M. Hommel

775 total citations
18 papers, 617 citations indexed

About

M. Hommel is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, M. Hommel has authored 18 papers receiving a total of 617 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Electrical and Electronic Engineering, 13 papers in Electronic, Optical and Magnetic Materials and 8 papers in Mechanics of Materials. Recurrent topics in M. Hommel's work include Copper Interconnects and Reliability (13 papers), Electronic Packaging and Soldering Technologies (12 papers) and Metal and Thin Film Mechanics (8 papers). M. Hommel is often cited by papers focused on Copper Interconnects and Reliability (13 papers), Electronic Packaging and Soldering Technologies (12 papers) and Metal and Thin Film Mechanics (8 papers). M. Hommel collaborates with scholars based in Germany, Austria and United States. M. Hommel's co-authors include O. Kraft, Oliver Kraft, Eduard Arzt, A. Seeger, L. Hollang, Ruth Schwaiger, P. Wellner, Oliver Aubel, W Haße and Christian Schlünder and has published in prestigious journals such as Acta Materialia, Materials Science and Engineering A and Journal of materials research/Pratt's guide to venture capital sources.

In The Last Decade

M. Hommel

18 papers receiving 587 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
M. Hommel Germany 10 333 286 251 231 172 18 617
W. R. LaFontaine United States 8 313 0.9× 189 0.7× 155 0.6× 125 0.5× 89 0.5× 15 444
K. Kubota Japan 10 226 0.7× 224 0.8× 323 1.3× 71 0.3× 97 0.6× 42 545
Yi-Shao Lai Taiwan 18 224 0.7× 162 0.6× 555 2.2× 211 0.9× 248 1.4× 41 787
F. Felten Germany 11 146 0.4× 277 1.0× 210 0.8× 79 0.3× 66 0.4× 19 536
Hsiang‐Yao Hsiao Taiwan 9 123 0.4× 234 0.8× 736 2.9× 298 1.3× 379 2.2× 10 888
F. Wulff Singapore 14 133 0.4× 98 0.3× 410 1.6× 71 0.3× 312 1.8× 29 566
Jin Onuki Japan 14 109 0.3× 104 0.4× 647 2.6× 284 1.2× 240 1.4× 119 789
Fred List United States 10 70 0.2× 455 1.6× 161 0.6× 248 1.1× 278 1.6× 17 979
E. Ristolainen Finland 15 139 0.4× 183 0.6× 620 2.5× 45 0.2× 265 1.5× 63 799
Cheng-Hsin Ma United States 6 399 1.2× 343 1.2× 144 0.6× 61 0.3× 120 0.7× 7 505

Countries citing papers authored by M. Hommel

Since Specialization
Citations

This map shows the geographic impact of M. Hommel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Hommel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Hommel more than expected).

Fields of papers citing papers by M. Hommel

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Hommel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Hommel. The network helps show where M. Hommel may publish in the future.

Co-authorship network of co-authors of M. Hommel

This figure shows the co-authorship network connecting the top 25 collaborators of M. Hommel. A scholar is included among the top collaborators of M. Hommel based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. Hommel. M. Hommel is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

18 of 18 papers shown
1.
Hommel, M., et al.. (2021). Reliability of automotive and consumer MEMS sensors - An overview. Microelectronics Reliability. 126. 114252–114252. 21 indexed citations
2.
Ciappa, Mauro, et al.. (2010). A new built-in screening methodology for Successive Approximation Register Analog to Digital Converters. Microelectronics Reliability. 50(9-11). 1750–1757. 2 indexed citations
3.
Hommel, M., et al.. (2008). How to improve intrinsic and extrinsic reliability of vias by process optimization. Microelectronic Engineering. 85(10). 2123–2127. 4 indexed citations
4.
Hommel, M., et al.. (2006). Size Effects and Temperature Dependence of Stress-Induced Voiding. 685–686. 5 indexed citations
5.
Pompl, T., et al.. (2006). Practical aspects of reliability analysis for IC designs. Proceedings - ACM IEEE Design Automation Conference. 5 indexed citations
6.
Pompl, T., et al.. (2006). Practical aspects of reliability analysis for IC designs. 193–193. 23 indexed citations
7.
Aubel, Oliver, et al.. (2005). Model for the barrier diffusion into Cu interconnects at high temperatures. Microelectronic Engineering. 82(3-4). 600–606. 9 indexed citations
8.
Aubel, Oliver, et al.. (2005). Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems. Microelectronics Reliability. 46(5-6). 768–773. 1 indexed citations
9.
Aubel, Oliver, W Haße, & M. Hommel. (2003). Highly accelerated electromigration lifetime test (HALT) of copper. IEEE Transactions on Device and Materials Reliability. 3(4). 213–217. 10 indexed citations
10.
11.
Kraft, Oliver, P. Wellner, M. Hommel, Ruth Schwaiger, & Eduard Arzt. (2002). Fatigue behavior of polycrystalline thin copper films. Zeitschrift für Metallkunde. 93(5). 392–400. 70 indexed citations
12.
Hommel, M.. (2002). Stress-induced voiding in aluminum and copper interconnects. AIP conference proceedings. 612. 157–168. 12 indexed citations
13.
Hommel, M. & O. Kraft. (2001). Deformation behavior of thin copper films on deformable substrates. Acta Materialia. 49(19). 3935–3947. 189 indexed citations
14.
Fischer, A., et al.. (2000). Stressmigration Behavior of Multilevel Ulsi Alcu-Metallizations. MRS Proceedings. 612. 1 indexed citations
15.
Kraft, Oliver, M. Hommel, & Eduard Arzt. (2000). X-ray diffraction as a tool to study the mechanical behaviour of thin films. Materials Science and Engineering A. 288(2). 209–216. 84 indexed citations
16.
Hommel, M., Oliver Kraft, & Eduard Arzt. (1999). A new method to study cyclic deformation of thin films in tension and compression. Journal of materials research/Pratt's guide to venture capital sources. 14(6). 2373–2376. 67 indexed citations
17.
Hommel, M., Oliver Kraft, Shefford P. Baker, & Eduard Arzt. (1998). Micro-Tensile and Fatigue Testing of Copper Thin Films on Substrates. MRS Proceedings. 546. 5 indexed citations
18.
Hollang, L., M. Hommel, & A. Seeger. (1997). The Flow Stress of Ultra-High-Purity Molybdenum Single Crystals. physica status solidi (a). 160(2). 329–354. 86 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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