Fuwen Zhang

428 total citations
38 papers, 318 citations indexed

About

Fuwen Zhang is a scholar working on Electrical and Electronic Engineering, Civil and Structural Engineering and Building and Construction. According to data from OpenAlex, Fuwen Zhang has authored 38 papers receiving a total of 318 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electrical and Electronic Engineering, 16 papers in Civil and Structural Engineering and 14 papers in Building and Construction. Recurrent topics in Fuwen Zhang's work include Electronic Packaging and Soldering Technologies (14 papers), Structural Behavior of Reinforced Concrete (12 papers) and 3D IC and TSV technologies (9 papers). Fuwen Zhang is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), Structural Behavior of Reinforced Concrete (12 papers) and 3D IC and TSV technologies (9 papers). Fuwen Zhang collaborates with scholars based in China, United States and Hong Kong. Fuwen Zhang's co-authors include Qingfeng Xu, Lingzhu Chen, Kent A. Harries, Qiong Liu, Jinghui Feng, Zhuolin Wang, Xiangmin Li, Jian‐Guo Dai, Lu Jiang and Kun Tian and has published in prestigious journals such as Construction and Building Materials, Journal of Alloys and Compounds and Engineering Structures.

In The Last Decade

Fuwen Zhang

35 papers receiving 313 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Fuwen Zhang China	9	143	129	75	67	59	38	318
Ivica Boko Croatia	10	114 0.8×	213 1.7×	45 0.6×	31 0.5×	6 0.1×	53	311
Olga Bondarenko Ukraine	12	61 0.4×	31 0.2×	110 1.5×	44 0.7×	38 0.6×	57	298
Andrea Lucherini Belgium	10	57 0.4×	135 1.0×	203 2.7×	251 3.7×	6 0.1×	31	401
K.Q. Robert United States	12	79 0.6×	63 0.5×	261 3.5×	7 0.1×	26 0.4×	23	362
Fabien Delhomme France	13	226 1.6×	413 3.2×	27 0.4×	54 0.8×	6 0.1×	22	512
Chun Ni Canada	13	310 2.2×	238 1.8×	39 0.5×	5 0.1×	81 1.4×	68	579
Mostafa Yossef Egypt	9	174 1.2×	183 1.4×	54 0.7×	10 0.1×	23 0.4×	19	328
Yantai Zhang China	13	71 0.5×	246 1.9×	25 0.3×	4 0.1×	12 0.2×	30	441
JE Masters United States	11	59 0.4×	82 0.6×	89 1.2×	31 0.5×	12 0.2×	20	328
Lin An China	14	134 0.9×	328 2.5×	20 0.3×	8 0.1×	10 0.2×	29	444

Countries citing papers authored by Fuwen Zhang

Since Specialization

Citations

This map shows the geographic impact of Fuwen Zhang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fuwen Zhang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fuwen Zhang more than expected).

Fields of papers citing papers by Fuwen Zhang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fuwen Zhang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fuwen Zhang. The network helps show where Fuwen Zhang may publish in the future.

Co-authorship network of co-authors of Fuwen Zhang

This figure shows the co-authorship network connecting the top 25 collaborators of Fuwen Zhang. A scholar is included among the top collaborators of Fuwen Zhang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fuwen Zhang. Fuwen Zhang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Zhou, Jiacheng, et al.. (2024). Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate. Soldering and Surface Mount Technology. 36(5). 276–284.

Xu, Lei, et al.. (2024). Effects of Ga addition on the microstructure and mechanical performance of Sn-58Bi based alloys and the solder joints. Journal of Materials Science Materials in Electronics. 35(34).

Harries, Kent A., et al.. (2023). Seismic performance evaluation of a five-story column-and-beam glulam frame with steel-timber buckling restrained braces. Journal of Building Engineering. 80. 108045–108045. 3 indexed citations

Leng, Yubing, et al.. (2023). Experimental study on longitudinal embedding performance of bolted engineered bamboo connections. Construction and Building Materials. 411. 134730–134730. 4 indexed citations

Zhang, Fuwen, et al.. (2023). Numerical and experimental analysis in seismic performance of post-earthquake reinforced concrete frame retrofitted with ECC. Advances in Structural Engineering. 27(1). 3–16. 1 indexed citations

Zhang, Fuwen, Xiangmin Li, Zhuolin Wang, et al.. (2022). Experimental Study of the Seismic Performance of a Prefabricated Frame Rocking Wall Structure. Buildings. 12(10). 1714–1714. 2 indexed citations

Zhang, Fuwen, et al.. (2022). Enhanced Thermoelectric Properties of Ag Doped Cu2s by Using Hydrothermal Method. SSRN Electronic Journal. 1 indexed citations

Zhou, Jiacheng, Fuwen Zhang, Zhigang Wang, et al.. (2022). Structure and Properties of SnBi/Cu Composite Lead-free Solder. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). 1–5. 1 indexed citations

Wang, Yishu, et al.. (2022). Impact of Ni-coated carbon fiber on the interfacial (Cu,Ni)6Sn5 growth of Sn-3.5Ag composite solder on Cu substrate during reflow and isothermal aging. Materials Today Communications. 31. 103572–103572. 10 indexed citations

10.

Zhang, Fuwen, et al.. (2020). Solder paste metamorphism. Rare Metals. 40(5). 1329–1336. 4 indexed citations

11.

Li, Xiangmin, et al.. (2020). Shaking table test for externally-hung self-centering rocking wall structure. Bulletin of Earthquake Engineering. 19(2). 863–887. 15 indexed citations

12.

Wang, Yishu, et al.. (2020). Effect of grain boundary on failure behavior of SABI333 solder joints during creep. Journal of Materials Science Materials in Electronics. 31(6). 5017–5024. 1 indexed citations

13.

Zhang, Shaoming, et al.. (2019). Properties of (Fe–B)‐doped Sn–1.0Ag–0.5Cu solders prepared by mechanical alloying. Rare Metals. 38(7). 665–674. 5 indexed citations

14.

Gao, Rundong, Xiangmin Li, Fuwen Zhang, Hui Liu, & Yubing Leng. (2017). Research on the Detection Technology of Defects in the Bottom Joint of the Precast Shear Wall Based on Ultrasonic Imaging Method. 1 indexed citations

15.

Xu, Jun, et al.. (2014). Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron. Rare Metals. 34(11). 783–788. 8 indexed citations

16.

Zhang, Fuwen. (2012). Experimental research on mechanical behavior of PC hollow-core slab exposed to fire. Jianzhu jiegou xuebao. 5 indexed citations

17.

Xu, Qingfeng, J.F. Chen, Lei Zhu, Xiangmin Li, & Fuwen Zhang. (2012). Strengthening timber beams with near surface mounted carbon fiber reinforced polymer rods. 2 indexed citations

18.

Zhang, Fuwen, et al.. (2009). Numerical simulation and analysis for collapse responses of RC frame structures under earthquake. Frontiers of Architecture and Civil Engineering in China. 3(4). 364–369. 3 indexed citations

19.

Zhang, Fuwen. (2005). A New Type Sn-Ag-Cu-Cr Lead-free Solder. Electronic Components and Materials. 1 indexed citations

20.

Zhang, Fuwen, et al.. (2003). Bend effect of the electrode for travelling wave integrated electro-optic modulators. Chinese Optics Letters. 1(7). 401–403.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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