Huanyu He

469 total citations
14 papers, 387 citations indexed

About

Huanyu He is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Mechanical Engineering. According to data from OpenAlex, Huanyu He has authored 14 papers receiving a total of 387 indexed citations (citations by other indexed papers that have themselves been cited), including 11 papers in Electrical and Electronic Engineering, 2 papers in Atomic and Molecular Physics, and Optics and 2 papers in Mechanical Engineering. Recurrent topics in Huanyu He's work include 3D IC and TSV technologies (9 papers), Electromagnetic Compatibility and Noise Suppression (9 papers) and Electronic Packaging and Soldering Technologies (6 papers). Huanyu He is often cited by papers focused on 3D IC and TSV technologies (9 papers), Electromagnetic Compatibility and Noise Suppression (9 papers) and Electronic Packaging and Soldering Technologies (6 papers). Huanyu He collaborates with scholars based in United States and China. Huanyu He's co-authors include Yan Li, Qihuang Gong, Yi Qin, James Lu, Zhaopei Liu, Yun‐Feng Xiao, Xiaobo Feng, Zheng Xu, Xiaoxiong Gu and Xicheng Zhang and has published in prestigious journals such as Applied Physics Letters, Optics Letters and Optics Express.

In The Last Decade

Huanyu He

12 papers receiving 354 citations

Peers

Huanyu He
Yan Xue China
Yi-Lin Hua China
Massimiliano Guasoni Italy
Chang Su China
Rahman Nouroozi Iran
Zhengyang Bai China
A. Foerster Germany
Guo-Qin Ge China
Heng Long China
Jinyong Ma Australia
Yan Xue China
Huanyu He
Citations per year, relative to Huanyu He Huanyu He (= 1×) peers Yan Xue

Countries citing papers authored by Huanyu He

Since Specialization
Citations

This map shows the geographic impact of Huanyu He's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Huanyu He with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Huanyu He more than expected).

Fields of papers citing papers by Huanyu He

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Huanyu He. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Huanyu He. The network helps show where Huanyu He may publish in the future.

Co-authorship network of co-authors of Huanyu He

This figure shows the co-authorship network connecting the top 25 collaborators of Huanyu He. A scholar is included among the top collaborators of Huanyu He based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Huanyu He. Huanyu He is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

14 of 14 papers shown
1.
Wang, Shiwei, Yingtao Ding, Zhiming Chen, Huanyu He, & Jian‐Qiang Lu. (2016). Modeling and analysis of vertical noise coupling in TSV-based 3D mixed-signal integration. Microelectronic Engineering. 156. 6–14. 2 indexed citations
2.
He, Huanyu & James Lu. (2015). Modeling and Analysis of PDN Impedance and Switching Noise in TSV-Based 3-D Integration. IEEE Transactions on Electron Devices. 62(4). 1241–1247. 26 indexed citations
3.
4.
He, Huanyu, Xiaoxiong Gu, & Jian-Qiang Lü. (2014). Modeling of switching noise and coupling in multiple chips of 3D TSV-based systems. 548–553. 4 indexed citations
5.
6.
Xu, Zheng, Qi Wu, Huanyu He, & James Lu. (2013). Electromagnetic-Simulation Program With Integrated Circuit Emphasis Modeling, Analysis, and Design of 3-D Power Delivery. IEEE Transactions on Components Packaging and Manufacturing Technology. 3(4). 641–652. 18 indexed citations
7.
He, Huanyu & Jian‐Qiang Lu. (2013). Compact Models of Voltage Drops in Power Delivery Network for TSV-Based Three-Dimensional Integration. IEEE Electron Device Letters. 34(3). 438–440. 11 indexed citations
8.
He, Huanyu, Zheng Xu, Xiaoxiong Gu, & Jian‐Qiang Lu. (2013). Power delivery modeling for 3D systems with non-uniform TSV distribution. 1115–1121. 6 indexed citations
9.
He, Huanyu, James Lu, Zheng Xu, & Xiaoxiong Gu. (2013). TSV density impact on 3D power delivery with high aspect ratio TSVs. 70–74. 11 indexed citations
10.
He, Huanyu & Xicheng Zhang. (2012). Analysis of Gouy phase shift for optimizing terahertz air-biased-coherent-detection. Applied Physics Letters. 100(6). 14 indexed citations
11.
Qin, Yi, Yan Li, Xiaobo Feng, et al.. (2010). Spin Hall effect of reflected light at the air-uniaxial crystal interface. Optics Express. 18(16). 16832–16832. 67 indexed citations
12.
Qin, Yi, Yan Li, Huanyu He, & Qihuang Gong. (2009). Measurement of spin Hall effect of reflected light. Optics Letters. 34(17). 2551–2551. 218 indexed citations
13.
He, Huanyu. (2006). Numerical simulation of stress field in CSP slab mold. 1 indexed citations
14.
He, Huanyu. (2006). Numerical simulation comparison of force field in CSP with in thick slab mold. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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