Finbarr Waldron
Impact in
- Mechanical Engineering top 10%
- Innovative Energy Harvesting Technologies
-
- Energy Harvesting in Wireless Networks
- Electronic Packaging and Soldering Technologies
- Advanced DC-DC Converters
- Advanced MEMS and NEMS Technologies
- Wireless Power Transfer Systems
Papers in
-
- Electronic Packaging and Soldering Technologies 9
- 3D IC and TSV technologies 6
- Advanced MEMS and NEMS Technologies 6
- Silicon Carbide Semiconductor Technologies 3
-
- Innovative Energy Harvesting Technologies 7
- Metal Forming Simulation Techniques 2
- Co-authors
- Nathan Jackson (7 shared papers)A. Mathewson (8 shared papers)M. O'Neill (6 shared papers)Raymond Foley (2 shared papers)Jeff Punch (3 shared papers)Bryan Rodgers (3 shared papers)S. Cian Ó Mathúna (1 shared paper)Elizabeth M. Sheehan (2 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)IEEE Transactions on Power Electronics (1 paper)Applied Surface Science (1 paper)Journal of Micromechanics and Microengineering (1 paper)
- Partner nations
- IrelandUnited StatesUnited Kingdom
In The Last Decade
Finbarr Waldron
25 papers receiving 363 citations
Peers
Comparison fields: 5 of 33
- Mechanical Engineering 192
- Electrical and Electronic Engineering 293
- Biomedical Engineering 151
- Condensed Matter Physics 20
- Mechanics of Materials 29
Countries citing papers authored by Finbarr Waldron
This map shows the geographic impact of Finbarr Waldron's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Finbarr Waldron with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Finbarr Waldron more than expected).
Fields of papers citing papers by Finbarr Waldron
This network shows the impact of papers produced by Finbarr Waldron. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Finbarr Waldron. The network helps show where Finbarr Waldron may publish in the future.
Co-authors
The 25 scholars most cited alongside Finbarr Waldron, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 25 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 57 | |
| 2 | 2013 | 43 | |
| 3 | 2012 | 43 | |
| 4 | 2014 | 28 | |
| 5 | 2005 | 26 | |
| 6 | 2004 | 23 | |
| 7 | 2010 | 20 | |
| 8 | 2010 | 16 | |
| 9 | 2015 | 16 | |
| 10 | 2005 | 15 | |
| 11 | 2012 | 11 | |
| 12 | 2013 | 11 | |
| 13 | 2013 | 9 | |
| 14 | 2008 | 9 | |
| 15 | 2016 | 7 | |
| 16 | 2005 | 7 | |
| 17 | 2011 | 6 | |
| 18 | 2013 | 5 | |
| 19 | 2011 | 5 | |
| 20 | 2015 | 4 |
About Finbarr Waldron
Finbarr Waldron is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Biomedical Engineering, Atomic and Molecular Physics, and Optics and Mechanics of Materials, having authored 25 papers that have together received 377 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (9 papers), Innovative Energy Harvesting Technologies (7 papers), 3D IC and TSV technologies (6 papers), Advanced MEMS and NEMS Technologies (6 papers), Advanced Sensor and Energy Harvesting Materials (4 papers), Acoustic Wave Resonator Technologies (3 papers), Silicon Carbide Semiconductor Technologies (3 papers) and Metal Forming Simulation Techniques (2 papers). The work is most often cited by research in Mechanical Engineering (192 citations), Electrical and Electronic Engineering (293 citations), Biomedical Engineering (151 citations), Condensed Matter Physics (20 citations) and Mechanics of Materials (29 citations). Finbarr Waldron has collaborated with scholars based in Ireland, United States and United Kingdom. Frequent co-authors include Nathan Jackson, A. Mathewson, M. O'Neill, Raymond Foley, Jeff Punch, Bryan Rodgers, S. Cian Ó Mathúna, Elizabeth M. Sheehan, Cian Ó Mathúna and Oskar Z. Olszewski. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Power Electronics, Applied Surface Science and Journal of Micromechanics and Microengineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.