Tao Hang

4.0k total citations
157 papers, 2.5k citations indexed

About

Tao Hang is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Tao Hang has authored 157 papers receiving a total of 2.5k indexed citations (citations by other indexed papers that have themselves been cited), including 124 papers in Electrical and Electronic Engineering, 51 papers in Materials Chemistry and 50 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Tao Hang's work include Electrodeposition and Electroless Coatings (42 papers), Electronic Packaging and Soldering Technologies (39 papers) and Copper Interconnects and Reliability (34 papers). Tao Hang is often cited by papers focused on Electrodeposition and Electroless Coatings (42 papers), Electronic Packaging and Soldering Technologies (39 papers) and Copper Interconnects and Reliability (34 papers). Tao Hang collaborates with scholars based in China, United States and Japan. Tao Hang's co-authors include Anmin Hu, Huiqin Ling, Ming Li, Yunwen Wu, Dali Mao, Ming Li, Ming Li, Sangaraju Shanmugam, Huiqin Ling and Xin Qian and has published in prestigious journals such as Advanced Materials, Advanced Functional Materials and Journal of Power Sources.

In The Last Decade

Tao Hang

141 papers receiving 2.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Tao Hang China 28 1.7k 725 614 486 409 157 2.5k
Xiaoming Yin China 25 1.7k 1.0× 1.1k 1.5× 388 0.6× 870 1.8× 293 0.7× 52 2.6k
Tuo Wang China 18 899 0.5× 981 1.4× 893 1.5× 521 1.1× 245 0.6× 35 2.3k
Shinill Kang South Korea 25 1.2k 0.7× 464 0.6× 1.2k 1.9× 656 1.3× 259 0.6× 110 2.3k
Yi Ding China 32 1.3k 0.8× 1.5k 2.0× 462 0.8× 1.0k 2.1× 210 0.5× 140 3.5k
Hyesung Cho South Korea 15 823 0.5× 899 1.2× 603 1.0× 660 1.4× 181 0.4× 33 1.9k
Jihai Zhang China 24 1.1k 0.6× 501 0.7× 660 1.1× 598 1.2× 147 0.4× 66 2.2k
Jiaxuan Liao China 27 2.1k 1.2× 1.1k 1.5× 231 0.4× 553 1.1× 113 0.3× 128 2.9k
Hsiharng Yang Taiwan 24 1.3k 0.8× 395 0.5× 974 1.6× 108 0.2× 304 0.7× 109 2.1k
Christopher E. Tabor United States 26 964 0.6× 860 1.2× 1.8k 2.9× 779 1.6× 261 0.6× 55 2.9k
Yunxia Gao China 20 800 0.5× 647 0.9× 717 1.2× 215 0.4× 105 0.3× 50 1.8k

Countries citing papers authored by Tao Hang

Since Specialization
Citations

This map shows the geographic impact of Tao Hang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tao Hang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tao Hang more than expected).

Fields of papers citing papers by Tao Hang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tao Hang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tao Hang. The network helps show where Tao Hang may publish in the future.

Co-authorship network of co-authors of Tao Hang

This figure shows the co-authorship network connecting the top 25 collaborators of Tao Hang. A scholar is included among the top collaborators of Tao Hang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tao Hang. Tao Hang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kuang, Yinghuan, et al.. (2025). Enhanced corrosion resistance of Co-W alloy coatings through multilayering strategy. Materials Letters. 385. 138135–138135.
2.
Wang, Xu, et al.. (2024). Ablation resistance and current-carrying friction performance of WMoCu alloy with different Mo contents. Tribology International. 203. 110413–110413. 4 indexed citations
3.
Han, Silin, Zihan Zhou, Peixin Chen, et al.. (2024). Investigation of grain growth and impurity diffusion in highly conductive copper interconnect films obtained by pulsed laser scanning annealing. Journal of Manufacturing Processes. 131. 297–311. 4 indexed citations
4.
Chen, Yulong, et al.. (2024). Controlled corrosion behaviors of copper in oxidizer solutions for chemical mechanical polishing: Influence of the decomposition products. Corrosion Science. 238. 112352–112352. 6 indexed citations
5.
6.
Chen, Peixin, Chongyang Li, Silin Han, et al.. (2024). Abnormal grain growth of (110)-oriented perpendicular nanotwinned copper into ultra-large grains at low temperatures. Journal of Material Science and Technology. 203. 61–65. 9 indexed citations
7.
Zhou, Zihan, Silin Han, Yunwen Wu, et al.. (2024). Study on the SiO2 Wet-Etching Mechanism Using γ-Ureidopropyltriethoxysilane as an Inhibitor for 3D NAND Fabrication. ACS Applied Electronic Materials. 6(4). 2788–2795. 2 indexed citations
8.
Wu, Yunwen, et al.. (2024). Investigation of phenyl methyl sulfoxide as an additive for cobalt super-filling in 3D interconnect. Surfaces and Interfaces. 56. 105652–105652. 3 indexed citations
9.
Lai, D.Y.F., et al.. (2024). Inhibitor Alkyne-PEG4-amine Contributes to Cobalt Superfilling. ACS Applied Electronic Materials. 3 indexed citations
10.
Chen, Peixin, et al.. (2022). Influence of artificial exchange current density on microstructure of Ni films by pulse-reverse electroplating. Materials Chemistry and Physics. 288. 126338–126338. 5 indexed citations
11.
Peng, Yan, et al.. (2022). Fabrication of Pyramid-Like Structured Cu Coatings by Pulse-Reverse Current Electrodeposition. Journal of The Electrochemical Society. 169(9). 92513–92513. 4 indexed citations
12.
Chen, Yuhang, Qi Xue, Xiaonong Zhang, et al.. (2022). Sol–Gel-Derived Biodegradable Er-Doped ZnO/Polyethylene Glycol Nanoparticles for Cell Imaging. ACS Applied Nano Materials. 5(5). 7103–7112. 10 indexed citations
13.
14.
Liu, Siyan, Chenlin Yang, Huiqin Ling, et al.. (2021). Inhibiting effects of the Ni barrier layer on the growth of porous Cu3Sn in 10-μm microbumps. Journal of Materials Science Materials in Electronics. 32(13). 17655–17661. 6 indexed citations
15.
Han, Silin, et al.. (2021). The Influence of Leveler on the Impurity Behavior of Electroplated Cu Films During Laser Annealing. Journal of The Electrochemical Society. 168(6). 62504–62504. 6 indexed citations
16.
Cao, Liang, Yunwen Wu, Tao Hang, & Ming Li. (2021). Fluorine‐Free Nanoporous Low‐k Dielectric Film Covalently Grafted on Si via Aryldiazonium Chemistry. Advanced Materials Interfaces. 8(24). 4 indexed citations
17.
Hu, Hua, Huiqin Ling, Tao Hang, et al.. (2021). Communication—Fabrication of Vertical Nanotwinned Copper with (220) Texture by Direct Current Electrodeposition. Journal of The Electrochemical Society. 168(8). 82506–82506. 11 indexed citations
18.
Xia, Yuanyuan, Yunwen Wu, Li-Wen Wu, et al.. (2020). Two-Step Electrodeposited 3D Ni Nanocone Supported Au Nanoball Arrays as SERS Substrate. Journal of The Electrochemical Society. 167(14). 142502–142502. 2 indexed citations
19.
Liu, Yang, Yutong Han, Tao Hang, et al.. (2020). In situ synthesis of a highly cross-linked polymethacrylimide ultrathin film on a silicon wafer with applicable dielectric, thermal, and mechanical properties. Thin Solid Films. 711. 138308–138308. 3 indexed citations
20.
Liu, Yang, Yutong Han, Jun Zhang, et al.. (2019). Electroless Grafting of Polymer Insulation Layers in Through-Silicon Vias. ECS Journal of Solid State Science and Technology. 8(10). P591–P595. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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