Finbarr Waldron

463 total citations
25 papers, 377 citations indexed

About

Finbarr Waldron is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Finbarr Waldron has authored 25 papers receiving a total of 377 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 6 papers in Biomedical Engineering. Recurrent topics in Finbarr Waldron's work include Electronic Packaging and Soldering Technologies (9 papers), Innovative Energy Harvesting Technologies (7 papers) and Advanced MEMS and NEMS Technologies (6 papers). Finbarr Waldron is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), Innovative Energy Harvesting Technologies (7 papers) and Advanced MEMS and NEMS Technologies (6 papers). Finbarr Waldron collaborates with scholars based in Ireland, United States and United Kingdom. Finbarr Waldron's co-authors include Nathan Jackson, A. Mathewson, M. O'Neill, Raymond Foley, Bryan Rodgers, Jeff Punch, S. Cian Ó Mathúna, Elizabeth M. Sheehan, Cian Ó Mathúna and Oskar Z. Olszewski and has published in prestigious journals such as IEEE Transactions on Power Electronics, Applied Surface Science and Journal of Micromechanics and Microengineering.

In The Last Decade

Finbarr Waldron

25 papers receiving 363 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Finbarr Waldron Ireland 12 293 192 151 29 29 25 377
Navas Khan Singapore 15 545 1.9× 157 0.8× 132 0.9× 22 0.8× 38 1.3× 46 666
Victor Farm-Guoo Tseng United States 11 255 0.9× 130 0.7× 165 1.1× 33 1.1× 10 0.3× 23 335
Tiantong Xu China 10 178 0.6× 201 1.0× 126 0.8× 14 0.5× 33 1.1× 41 373
Rosario Casanueva Spain 13 465 1.6× 181 0.9× 77 0.5× 23 0.8× 27 0.9× 61 504
T. Zaitsu Japan 13 333 1.1× 191 1.0× 154 1.0× 12 0.4× 23 0.8× 20 390
Boon Long Lau Singapore 12 262 0.9× 290 1.5× 58 0.4× 23 0.8× 75 2.6× 60 508
Kevin Harsh United States 9 269 0.9× 109 0.6× 185 1.2× 33 1.1× 16 0.6× 21 359
Ebrahim Abbaspour-Sani Iran 11 316 1.1× 77 0.4× 243 1.6× 14 0.5× 16 0.6× 23 452
S. Cian Ó Mathúna Ireland 11 408 1.4× 65 0.3× 79 0.5× 14 0.5× 30 1.0× 27 468
Dionysios Manessis Germany 13 418 1.4× 128 0.7× 85 0.6× 31 1.1× 11 0.4× 64 516

Countries citing papers authored by Finbarr Waldron

Since Specialization
Citations

This map shows the geographic impact of Finbarr Waldron's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Finbarr Waldron with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Finbarr Waldron more than expected).

Fields of papers citing papers by Finbarr Waldron

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Finbarr Waldron. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Finbarr Waldron. The network helps show where Finbarr Waldron may publish in the future.

Co-authorship network of co-authors of Finbarr Waldron

This figure shows the co-authorship network connecting the top 25 collaborators of Finbarr Waldron. A scholar is included among the top collaborators of Finbarr Waldron based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Finbarr Waldron. Finbarr Waldron is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Olszewski, Oskar Z., et al.. (2016). Location Dependence of a MEMS Electromagnetic Transducer with respect to an AC Power Source. Journal of Physics Conference Series. 757. 12041–12041. 7 indexed citations
2.
Waldron, Finbarr, et al.. (2015). Reliability of plastic-encapsulated electronic components in supersaturated steam environments. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(10). 1423–1431. 4 indexed citations
3.
Olszewski, Oskar Z., et al.. (2014). A MEMS Silicon-based Piezoelectric AC Current Sensor. Procedia Engineering. 87. 1457–1460. 28 indexed citations
4.
Smet, Vanessa, Mamun Jamal, Finbarr Waldron, et al.. (2013). High-Temperature Die-Attach Technology for Power Devices Based on Thermocompression Bonding of Thin Ag Films. IEEE Transactions on Components Packaging and Manufacturing Technology. 3(4). 533–542. 3 indexed citations
5.
Wang, Ningning, John Barry, Santosh Kulkarni, et al.. (2013). High frequency DC-DC converter with co-packaged planar inductor and power IC. Cork Open Research Archive (University College Cork). 316. 1946–1952. 9 indexed citations
6.
Jackson, Nathan, et al.. (2013). CMOS compatible low-frequency aluminium nitride MEMS piezoelectric energy harvesting device. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 8763. 87631I–87631I. 5 indexed citations
7.
Jackson, Nathan, et al.. (2013). Evaluation of low-acceleration MEMS piezoelectric energy harvesting devices. Microsystem Technologies. 20(4-5). 671–680. 57 indexed citations
8.
Jackson, Nathan, et al.. (2013). Influence of aluminum nitride crystal orientation on MEMS energy harvesting device performance. Journal of Micromechanics and Microengineering. 23(7). 75014–75014. 43 indexed citations
9.
10.
Waldron, Finbarr, et al.. (2012). Technology Roadmapping for Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC). IEEE Transactions on Power Electronics. 28(9). 4137–4145. 43 indexed citations
11.
Jackson, Nathan, et al.. (2012). A diaphragm based piezoelectric AlN film quality test structure. 50–54. 11 indexed citations
12.
Rohan, James F., Anne-Marie Kelleher, Brice Jamieson, et al.. (2011). (Invited) Integrated Microinductors on Semiconductor Substrates for Power Supply on Chip. ECS Transactions. 41(8). 341–347. 5 indexed citations
13.
14.
Foley, Raymond, et al.. (2010). Technology roadmapping for Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC). 525–532. 20 indexed citations
15.
Desmulliez, Marc P. Y., Mark Leonard, R. S. Dhariwal, et al.. (2008). Fabrication and Characterization of a Low-Cost, Wafer-Scale Radial Microchannel Cooling Plate. IEEE Transactions on Components and Packaging Technologies. 32(1). 20–29. 9 indexed citations
16.
17.
Desmulliez, Marc P. Y., Mark Leonard, R. S. Dhariwal, et al.. (2005). Design, manufacture and testing of a low-cost micro-channel cooling device. Science and Technology Facilities Council. 564–568. 7 indexed citations
18.
Sheehan, Elizabeth M., et al.. (2004). Sources of Variation in Piezoresistive Stress Sensor Measurements. IEEE Transactions on Components and Packaging Technologies. 27(1). 81–86. 23 indexed citations
19.
20.
Barrett, John, et al.. (2002). Performance and reliability of a three-dimensional plastic moulded vertical multichip module (MCM-V). 16. 656–663. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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