P. H. Yih

691 total citations
17 papers, 550 citations indexed

About

P. H. Yih is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, P. H. Yih has authored 17 papers receiving a total of 550 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 6 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in P. H. Yih's work include Semiconductor materials and devices (6 papers), Copper Interconnects and Reliability (5 papers) and Aluminum Alloys Composites Properties (5 papers). P. H. Yih is often cited by papers focused on Semiconductor materials and devices (6 papers), Copper Interconnects and Reliability (5 papers) and Aluminum Alloys Composites Properties (5 papers). P. H. Yih collaborates with scholars based in United States, China and Germany. P. H. Yih's co-authors include A. J. Steckl, D.D.L. Chung, Vishal Saxena, Lin Li, Cailei Yuan, Jianbin Xu, H. C. Mogul, Jia-Sheng Huang, T. L. Shofner and Yaw S. Obeng and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Journal of Materials Science.

In The Last Decade

P. H. Yih

17 papers receiving 533 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
P. H. Yih United States 12 306 194 140 123 98 17 550
Vincent Bley France 15 378 1.2× 194 1.0× 343 2.5× 160 1.3× 113 1.2× 50 709
H. Takamizawa Japan 11 377 1.2× 63 0.3× 268 1.9× 250 2.0× 46 0.5× 21 553
B. A. Bender United States 13 277 0.9× 164 0.8× 544 3.9× 315 2.6× 118 1.2× 26 748
S. K. Tung Singapore 9 290 0.9× 194 1.0× 284 2.0× 22 0.2× 64 0.7× 13 524
Tetsuroh Minemura Japan 15 376 1.2× 346 1.8× 502 3.6× 40 0.3× 86 0.9× 61 799
Boen Houng Taiwan 12 253 0.8× 109 0.6× 355 2.5× 119 1.0× 101 1.0× 24 485
M. Azuma Japan 12 162 0.5× 286 1.5× 285 2.0× 38 0.3× 40 0.4× 31 471
Rabih Khazaka France 10 538 1.8× 285 1.5× 229 1.6× 54 0.4× 50 0.5× 29 755
Vemal Raja Manikam Malaysia 7 433 1.4× 225 1.2× 82 0.6× 27 0.2× 54 0.6× 12 508
P.-S. Kuo Taiwan 8 150 0.5× 166 0.9× 166 1.2× 194 1.6× 17 0.2× 19 398

Countries citing papers authored by P. H. Yih

Since Specialization
Citations

This map shows the geographic impact of P. H. Yih's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by P. H. Yih with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites P. H. Yih more than expected).

Fields of papers citing papers by P. H. Yih

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by P. H. Yih. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by P. H. Yih. The network helps show where P. H. Yih may publish in the future.

Co-authorship network of co-authors of P. H. Yih

This figure shows the co-authorship network connecting the top 25 collaborators of P. H. Yih. A scholar is included among the top collaborators of P. H. Yih based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with P. H. Yih. P. H. Yih is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

17 of 17 papers shown
1.
Huang, Jia-Sheng, et al.. (2001). Effect of silicon nitride capping layer on via electromigration and failure criterion methodology in multilevel interconnection. Thin Solid Films. 397(1-2). 186–193. 9 indexed citations
2.
Yih, P. H. & D.D.L. Chung. (1999). Brass-matrix silicon carbide whisker composites prepared by powder metallurgy. Journal of Materials Science. 34(2). 359–364. 20 indexed citations
3.
Yih, P. H. & D.D.L. Chung. (1997). Titanium diboride copper-matrix composites. Journal of Materials Science. 32(7). 1703–1709. 73 indexed citations
4.
Yih, P. H., Vishal Saxena, & A. J. Steckl. (1997). A Review of SiC Reactive Ion Etching in Fluorinated Plasmas. physica status solidi (b). 202(1). 605–642. 118 indexed citations
5.
Yih, P. H. & D.D.L. Chung. (1997). A comparative study of the coated filler method and the admixture method of powder metallurgy for making metal–matrix composites. Journal of Materials Science. 32(11). 2873–2882. 35 indexed citations
6.
Yih, P. H. & D.D.L. Chung. (1996). Silicon carbide whisker copper-matrix composites fabricated by hot pressing copper coated whiskers. Journal of Materials Science. 31(2). 399–406. 57 indexed citations
7.
Yih, P. H. & A. J. Steckl. (1995). Residue‐Free Reactive Ion Etching of Silicon Carbide in Fluorinated Plasmas: II .. Journal of The Electrochemical Society. 142(1). 312–319. 39 indexed citations
8.
Yih, P. H. & D.D.L. Chung. (1995). Copper-matrix molybdenum particle composites made from copper coated molybdenum powder. Journal of Electronic Materials. 24(7). 841–851. 21 indexed citations
9.
Yih, P. H. & A. J. Steckl. (1995). Residue‐Free Reactive Ion Etching of 3 C  ‐ SiC and 6 H  ‐ SiC in Fluorinated Mixture Plasmas. Journal of The Electrochemical Society. 142(8). 2853–2860. 27 indexed citations
10.
Steckl, A. J., et al.. (1994). Selective-area room temperature visible photoluminescence from SiC/Si heterostructures. Applied Physics Letters. 64(11). 1419–1420. 11 indexed citations
11.
Yih, P. H., et al.. (1994). SiC/Si heterojunction diodes fabricated by self-selective and by blanket rapid thermal chemical vapor deposition. IEEE Transactions on Electron Devices. 41(3). 281–287. 28 indexed citations
12.
Yih, P. H. & A. J. Steckl. (1993). Effects of Hydrogen Additive on Obtaining Residue‐Free Reactive Ion Etching of β ‐ SiC in Fluorinated Plasmas. Journal of The Electrochemical Society. 140(6). 1813–1824. 34 indexed citations
13.
Yih, P. H., et al.. (1993). Thickness Determination of SiC ‐ on ‐ Si Thin Films by Anisotropic Reactive Ion Etching and Preferential Wet Etching. Journal of The Electrochemical Society. 140(1). 178–182. 8 indexed citations
15.
Steckl, A. J. & P. H. Yih. (1992). Residue-free reactive ion etching of β-SiC in CHF3/O2 with H2 additive. Applied Physics Letters. 60(16). 1966–1968. 46 indexed citations
16.
Li, Lin, P. H. Yih, & D.D.L. Chung. (1992). Effect of the second filler which melted during composite fabrication on the electrical properties of short fiber polymer-matrix composites. Journal of Electronic Materials. 21(11). 1065–1071. 18 indexed citations
17.
Yih, P. H., et al.. (1985). Processes and Installation for Continuous Electroplating of Metals and Bi-Metals on the Surface of Carbon Fibers. SAE technical papers on CD-ROM/SAE technical paper series. 1. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Rankless by CCL
2026