Jusheng Ma

2.3k total citations · 1 hit paper
28 papers, 2.0k citations indexed

About

Jusheng Ma is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Jusheng Ma has authored 28 papers receiving a total of 2.0k indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 14 papers in Mechanical Engineering and 12 papers in Materials Chemistry. Recurrent topics in Jusheng Ma's work include Electronic Packaging and Soldering Technologies (15 papers), Aluminum Alloys Composites Properties (6 papers) and Aluminum Alloy Microstructure Properties (5 papers). Jusheng Ma is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), Aluminum Alloys Composites Properties (6 papers) and Aluminum Alloy Microstructure Properties (5 papers). Jusheng Ma collaborates with scholars based in China, Japan and United States. Jusheng Ma's co-authors include Zhong Lin Wang, Peng Bai, Guang Zhu, Gong Zhang, Jun Chen, Qingshen Jing, Zong‐Hong Lin, Jianchun Liu, Katsuaki Suganuma and Jin Yang and has published in prestigious journals such as ACS Nano, Advanced Functional Materials and Nano Energy.

In The Last Decade

Jusheng Ma

26 papers receiving 2.0k citations

Hit Papers

Integrated Multilayered Triboelectric Nanogenerator for H... 2013 2026 2017 2021 2013 100 200 300 400 500

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jusheng Ma China 16 1.3k 939 883 587 418 28 2.0k
Yiin‐Kuen Fuh Taiwan 25 2.2k 1.8× 1.1k 1.2× 903 1.0× 875 1.5× 436 1.0× 140 3.0k
Xing Yin China 23 1.8k 1.4× 1.3k 1.4× 576 0.7× 518 0.9× 291 0.7× 34 2.4k
Rui Guo China 28 2.4k 1.9× 524 0.6× 862 1.0× 1.0k 1.8× 536 1.3× 68 3.0k
Gengheng Zhou China 16 712 0.6× 477 0.5× 304 0.3× 361 0.6× 488 1.2× 27 1.4k
Lei Hao China 24 946 0.8× 578 0.6× 279 0.3× 652 1.1× 433 1.0× 69 2.0k
Navid Kazem United States 11 1.5k 1.2× 445 0.5× 670 0.8× 430 0.7× 480 1.1× 14 2.0k
Mônica Jung de Andrade United States 24 1.6k 1.2× 441 0.5× 1.1k 1.2× 359 0.6× 737 1.8× 42 2.4k
Woon‐Seop Choi South Korea 23 934 0.7× 449 0.5× 577 0.7× 2.1k 3.5× 590 1.4× 84 2.8k

Countries citing papers authored by Jusheng Ma

Since Specialization
Citations

This map shows the geographic impact of Jusheng Ma's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jusheng Ma with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jusheng Ma more than expected).

Fields of papers citing papers by Jusheng Ma

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jusheng Ma. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jusheng Ma. The network helps show where Jusheng Ma may publish in the future.

Co-authorship network of co-authors of Jusheng Ma

This figure shows the co-authorship network connecting the top 25 collaborators of Jusheng Ma. A scholar is included among the top collaborators of Jusheng Ma based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jusheng Ma. Jusheng Ma is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Liu, Jianchun, Zhenghong Wang, Jusheng Ma, et al.. (2016). Effects of intermetallic-forming element additions on microstructure and corrosion behavior of Sn–Zn solder alloys. Corrosion Science. 112. 150–159. 51 indexed citations
2.
Liu, Jianchun, Gong Zhang, Zhenghong Wang, Jusheng Ma, & Katsuaki Suganuma. (2015). Thermal property, wettability and interfacial characterization of novel Sn–Zn–Bi–In alloys as low-temperature lead-free solders. Materials & Design. 84. 331–339. 51 indexed citations
3.
Bai, Peng, Guang Zhu, Qingshen Jing, et al.. (2015). Transparent and flexible barcode based on sliding electrification for self-powered identification systems. Nano Energy. 12. 278–286. 31 indexed citations
4.
Liu, Jianchun, Gong Zhang, Jusheng Ma, & Katsuaki Suganuma. (2015). Ti addition to enhance corrosion resistance of Sn–Zn solder alloy by tailoring microstructure. Journal of Alloys and Compounds. 644. 113–118. 70 indexed citations
5.
Bai, Peng, Guang Zhu, Yusheng Zhou, et al.. (2014). Dipole-moment-induced effect on contact electrification for triboelectric nanogenerators. Nano Research. 7(7). 990–997. 187 indexed citations
6.
Liu, Jianchun, Sung Won Park, Shijo Nagao, et al.. (2014). The role of Zn precipitates and Cl− anions in pitting corrosion of Sn–Zn solder alloys. Corrosion Science. 92. 263–271. 134 indexed citations
7.
Liu, Jianchun, et al.. (2014). Constitutive behavior and Anand model of novel lead-free solder Sn-Zn-Bi-In-P. 156–161. 4 indexed citations
8.
Bai, Peng, Guang Zhu, Ying Liu, et al.. (2013). Cylindrical Rotating Triboelectric Nanogenerator. ACS Nano. 7(7). 6361–6366. 264 indexed citations
9.
Ma, Jusheng. (2004). Accumulated Residual Plastic Strain of Solder Joints under Thermal Cycling. Electronic Components and Materials. 1 indexed citations
10.
Suzuki, Hirowo G., et al.. (2004). Effects of Ni Addition on the Mechanical and Electrical Properties of Cu-15 mass%Cr <i>In-Situ</i> Composites. MATERIALS TRANSACTIONS. 45(1). 75–80. 1 indexed citations
11.
Ma, Jusheng, et al.. (2003). Effect of Sn Addition on the Mechanical and Electrical Properties of Cu-15%Cr <I>In-Situ</I> Composites. MATERIALS TRANSACTIONS. 44(2). 232–238. 5 indexed citations
12.
Huang, Fuxiang, et al.. (2003). Precipitation in Cu–Ni–Si–Zn alloy for lead frame. Materials Letters. 57(13-14). 2135–2139. 74 indexed citations
14.
Ning, Honglong, et al.. (2003). Joining of sapphire and hot pressed Al2O3 using Ag70.5Cu27.5Ti2 brazing filler metal. Ceramics International. 29(6). 689–694. 46 indexed citations
15.
Liu, Yudong, et al.. (2003). Effect of the texture of indium on its mechanical properties. 102. 270–274.
16.
Huang, Fuxiang, et al.. (2002). The investigation of some properties of copper alloys for lead frame. 391–393. 4 indexed citations
17.
Liu, Yudong, et al.. (2002). . Journal of Materials Science Materials in Electronics. 13(10). 597–600. 1 indexed citations
18.
Ma, Jusheng, et al.. (2002). Bingham plastic fluid flow model for ceramic tape casting. Materials Science and Engineering A. 337(1-2). 274–280. 18 indexed citations
19.
Wang, Yonggang, et al.. (2002). Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging. Materials Science and Engineering B. 94(1). 48–53. 51 indexed citations
20.
Mu, Daobin, et al.. (2001). Electroless copper metallization on anodized aluminum metal substrates. Metal Finishing. 99(12). 11–13. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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