Ryan Dehoff
- Automotive Engineering top 0.05%
- Additive Manufacturing and 3D Printing Technologies 65
- Mechanical Engineering top 0.05%
- Additive Manufacturing Materials and Processes 93
- High Entropy Alloys Studies 28
- Welding Techniques and Residual Stresses 26
- High Temperature Alloys and Creep 12
- Materials Chemistry top 1%
- Microstructure and mechanical properties 13
- Titanium Alloys Microstructure and Properties 11
- Aerospace Engineering top 0.5%
- Aluminum Alloy Microstructure Properties 16
Ryan Dehoff
183 papers receiving 11.0k citations
Hit Papers
Peers
Comparison fields: 5 of 142
- Automotive Engineering 5.0k
- Mechanical Engineering 9.1k
- Materials Chemistry 3.0k
- Industrial and Manufacturing Engineering 636
- Aerospace Engineering 1.3k
Countries citing papers authored by Ryan Dehoff
This map shows the geographic impact of Ryan Dehoff's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ryan Dehoff with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ryan Dehoff more than expected).
Fields of papers citing papers by Ryan Dehoff
This network shows the impact of papers produced by Ryan Dehoff. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ryan Dehoff. The network helps show where Ryan Dehoff may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Ryan Dehoff, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 1 | |
| 2 | 2024 | 2 | |
| 3 | 2024 | 6 | |
| 4 | 2024 | 5 | |
| 5 | 2024 | 4 | |
| 6 | 2023 | 28 | |
| 7 | 2023 | 8 | |
| 8 | 2022 | 22 | |
| 9 | 2022 | 8 | |
| 10 | 2021 | 49 | |
| 11 | 2021 | 64 | |
| 12 | 2019 | 31 | |
| 13 | 2018 | 8 | |
| 14 | 2017 | 30 | |
| 15 | 2017 | 34 | |
| 16 | 2016 | 3 | |
| 17 | 2014 | 167 | |
| 18 | Microstructural Characterization of Bonding Interfaces in Aluminum 3003 Blocks Fabricated by Ultrasonic Additive Manufacturing | 2010 | 30 |
| 19 | Use of the disector to estimate the Euler characteristic of three dimensional microstructures | 1987 | 19 |
| 20 | Quantitative serial sectioning analysis of the evolution of pore structure in the late stages of sintering of nickel powder | 1984 | 1 |
About Ryan Dehoff
Ryan Dehoff is a scholar working on Automotive Engineering, Mechanical Engineering and Materials Chemistry, having authored 186 papers that have together received 11.4k indexed citations. Recurring topics across this work include Additive Manufacturing Materials and Processes (93 papers), Additive Manufacturing and 3D Printing Technologies (65 papers), High Entropy Alloys Studies (28 papers), Welding Techniques and Residual Stresses (26 papers), Aluminum Alloy Microstructure Properties (16 papers), Microstructure and mechanical properties (13 papers), High Temperature Alloys and Creep (12 papers) and Titanium Alloys Microstructure and Properties (11 papers). The work is most often cited by research in Automotive Engineering (5.0k citations), Mechanical Engineering (9.1k citations) and Materials Chemistry (3.0k citations). Ryan Dehoff has collaborated with scholars based in United States, India and Australia. Frequent co-authors include S. S. Babu, Michael Kirka, William J. Sames, Sreekanth Pannala, F.A. List, Peeyush Nandwana, Alex Plotkowski, Haize Galarraga, Diana A. Lados and Amit Shyam. Their work appears in journals such as Acta Materialia, Additive manufacturing, Metallurgical Transactions A, Metallurgical and Materials Transactions A and Materials Science and Engineering A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.