Huanyu He
- Atomic and Molecular Physics, and Optics top 10%
- Electrical and Electronic Engineering
- Artificial Intelligence top 10%
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials
- Topics
- 3D IC and TSV technologies (9 papers)Electromagnetic Compatibility and Noise Suppression (9 papers)Electronic Packaging and Soldering Technologies (6 papers)
- Partner nations
- United StatesChina
In The Last Decade
Huanyu He
12 papers receiving 354 citations
Peers
Comparison fields: 5 of 30
- Atomic and Molecular Physics, and Optics 288
- Electrical and Electronic Engineering 179
- Artificial Intelligence 117
- Biomedical Engineering 81
- Electronic, Optical and Magnetic Materials 64
Countries citing papers authored by Huanyu He
This map shows the geographic impact of Huanyu He's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Huanyu He with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Huanyu He more than expected).
Fields of papers citing papers by Huanyu He
This network shows the impact of papers produced by Huanyu He. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Huanyu He. The network helps show where Huanyu He may publish in the future.
Co-authorship network of co-authors of Huanyu He
This figure shows the co-authorship network connecting the top 25 collaborators of Huanyu He. A scholar is included among the top collaborators of Huanyu He based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Huanyu He. Huanyu He is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 26 | |
| 3 | 0 | |
| 4 | 4 | |
| 5 | 8 | |
| 6 | 18 | |
| 7 | 11 | |
| 8 | 6 | |
| 9 | 11 | |
| 10 | 14 | |
| 11 | 67 | |
| 12 | 218 | |
| 13 | Numerical simulation of stress field in CSP slab mold | 1 |
| 14 | Numerical simulation comparison of force field in CSP with in thick slab mold | 1 |
About Huanyu He
Huanyu He is a scholar working on Electrical and Electronic Engineering, Industrial and Manufacturing Engineering and Atomic and Molecular Physics, and Optics, having authored 14 papers that have together received 387 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (9 papers), Electromagnetic Compatibility and Noise Suppression (9 papers) and Electronic Packaging and Soldering Technologies (6 papers). The work is most often cited by research in Acoustics and Ultrasonics (19 citations), Atomic and Molecular Physics, and Optics (288 citations) and Artificial Intelligence (117 citations). Huanyu He has collaborated with scholars based in United States and China. Frequent co-authors include Yan Li, Qihuang Gong, Yi Qin, James Lu, Zhaopei Liu, Yun‐Feng Xiao, Xiaobo Feng, Zheng Xu, Xiaoxiong Gu and Xicheng Zhang. Their work appears in journals such as Applied Physics Letters, Optics Letters and Optics Express.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.