Iver E. Anderson
- General Materials Science top 0.2%
- Mechanical Engineering top 0.5%
- Aluminum Alloys Composites Properties 17
- Metallic Glasses and Amorphous Alloys 17
- Ceramics and Composites top 2%
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- Magnetic Properties of Alloys 41
- Magnetic Properties and Applications 16
- Automotive Engineering top 2%
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- Electronic Packaging and Soldering Technologies 26
- 3D IC and TSV technologies 17
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- Magnetic properties of thin films 22
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- Aluminum Alloy Microstructure Properties 18
- Co-authors
- J. L. HarringaRobert L TerpstraEmma WhiteM. J. KramerJack SmithR. W. McCallumFei TangB. A. Cook
- Journals
- Materials Science and Engineering A (14 papers)Journal of Electronic Materials (13 papers)Journal of Applied Physics (12 papers)
- Partner nations
- United StatesGermanyUnited Kingdom
In The Last Decade
Iver E. Anderson
135 papers receiving 4.0k citations
Peers
Comparison fields: 5 of 113
- General Materials Science 225
- Mechanical Engineering 2.6k
- Ceramics and Composites 320
- Electronic, Optical and Magnetic Materials 886
- Automotive Engineering 347
Countries citing papers authored by Iver E. Anderson
This map shows the geographic impact of Iver E. Anderson's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Iver E. Anderson with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Iver E. Anderson more than expected).
Fields of papers citing papers by Iver E. Anderson
This network shows the impact of papers produced by Iver E. Anderson. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Iver E. Anderson. The network helps show where Iver E. Anderson may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Iver E. Anderson, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2025 | 0 | |
| 3 | 2025 | 0 | |
| 4 | 2024 | 7 | |
| 5 | 2024 | 8 | |
| 6 | 2024 | 2 | |
| 7 | 2024 | 1 | |
| 8 | 2023 | 4 | |
| 9 | Gas atomization synthesis of refractory or intermetallic compounds and supersaturated solid solutions | 2023 | 0 |
| 10 | Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder | 2023 | 0 |
| 11 | Pb-free Sn-Ag-Cu ternary eutectic solder | 2023 | 0 |
| 12 | 2009 | 21 | |
| 13 | 2009 | 63 | |
| 14 | ALLOY DESIGN AND MICROSTRUCTURE OF ADVANCED PERMANENT MAGNETS USING RAPID SOLIDIFICATION AND POWDER PROCESSING | 2008 | 5 |
| 15 | 2008 | 27 | |
| 16 | 2005 | 63 | |
| 17 | 2005 | 5 | |
| 18 | 2003 | 73 | |
| 19 | Low temperature joining of ceramic composites | 1999 | 1 |
| 20 | METHOD OF MAKING QUASICRYSTAL ALLOY POWDER, PROTECTIVECOATINGS AND ARTICLES | 1995 | 1 |
About Iver E. Anderson
Iver E. Anderson is a scholar working on General Materials Science, Electronic, Optical and Magnetic Materials, Ceramics and Composites, Mechanical Engineering and Materials Chemistry, having authored 145 papers that have together received 4.2k indexed citations. Recurring topics across this work include Magnetic Properties of Alloys (41 papers), Electronic Packaging and Soldering Technologies (26 papers), Magnetic properties of thin films (22 papers), Aluminum Alloy Microstructure Properties (18 papers), 3D IC and TSV technologies (17 papers), Aluminum Alloys Composites Properties (17 papers), Metallic Glasses and Amorphous Alloys (17 papers) and Magnetic Properties and Applications (16 papers). The work is most often cited by research in General Materials Science (225 citations), Mechanical Engineering (2.6k citations), Ceramics and Composites (320 citations), Electronic, Optical and Magnetic Materials (886 citations) and Automotive Engineering (347 citations). Iver E. Anderson has collaborated with scholars based in United States, Germany and United Kingdom. Frequent co-authors include J. L. Harringa, Robert L Terpstra, Emma White, M. J. Kramer, Jack Smith, R. W. McCallum, Fei Tang, B. A. Cook, Ryan Dehoff and A.M. Russell. Their work appears in journals such as Materials Science and Engineering A, Journal of Electronic Materials, Journal of Applied Physics, JOM and IEEE Transactions on Magnetics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.