Huiqin Ling
- Electrical and Electronic Engineering top 5%
- Materials Chemistry top 10%
- Mechanical Engineering top 10%
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials top 10%
- Topics
- Electronic Packaging and Soldering Technologies (23 papers)3D IC and TSV technologies (22 papers)Ferroelectric and Piezoelectric Materials (17 papers)
- Cited by
- Electrical and Electronic EngineeringElectronic, Optical and Magnetic MaterialsAutomotive Engineering
- Journals
- SHILAP Revista de lepidopterologíaApplied Physics LettersJournal of Applied Physics
- Partner nations
- ChinaUnited StatesSouth Korea
In The Last Decade
Huiqin Ling
58 papers receiving 993 citations
Peers
Comparison fields: 5 of 67
- Electrical and Electronic Engineering 660
- Materials Chemistry 412
- Mechanical Engineering 232
- Biomedical Engineering 230
- Electronic, Optical and Magnetic Materials 196
Countries citing papers authored by Huiqin Ling
This map shows the geographic impact of Huiqin Ling's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Huiqin Ling with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Huiqin Ling more than expected).
Fields of papers citing papers by Huiqin Ling
This network shows the impact of papers produced by Huiqin Ling. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Huiqin Ling. The network helps show where Huiqin Ling may publish in the future.
Co-authorship network of co-authors of Huiqin Ling
This figure shows the co-authorship network connecting the top 25 collaborators of Huiqin Ling. A scholar is included among the top collaborators of Huiqin Ling based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Huiqin Ling. Huiqin Ling is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 0 | |
| 4 | 6 | |
| 5 | 38 | |
| 6 | 14 | |
| 7 | 5 | |
| 8 | 212 | |
| 9 | 56 | |
| 10 | 0 | |
| 11 | 33 | |
| 12 | 1 | |
| 13 | 7 | |
| 14 | 74 | |
| 15 | 50 | |
| 16 | 18 | |
| 17 | 51 | |
| 18 | 6 | |
| 19 | 1 | |
| 20 | 1 |
About Huiqin Ling
Huiqin Ling is a scholar working on Electronic, Optical and Magnetic Materials, Ceramics and Composites and Electrical and Electronic Engineering, having authored 63 papers that have together received 1.0k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (22 papers) and Ferroelectric and Piezoelectric Materials (17 papers). The work is most often cited by research in Electrical and Electronic Engineering (660 citations), Electronic, Optical and Magnetic Materials (196 citations) and Automotive Engineering (118 citations). Huiqin Ling has collaborated with scholars based in China, United States and South Korea. Frequent co-authors include Anmin Hu, Aidong Li, Tao Hang, Nai‐Ben Ming, Di Wu, Qiyue Shao, Ming Li, Mu Wang, Liming Gao and Zhiguo Liu. Their work appears in journals such as SHILAP Revista de lepidopterología, Applied Physics Letters and Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.