M. Rencz

400 total citations
19 papers, 246 citations indexed

About

M. Rencz is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Computer Networks and Communications. According to data from OpenAlex, M. Rencz has authored 19 papers receiving a total of 246 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 3 papers in Computer Networks and Communications. Recurrent topics in M. Rencz's work include Heat Transfer and Optimization (5 papers), Advancements in Semiconductor Devices and Circuit Design (5 papers) and Advanced MEMS and NEMS Technologies (4 papers). M. Rencz is often cited by papers focused on Heat Transfer and Optimization (5 papers), Advancements in Semiconductor Devices and Circuit Design (5 papers) and Advanced MEMS and NEMS Technologies (4 papers). M. Rencz collaborates with scholars based in Hungary, France and Ireland. M. Rencz's co-authors include Vladimı́r Székely, V. Székely, B. Courtois, A. Poppe, B. Höfflinger, J.M. Karam, Finbarr Waldron, Geok Soon Hong, David R. Emerson and Marc P. Y. Desmulliez and has published in prestigious journals such as Sensors and Actuators A Physical, Electronics Letters and Microelectronics Reliability.

In The Last Decade

M. Rencz

18 papers receiving 237 citations

Peers

M. Rencz
Jianyong Xie United States
R. Letor Italy
O. Semenov Canada
B.D. Shafer United States
Jongsoo Lee South Korea
M.W. Beranek United States
Marcelo Schupbach United States
K. Harada Japan
Dawei Liu United Kingdom
M. Rencz
Citations per year, relative to M. Rencz M. Rencz (= 1×) peers A. Vassighi

Countries citing papers authored by M. Rencz

Since Specialization
Citations

This map shows the geographic impact of M. Rencz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Rencz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Rencz more than expected).

Fields of papers citing papers by M. Rencz

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Rencz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Rencz. The network helps show where M. Rencz may publish in the future.

Co-authorship network of co-authors of M. Rencz

This figure shows the co-authorship network connecting the top 25 collaborators of M. Rencz. A scholar is included among the top collaborators of M. Rencz based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. Rencz. M. Rencz is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

19 of 19 papers shown
1.
Desmulliez, Marc P. Y., Mark Leonard, R. S. Dhariwal, et al.. (2008). Fabrication and Characterization of a Low-Cost, Wafer-Scale Radial Microchannel Cooling Plate. IEEE Transactions on Components and Packaging Technologies. 32(1). 20–29. 9 indexed citations
2.
Székely, V. & M. Rencz. (2005). A New Monolithic Temperature Sensor: The Thermal Feedback Oscillator. Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95. 2. 124–127. 14 indexed citations
3.
Horváth, Gy., et al.. (2005). Cross-verification of thermal characterisation of a micro-cooler. DSpace (Centre National De La Recherche Scientifique). 1 indexed citations
4.
Desmulliez, Marc P. Y., Mark Leonard, R. S. Dhariwal, et al.. (2005). Design, manufacture and testing of a low-cost micro-channel cooling device. Science and Technology Facilities Council. 564–568. 7 indexed citations
5.
Székely, V. & M. Rencz. (2002). Thermal test and monitoring [microelectronic structures]. 601–601. 1 indexed citations
6.
Székely, V., et al.. (2000). Realization of an electronically controlled thermal resistance. Microelectronics Journal. 31(9-10). 811–814. 12 indexed citations
7.
Székely, Vladimı́r & M. Rencz. (1998). Fast field solvers for thermal and electrostatic analysis. Design, Automation, and Test in Europe. 518–523. 10 indexed citations
8.
Székely, Vladimı́r, et al.. (1998). Thermal Monitoring of Self-Checking Systems. Journal of Electronic Testing. 12(1-2). 81–92. 9 indexed citations
9.
Székely, V., et al.. (1998). CMOS temperature sensors and built-in test circuitry for thermal testing of ICs. Sensors and Actuators A Physical. 71(1-2). 10–18. 23 indexed citations
10.
Székely, Vladimı́r, M. Rencz, & B. Courtois. (1998). Thermal investigations of ICs and microstructures II. Microelectronics Journal. 29(4-5). 159–162. 3 indexed citations
11.
Székely, V., et al.. (1998). Studies on the heat removal features of stacked SOI structures with a dedicated field solver program (SUNRED). Microelectronics Reliability. 38(12). 1881–1891. 16 indexed citations
12.
Székely, Vladimı́r, et al.. (1998). An efficient thermal simulation tool for ICs, microsystem elements and MCMs: the μS-THERMANAL. Microelectronics Journal. 29(4-5). 241–255. 33 indexed citations
13.
Székely, V., et al.. (1998). A thermal benchmark chip: design and applications. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 21(3). 399–405. 13 indexed citations
14.
Székely, Vladimı́r, M. Rencz, & B. Courtois. (1998). Tracing the thermal behavior of ICs. IEEE Design & Test of Computers. 15(2). 14–21. 26 indexed citations
15.
Székely, Vladimı́r, et al.. (1997). SISSSI-A tool for dynamic electro-thermal simulation of analog VLSI cells. 617. 10 indexed citations
16.
Székely, Vladimı́r, M. Rencz, & B. Courtois. (1997). Thermal Transient Testing. Microelectronics International. 14(2). 8–10. 10 indexed citations
17.
Székely, Vladimı́r, et al.. (1997). Cooling as a possible way to extend the usabilityof I DDQ testing. Electronics Letters. 33(25). 2117–2118. 9 indexed citations
18.
Székely, Vladimı́r, et al.. (1996). Thermal mapping with liquid crystal method. Microelectronic Engineering. 31(1-4). 281–290. 39 indexed citations
19.
Székely, V. & M. Rencz. (1995). Thermal test and monitoring [microelectronic structures]. 601–601. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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