1.0k 1.3× 1.5k 2.0× 364 1.0× 331 1.0× 147 2.7k
Shu Guo China 22 528 0.3× 732 0.9× 669 0.9× 263 0.7× 268 0.8× 61 1.7k
Na Ni China 31 533 0.3× 1.0k 1.3× 1.9k 2.6× 585 1.6× 297 0.9× 97 3.3k
Victoria G. Rocha Spain 21 360 0.2× 670 0.9× 776 1.0× 607 1.6× 116 0.4× 56 2.0k
Jiping Cheng United States 26 802 0.5× 935 1.2× 1.1k 1.4× 495 1.3× 59 0.2× 54 2.8k
A.M.A. Mohamed Egypt 34 622 0.4× 1.6k 2.1× 1.6k 2.2× 335 0.9× 204 0.6× 101 3.3k
Rubing Zhang China 29 261 0.2× 508 0.6× 760 1.0× 378 1.0× 77 0.2× 64 2.0k
Andrew N. Rider Australia 27 532 0.3× 747 1.0× 785 1.1× 330 0.9× 69 0.2× 95 2.1k

Countries citing papers authored by Anmin Hu

Since Specialization
Citations

This map shows the geographic impact of Anmin Hu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Anmin Hu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Anmin Hu more than expected).

Fields of papers citing papers by Anmin Hu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Anmin Hu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Anmin Hu. The network helps show where Anmin Hu may publish in the future.

Co-authorship network of co-authors of Anmin Hu

This figure shows the co-authorship network connecting the top 25 collaborators of Anmin Hu. A scholar is included among the top collaborators of Anmin Hu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Anmin Hu. Anmin Hu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kuang, Yinghuan, et al.. (2025). Enhanced corrosion resistance of Co-W alloy coatings through multilayering strategy. Materials Letters. 385. 138135–138135.
2.
Li, Chongyang, et al.. (2025). Fe content-dependent non-monotonic IMC growth kinetics in Co-Fe alloy barrier microbumps through lattice distortion mechanisms. Materials Today Communications. 48. 113628–113628.
3.
Li, Chongyang, et al.. (2025). Co-W alloy as an effective barrier layer for suppressing Sn surface diffusion and sidewall IMCs in small-size micro-bumps. Journal of Alloys and Compounds. 1018. 179265–179265.
4.
Li, Chongyang, et al.. (2025). Grain Size Effects on Interfacial Reactions in Fe-Co Alloy Barrier Micro-bumps. Electronic Materials Letters. 21(3). 473–485. 1 indexed citations
5.
Liu, Jinyang, et al.. (2024). Comparison of Diffusion Barrier Properties of Ni–Fe and Ni–Fe–W Layer at the Cu/Sn Interface. Electronic Materials Letters. 21(1). 22–31. 2 indexed citations
6.
Chen, Peixin, et al.. (2023). Diffusion barrier property of Co-W layer compared with Ni layer in fine pitch micro-bumps during high temperature storage. Materials Letters. 347. 134572–134572. 5 indexed citations
7.
Hu, Hua, Peixin Chen, Lei Han, et al.. (2023). Electrodeposited Palladium Coating on Co Micro-Nano Cones Array for Low-Temperature Solid-State Bonding. Electronic Materials Letters. 20(3). 326–336.
8.
Han, Silin, Peixin Chen, Liang Cao, et al.. (2023). Electrochemically reduced graphene oxide (ERGO)-Cu bilayer structure fabricated at room temperature for future interconnects. RSC Advances. 13(4). 2372–2378. 1 indexed citations
9.
Li, Chongyang, et al.. (2023). Effects of electrodeposited Co–W and Co–Fe–W diffusion barrier layers on the evolution of Sn/Cu interface. Materials Chemistry and Physics. 313. 128761–128761. 8 indexed citations
10.
Liu, Siyan, Chenlin Yang, Huiqin Ling, et al.. (2021). Inhibiting effects of the Ni barrier layer on the growth of porous Cu3Sn in 10-μm microbumps. Journal of Materials Science Materials in Electronics. 32(13). 17655–17661. 6 indexed citations
11.
Liu, Yang, Yutong Han, Tao Hang, et al.. (2020). In situ synthesis of a highly cross-linked polymethacrylimide ultrathin film on a silicon wafer with applicable dielectric, thermal, and mechanical properties. Thin Solid Films. 711. 138308–138308. 3 indexed citations
12.
13.
Wu, Yunwen, et al.. (2019). Applicable Superamphiphobic Ni/Cu Surface with High Liquid Repellency Enabled by the Electrochemical-Deposited Dual-Scale Structure. ACS Applied Materials & Interfaces. 11(12). 11106–11111. 21 indexed citations
14.
Zhang, Zhaoyang, Yunwen Wu, Yumei Zhang, et al.. (2019). Competitive Effect of Leveler's Electrochemical Behavior and Impurity on Electrical Resistance of Electroplated Copper. Journal of The Electrochemical Society. 166(13). D577–D582. 22 indexed citations
15.
Liu, Yang, Tao Hang, Huiqin Ling, et al.. (2018). Design of thermally stable insulation film by radical grafting poly(methylacrylic acid) on silicon surface. Applied Surface Science. 464. 627–635. 24 indexed citations
16.
Sun, Menglong, et al.. (2018). Growth behavior of tin whisker on SnAg microbump under compressive stress. Scripta Materialia. 147. 114–118. 33 indexed citations
17.
Hu, Anmin, et al.. (2011). Thermal stability and electrical characteristics of NiSi films with electroplated Ni(W) alloy. Applied Surface Science. 257(22). 9351–9354. 6 indexed citations
18.
Ling, Huiqin, et al.. (2010). Wetting process of electrolyte in high density Cu/Sn micro-bumps electrodepositing. Applied Surface Science. 257(8). 3723–3727. 5 indexed citations
19.
Liu, Peisheng, et al.. (2009). Techniques for the Preparation of Porous Metals. Journal of Material Science and Technology. 18(4). 299–305. 5 indexed citations
20.
Peng, Fei, Qiang Cai, Hua Shao, & Anmin Hu. (2004). Nano-crystal glass-ceramics obtained by crystallization of vitrified red mud. Chemosphere. 59(6). 899–903. 38 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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