Chengqiang Cui

1.2k total citations · 2 hit papers
82 papers, 824 citations indexed

About

Chengqiang Cui is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Chengqiang Cui has authored 82 papers receiving a total of 824 indexed citations (citations by other indexed papers that have themselves been cited), including 51 papers in Electrical and Electronic Engineering, 20 papers in Mechanical Engineering and 19 papers in Materials Chemistry. Recurrent topics in Chengqiang Cui's work include Electronic Packaging and Soldering Technologies (27 papers), 3D IC and TSV technologies (20 papers) and Nanomaterials and Printing Technologies (19 papers). Chengqiang Cui is often cited by papers focused on Electronic Packaging and Soldering Technologies (27 papers), 3D IC and TSV technologies (20 papers) and Nanomaterials and Printing Technologies (19 papers). Chengqiang Cui collaborates with scholars based in China, Hong Kong and United States. Chengqiang Cui's co-authors include Guannan Yang, Jiye Luo, Xiaoling He, Xinxin Sheng, Ying Chen, Li Zhang, Delong Xie, Yu Zhang, Wei Lin and Jian Gao and has published in prestigious journals such as Advanced Functional Materials, Journal of The Electrochemical Society and IEEE Transactions on Industrial Electronics.

In The Last Decade

Chengqiang Cui

71 papers receiving 788 citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

MXene and Polymer Collision: Sparking the Future of High‐Performance Multifunctional Coatings

2024 125 citations Xiaoling He, Chengqiang Cui et al. profile →
Triple-network structured phase change composite based on “rod-brush” CNTs-CFs with high thermal conductivity

2025 26 citations Xiaoling He, Wenjian Zhang et al. Composites Science and Technology profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Chengqiang Cui China	16	406	293	186	163	138	82	824
Gaofeng Li China	17	505 1.2×	189 0.6×	271 1.5×	207 1.3×	105 0.8×	55	982
Yun Seok Choi South Korea	14	460 1.1×	210 0.7×	172 0.9×	171 1.0×	214 1.6×	34	748
Yingchun Niu China	15	340 0.8×	392 1.3×	95 0.5×	243 1.5×	81 0.6×	45	951
Wei Lv China	19	343 0.8×	564 1.9×	162 0.9×	63 0.4×	125 0.9×	41	1.1k
Xiao Ling China	13	444 1.1×	180 0.6×	141 0.8×	158 1.0×	162 1.2×	33	739
Chairul Hudaya Indonesia	15	647 1.6×	186 0.6×	99 0.5×	120 0.7×	292 2.1×	96	836
Xiaoguang Li China	18	513 1.3×	270 0.9×	91 0.5×	151 0.9×	150 1.1×	60	971
Chuan Chen China	18	696 1.7×	313 1.1×	159 0.9×	338 2.1×	71 0.5×	69	1.0k
Jie Wei China	17	211 0.5×	175 0.6×	458 2.5×	289 1.8×	126 0.9×	56	1.1k

Countries citing papers authored by Chengqiang Cui

Since Specialization

Citations

This map shows the geographic impact of Chengqiang Cui's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chengqiang Cui with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chengqiang Cui more than expected).

Fields of papers citing papers by Chengqiang Cui

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chengqiang Cui. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chengqiang Cui. The network helps show where Chengqiang Cui may publish in the future.

Co-authorship network of co-authors of Chengqiang Cui

This figure shows the co-authorship network connecting the top 25 collaborators of Chengqiang Cui. A scholar is included among the top collaborators of Chengqiang Cui based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chengqiang Cui. Chengqiang Cui is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

He, Xiaoling, Wenjian Zhang, Yuanjun Yang, et al.. (2025). Triple-network structured phase change composite based on “rod-brush” CNTs-CFs with high thermal conductivity. Composites Science and Technology. 262. 111080–111080. 26 indexed citations breakdown →

He, Xiaoling, Wenjian Zhang, Tao Liu, et al.. (2025). Sea Anemone-Inspired Phase Change Composites for Efficient Heat Dissipation and Ultra-High Electromagnetic Interference Shielding. Research. 9. 1075–1075. 2 indexed citations

Huang, Guanghan, Yongjian Wang, Chengqiang Cui, et al.. (2025). Enhanced single-phase heat transfer performance of glass-based microchannels with a three-dimensional wavy-rectangular structure. Applied Thermal Engineering. 279. 127894–127894.

Zhang, Yu, et al.. (2025). Realizing low-temperature air sintering of robust Cu-Cu joints through benzimidazole-coated in-situ Cu paste with protective encapsulation. Journal of Materials Research and Technology. 39. 9330–9341.

Zhang, Yuxin, et al.. (2025). Fabrication of metastable nanoscale Ag–Cu supersaturated solid solutions and their low-temperature low-pressure interconnect applications. Journal of Material Science and Technology. 246. 76–85. 4 indexed citations

Tian, Xiaoyong, et al.. (2025). A bioinspired helical metamaterial for broadband electromagnetic wave absorption. Composites Part B Engineering. 304. 112685–112685. 6 indexed citations

Cao, Jun, Weilong Liu, Jun Wei, et al.. (2025). Advances in copper wire bonding technology: Material optimization, interfacial strength bonding interface reliability, and corrosion resistance. Journal of Alloys and Compounds. 1032. 181108–181108. 1 indexed citations

Yang, Guannan, Qiyuan Zhang, Wentao Li, et al.. (2025). Preparation of nickel nanoparticle-decorated graphene/copper composites with enhanced interfacial bonding and heat dissipation properties. Journal of Alloys and Compounds. 1028. 180696–180696. 3 indexed citations

Huang, Guanghan, Chao Fan, Yu Zhang, et al.. (2024). Gradient-Pattern Micro-Grooved Wicks Fabricated by the Ultraviolet Nanosecond Laser Method and Their Enhanced Capillary Performance. Micromachines. 15(1). 165–165. 4 indexed citations

10.

Cao, Jun, et al.. (2024). Research Progress on Rolling Forming of Tungsten Alloy. Materials. 17(18). 4531–4531. 3 indexed citations

11.

Cao, Jun, Junchao Zhang, Xiaoyu Shen, et al.. (2024). Investigation on the microstructure evolution and strengthening behavior of rolled bonding Cu strip. Journal of Science Advanced Materials and Devices. 10(1). 100835–100835.

12.

Li, Zebo, Linfeng Peng, Guannan Yang, et al.. (2024). Silver/graphene oxide composite with high thermal/electrical conductivity and mechanical performance developed through a dual-dispersion medium method. Journal of Materials Research and Technology. 33. 8211–8221. 1 indexed citations

13.

Zhang, Yu, Ziyuan Chen, Song Wu, et al.. (2023). Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties. Micromachines. 14(11). 2079–2079. 4 indexed citations

14.

Sun, Bo, et al.. (2023). A lifetime prediction approach for LED packages in paralleled under thermal-electronic coupling effects. Microelectronics Reliability. 142. 114904–114904. 1 indexed citations

15.

Zhang, Yu, Qiang Liu, Yu Liu, et al.. (2022). Green synthesis of novel in situ micro/submicron-Cu paste for semiconductor interconnection. Nanotechnology. 33(28). 285705–285705. 9 indexed citations

16.

Yang, Guannan, et al.. (2021). Understanding the sintering and heat dissipation behaviours of Cu nanoparticles during low-temperature selective laser sintering process on flexible substrates. Journal of Physics D Applied Physics. 54(37). 375304–375304. 20 indexed citations

17.

Yang, Guannan, Wei Lin, Jun Cao, et al.. (2021). A quantitative model to understand the microflow-controlled sintering mechanism of metal particles at nanometer to micron scale. Nanotechnology. 32(50). 505721–505721. 14 indexed citations

18.

Tang, Hui, Kaifu Zhang, Chuangbin Chen, et al.. (2020). A Flip-Chip Alignment System With the Property of Deviation Self-Correction at the Nanoscale. IEEE Transactions on Industrial Electronics. 68(3). 2345–2355. 22 indexed citations

19.

Shi, Minghao, Jiye Luo, Zhifeng Hao, et al.. (2020). Bis-(sodium sulfoethyl)-disulfide: A Promising Accelerator for Super-conformal Copper Electrodeposition with Wide Operating Concentration Ranges. Journal of The Electrochemical Society. 167(4). 42508–42508. 25 indexed citations

20.

Zhang, Xiaowu, et al.. (2002). Analysis of solder joint reliability in flip chip packages. 25(1). 147–159. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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