G. Lefranc

904 total citations
32 papers, 690 citations indexed

About

G. Lefranc is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Surfaces, Coatings and Films. According to data from OpenAlex, G. Lefranc has authored 32 papers receiving a total of 690 indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Electrical and Electronic Engineering, 10 papers in Biomedical Engineering and 8 papers in Surfaces, Coatings and Films. Recurrent topics in G. Lefranc's work include Silicon Carbide Semiconductor Technologies (7 papers), Advanced optical system design (5 papers) and Optical Coatings and Gratings (5 papers). G. Lefranc is often cited by papers focused on Silicon Carbide Semiconductor Technologies (7 papers), Advanced optical system design (5 papers) and Optical Coatings and Gratings (5 papers). G. Lefranc collaborates with scholars based in Germany, Austria and Italy. G. Lefranc's co-authors include G. Mitić, H.P. Degischer, Tobias Huber, Thomas Schmitt, Thomas Licht, I. Dietrich, E. Knapek, Anke-Susanne Müller, Andreas Schubert and H. Walter and has published in prestigious journals such as Composites Science and Technology, IEEE Transactions on Industry Applications and Ultramicroscopy.

In The Last Decade

G. Lefranc

32 papers receiving 646 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
G. Lefranc Germany 14 381 237 225 117 91 32 690
Kyou-Hyun Kim South Korea 10 170 0.4× 160 0.7× 300 1.3× 54 0.5× 223 2.5× 17 497
H. Fujimoto United States 12 323 0.8× 114 0.5× 134 0.6× 44 0.4× 152 1.7× 45 613
M.A. Kulakov Germany 15 272 0.7× 210 0.9× 286 1.3× 13 0.1× 76 0.8× 39 648
H. Bangert Austria 13 122 0.3× 159 0.7× 277 1.2× 61 0.5× 124 1.4× 61 641
Michaël Coulombier Belgium 14 177 0.5× 257 1.1× 393 1.7× 26 0.2× 209 2.3× 36 693
Alexander Minor United States 5 179 0.5× 86 0.4× 180 0.8× 12 0.1× 130 1.4× 5 488
H. Tan Singapore 14 294 0.8× 419 1.8× 323 1.4× 222 1.9× 71 0.8× 59 781
H.‐L. Huber Germany 11 241 0.6× 85 0.4× 88 0.4× 39 0.3× 102 1.1× 54 423
Chih‐Lung Chou United Kingdom 15 121 0.3× 241 1.0× 152 0.7× 10 0.1× 51 0.6× 33 484
Remco Geurts Netherlands 9 154 0.4× 139 0.6× 170 0.8× 7 0.1× 127 1.4× 24 484

Countries citing papers authored by G. Lefranc

Since Specialization
Citations

This map shows the geographic impact of G. Lefranc's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by G. Lefranc with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites G. Lefranc more than expected).

Fields of papers citing papers by G. Lefranc

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by G. Lefranc. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by G. Lefranc. The network helps show where G. Lefranc may publish in the future.

Co-authorship network of co-authors of G. Lefranc

This figure shows the co-authorship network connecting the top 25 collaborators of G. Lefranc. A scholar is included among the top collaborators of G. Lefranc based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with G. Lefranc. G. Lefranc is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lefranc, G., et al.. (2004). A solder bumping interconnect technology for high-power devices. 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551). 4183–4187. 10 indexed citations
2.
Coquery, G., G. Lefranc, Thomas Licht, et al.. (2003). High temperature reliability on automotive power modules verified by power cycling tests up to 150°C. Microelectronics Reliability. 43(9-11). 1871–1876. 29 indexed citations
3.
Lefranc, G., et al.. (2003). Non‐destructive Investigation of AlSi7Mg/SiC70p MMCs by means of Acoustic Scanning Microscopy, X‐Ray and Neutron Diffraction. Materialwissenschaft und Werkstofftechnik. 34(4). 375–380. 4 indexed citations
4.
Mitić, G. & G. Lefranc. (2003). Localisation of electrical-insulation- and partial-discharge failures of IGBT modules. 2. 1453–1458. 47 indexed citations
5.
Lefranc, G., et al.. (2003). Aluminum bond-wire properties after 1 billion mechanical cycles. Microelectronics Reliability. 43(9-11). 1833–1838. 11 indexed citations
6.
Mitić, G., et al.. (2002). The thermal impedance of new power semiconductor modules using AlN substrates. 2. 1026–1030. 9 indexed citations
7.
Lefranc, G., G. Mitić, & Thomas Licht. (2002). Properties of solders and their fatigue in power modules. Microelectronics Reliability. 42(9-11). 1641–1646. 14 indexed citations
8.
Seliger, N., E. Wolfgang, G. Lefranc, H. Berg, & Thomas Licht. (2002). Reliable power electronics for automotive applications. Microelectronics Reliability. 42(9-11). 1597–1604. 14 indexed citations
9.
Lefranc, G., et al.. (2001). Thermal management and reliability of multi-chip power modules. Microelectronics Reliability. 41(9-10). 1663–1669. 1 indexed citations
10.
Mitić, G., et al.. (1999). Reliability of AlN substrates and their solder joints in IGBT power modules. Microelectronics Reliability. 39(6-7). 1159–1164. 27 indexed citations
11.
Knapek, E., et al.. (1995). Design, CAD-data generation and fabrication of diffractive lenses with submicron feature sizes. Microelectronic Engineering. 27(1-4). 175–178. 1 indexed citations
12.
Knapek, E., et al.. (1995). Efficiency enhancement of diffractive optical elements by variable relief profiling. Microelectronic Engineering. 27(1-4). 171–174. 3 indexed citations
13.
Knapek, E., et al.. (1994). High efficiency diffractive coupling lenses by three-dimensional profiling with electron-beam lithography and reactive ion etching. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 12(6). 3635–3638. 4 indexed citations
14.
Knapek, E., H. Formanek, G. Lefranc, & I. Dietrich. (1984). The interpretation of radiation damage measurements with electron diffraction of organic materials at very low temperatures. Ultramicroscopy. 14(3). 253–263. 13 indexed citations
15.
Knapek, E., G. Lefranc, I. Dietrich, & H. Formanek. (1984). High resolution cryo electron microscopy of specifically stained specimens. Ultramicroscopy. 15(3). 205–213. 1 indexed citations
16.
Knapek, E., et al.. (1983). Superconducting Lenses for Steric Structure Determination of Organic Material in the Electron Microscope. Molecular crystals and liquid crystals. 96(1). 293–303. 1 indexed citations
17.
Knapek, E., G. Lefranc, H.G. Heide, & I. Dietrich. (1982). Electron microscopical results on cryoprotection of organic materials obtained with cold stages. Ultramicroscopy. 10(1-2). 105–110. 14 indexed citations
18.
Lefranc, G. & Anke-Susanne Müller. (1976). Effect of copper additions to superconducting niobium-tin sinter materia. Journal of the Less Common Metals. 45(2). 339–342. 25 indexed citations
19.
Dietrich, I., et al.. (1976). Improvements in electron microscopy by application of superconductivity. Ultramicroscopy. 2(2-3). 241–249. 59 indexed citations
20.
Dietrich, I., G. Lefranc, & Anke-Susanne Müller. (1972). Abschirmverhalten von Niob-Zinn-Sintermaterial bei zugabe von fremdelementen. Journal of the Less Common Metals. 29(2). 121–132. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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