M. Bolduc

1.0k total citations
67 papers, 747 citations indexed

About

M. Bolduc is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Mechanics of Materials. According to data from OpenAlex, M. Bolduc has authored 67 papers receiving a total of 747 indexed citations (citations by other indexed papers that have themselves been cited), including 40 papers in Electrical and Electronic Engineering, 25 papers in Materials Chemistry and 19 papers in Mechanics of Materials. Recurrent topics in M. Bolduc's work include Terahertz technology and applications (15 papers), Metal and Thin Film Mechanics (13 papers) and Ion-surface interactions and analysis (11 papers). M. Bolduc is often cited by papers focused on Terahertz technology and applications (15 papers), Metal and Thin Film Mechanics (13 papers) and Ion-surface interactions and analysis (11 papers). M. Bolduc collaborates with scholars based in Canada, United States and Belgium. M. Bolduc's co-authors include C. Awo-Affouda, V. P. LaBella, Mengbing Huang, Gabriel Agnello, Andrew Stollenwerk, Sylvain G. Cloutier, B. Terreault, F. Javier Ramos, Alain Bergeron and Linda Marchese and has published in prestigious journals such as SHILAP Revista de lepidopterología, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

M. Bolduc

60 papers receiving 721 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
M. Bolduc Canada 15 434 366 249 119 104 67 747
F. D. Tichelaar Netherlands 11 326 0.8× 366 1.0× 122 0.5× 84 0.7× 92 0.9× 23 610
K. L. Westra Canada 15 318 0.7× 404 1.1× 272 1.1× 357 3.0× 232 2.2× 29 912
Marialilia Pea Italy 17 315 0.7× 373 1.0× 191 0.8× 27 0.2× 367 3.5× 46 781
Shawn-Yu Lin United States 10 403 0.9× 408 1.1× 348 1.4× 27 0.2× 428 4.1× 16 1.1k
N. Yacoubi Tunisia 17 474 1.1× 394 1.1× 164 0.7× 260 2.2× 188 1.8× 98 860
G.K. Reeves Australia 13 1.1k 2.6× 410 1.1× 707 2.8× 144 1.2× 200 1.9× 62 1.4k
Bogdan Voisiat Germany 20 333 0.8× 90 0.2× 194 0.8× 343 2.9× 328 3.2× 81 1.1k
M. Jaso United States 13 486 1.1× 285 0.8× 242 1.0× 114 1.0× 428 4.1× 25 857
Tommi Kaplas Finland 19 358 0.8× 420 1.1× 237 1.0× 17 0.1× 311 3.0× 47 968
Anthony S. Holland Australia 17 551 1.3× 391 1.1× 258 1.0× 98 0.8× 344 3.3× 128 878

Countries citing papers authored by M. Bolduc

Since Specialization
Citations

This map shows the geographic impact of M. Bolduc's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Bolduc with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Bolduc more than expected).

Fields of papers citing papers by M. Bolduc

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Bolduc. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Bolduc. The network helps show where M. Bolduc may publish in the future.

Co-authorship network of co-authors of M. Bolduc

This figure shows the co-authorship network connecting the top 25 collaborators of M. Bolduc. A scholar is included among the top collaborators of M. Bolduc based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. Bolduc. M. Bolduc is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Benavides, Jaime, et al.. (2025). Flexible screen-printed SiC-based humidity sensors. Communications Engineering. 4(1). 96–96. 2 indexed citations
2.
Bolduc, M., et al.. (2025). Screen Printing for Energy Storage and Functional Electronics: A Review. Preprints.org. 1 indexed citations
3.
Bolduc, M., et al.. (2024). Implantation de stages de travail adapté en milieu universitaire : des pratiques collaboratives à visée inclusive. Érudit (Université de Montréal). 8(5). 1–28.
4.
Benavides, Jaime, et al.. (2024). Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications. Materials. 17(20). 4966–4966. 2 indexed citations
5.
Benavides, Jaime, et al.. (2024). All Screen Printed and Flexible Silicon Carbide NTC Thermistors for Temperature Sensing Applications. Materials. 17(11). 2489–2489. 6 indexed citations
7.
Altay, Bilge Nazli, Burak Aksoy, Debika Banerjee, et al.. (2021). Lignin-Derived Carbon-Coated Functional Paper for Printed Electronics. ACS Applied Electronic Materials. 3(9). 3904–3914. 26 indexed citations
8.
Altay, Bilge Nazli, Vikram S. Turkani, Alexandra Pekarovičová, et al.. (2021). One-step photonic curing of screen-printed conductive Ni flake electrodes for use in flexible electronics. Scientific Reports. 11(1). 3393–3393. 20 indexed citations
9.
Bolduc, M., et al.. (2018). Thermal Dynamics Effects using Pulse-Shaping Laser Sintering of Printed Silver Inks. Scientific Reports. 8(1). 1418–1418. 28 indexed citations
11.
Marchese, Linda, et al.. (2013). Review of the characteristics of 384x288 pixel THz camera for see-through imaging. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 8900. 890009–890009. 6 indexed citations
12.
Bolduc, M. & Richard Arsenault. (2012). Development of a strain-gage installation method for high-speed impact of strikers on a Split Hopkinson bar apparatus. SHILAP Revista de lepidopterología. 26. 1033–1033. 1 indexed citations
13.
Marchese, Linda, C. Chevalier, Luc Mercier, et al.. (2012). Catadioptric optics for high-resolution terahertz imager. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 8363. 83630B–83630B. 3 indexed citations
14.
Bergeron, Alain, Linda Marchese, M. Bolduc, et al.. (2011). Resolution capability comparison of infrared and terahertz imagers. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 8188. 81880I–81880I. 7 indexed citations
15.
Marchese, Linda, M. Bolduc, Bruno Tremblay, et al.. (2010). A microbolometer-based THz imager. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7671. 76710Z–76710Z. 17 indexed citations
16.
Bolduc, M., Linda Marchese, Bruno Tremblay, et al.. (2010). Video-rate THz imaging using a microbolometer-based camera. 7311. 1–2. 5 indexed citations
17.
Dionne, Gerald F., et al.. (2007). Mixed-cation designs of magnetic perovskites for Faraday rotation at IR wavelengths. Journal of Applied Physics. 101(9). 3 indexed citations
18.
Bolduc, M., C. Awo-Affouda, Andrew Stollenwerk, et al.. (2005). Above room temperature ferromagnetism in Mn-ion implanted Si. Physical Review B. 71(3). 216 indexed citations
19.
Ross, J.R.H., et al.. (2003). Effect of ageing on wettability of quartz surfaces modified by Ar implantation. Journal of Physics D Applied Physics. 36(8). 1001–1008. 8 indexed citations
20.
Popovici, Dumitru, B. Terreault, M. Bolduc, et al.. (1999). Surface treatment of pure and alloyed aluminum using a new plasma-based ion implanter apparatus. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 17(2). 859–862. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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