D.F. Baldwin

1.2k total citations
86 papers, 870 citations indexed

About

D.F. Baldwin is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, D.F. Baldwin has authored 86 papers receiving a total of 870 indexed citations (citations by other indexed papers that have themselves been cited), including 81 papers in Electrical and Electronic Engineering, 13 papers in Mechanics of Materials and 13 papers in Mechanical Engineering. Recurrent topics in D.F. Baldwin's work include Electronic Packaging and Soldering Technologies (69 papers), 3D IC and TSV technologies (64 papers) and Integrated Circuits and Semiconductor Failure Analysis (8 papers). D.F. Baldwin is often cited by papers focused on Electronic Packaging and Soldering Technologies (69 papers), 3D IC and TSV technologies (64 papers) and Integrated Circuits and Semiconductor Failure Analysis (8 papers). D.F. Baldwin collaborates with scholars based in United States, Sweden and Germany. D.F. Baldwin's co-authors include Daniel E. Whitney, Thomas L. De Fazio, Chun‐Ho Kim, Nam P. Suh, C.P. Wong, Rao Tummala, Derek J. Milner, V. Sundaram, G. Edward White and Fuhan Liu and has published in prestigious journals such as Applied Energy, IEEE Transactions on Robotics and Automation and IEEE Transactions on Instrumentation and Measurement.

In The Last Decade

D.F. Baldwin

78 papers receiving 801 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
D.F. Baldwin United States 12 469 285 200 99 97 86 870
N.S. Ong Singapore 15 100 0.2× 213 0.7× 233 1.2× 28 0.3× 45 0.5× 29 596
Robert W. Messler United States 16 528 1.1× 125 0.4× 1.0k 5.0× 43 0.4× 25 0.3× 56 1.3k
Ali Zghal France 15 97 0.2× 153 0.5× 486 2.4× 32 0.3× 92 0.9× 56 746
Jozef Zajac Slovakia 14 87 0.2× 173 0.6× 371 1.9× 34 0.3× 49 0.5× 81 574
Xiaozhong Hao China 17 149 0.3× 240 0.8× 636 3.2× 25 0.3× 166 1.7× 57 857
Blaine Lilly United States 10 170 0.4× 198 0.7× 489 2.4× 13 0.1× 20 0.2× 26 621
Wen‐Ren Jong Taiwan 15 135 0.3× 224 0.8× 497 2.5× 9 0.1× 78 0.8× 54 758
Yann Meyer France 14 328 0.7× 40 0.1× 139 0.7× 19 0.2× 30 0.3× 41 672
Zhijia Xu China 15 54 0.1× 213 0.7× 260 1.3× 24 0.2× 27 0.3× 42 682
Mudassar Rehman China 17 199 0.4× 112 0.4× 376 1.9× 33 0.3× 32 0.3× 45 678

Countries citing papers authored by D.F. Baldwin

Since Specialization
Citations

This map shows the geographic impact of D.F. Baldwin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D.F. Baldwin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D.F. Baldwin more than expected).

Fields of papers citing papers by D.F. Baldwin

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by D.F. Baldwin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D.F. Baldwin. The network helps show where D.F. Baldwin may publish in the future.

Co-authorship network of co-authors of D.F. Baldwin

This figure shows the co-authorship network connecting the top 25 collaborators of D.F. Baldwin. A scholar is included among the top collaborators of D.F. Baldwin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with D.F. Baldwin. D.F. Baldwin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Hanif, Sarmad, et al.. (2023). On the impact of tidal generation and energy storage integration in PV-rich electric distribution systems. Applied Energy. 357. 122466–122466. 8 indexed citations
3.
Baldwin, D.F., et al.. (2018). Developing an Acuity Tool to Optimize Nurse Navigation Caseloads. Oncology Issues. 33(2). 17–25. 2 indexed citations
4.
5.
Ding, Hengfei, I. Charles Ume, Jian Zhang, & D.F. Baldwin. (2005). Integrated Hardware and Software for Improved Flatness Measurement With ATC4.1 Flip-Chip Assembly Case Study. IEEE Transactions on Instrumentation and Measurement. 54(5). 1898–1904. 3 indexed citations
6.
Baldwin, D.F., et al.. (2005). Flip chip processing using wafer-applied underfills. 2. 297–306. 3 indexed citations
7.
Zhang, Jian & D.F. Baldwin. (2004). An innovative underfill process for high-speed SMT CSP BGA flip chip assembly. 17–21. 1 indexed citations
8.
Zhang, Jian & D.F. Baldwin. (2004). High-speed SMT compatible dispenseless underfill process for CSP BGA flip chip assembly. 20. 870–874. 2 indexed citations
9.
Baldwin, D.F., et al.. (2003). Flux-underfill compatibility and failure mode analysis in high yield flip chip processing. 78–84. 10 indexed citations
10.
Baldwin, D.F., et al.. (2003). Development of solder interconnects wetting model. 46. 47–53. 1 indexed citations
11.
12.
Baldwin, D.F., et al.. (2002). Flip chip self-alignment mechanism and modeling. 13. 158–164. 8 indexed citations
13.
Wang, Lejun, et al.. (2002). Reworkable underfills for flip chip, BGA, and CSP applications. 1. 914–919. 9 indexed citations
14.
Liu, Fuhan, et al.. (2002). Reliability assessment of microvias in HDI printed circuit boards. IEEE Transactions on Components and Packaging Technologies. 25(2). 254–259. 35 indexed citations
15.
Baldwin, D.F., et al.. (2001). Modular, device-scale, direct-chip-attach packaging for microsystems. IEEE Transactions on Components and Packaging Technologies. 24(4). 631–634. 2 indexed citations
16.
Baldwin, D.F., et al.. (2000). Processing and reliability of fast-flow, snap-cure underfills. I. Processing and moisture sensitivity. IEEE Transactions on Electronics Packaging Manufacturing. 23(4). 259–266. 3 indexed citations
17.
Baldwin, D.F., et al.. (2000). A low temperature processable ternary gallium alloy for via filling application in microelectronic packaging. Journal of Materials Science Materials in Electronics. 11(9). 653–656. 3 indexed citations
18.
Baldwin, D.F., et al.. (1999). Thermal Management in Direct Chip Attach Assemblies. Journal of Electronic Packaging. 121(4). 222–230. 1 indexed citations
19.
Baldwin, D.F., et al.. (1997). Initial development work on a high throughput low cost flip chip on board assembly process. 3235. 284–289. 4 indexed citations
20.
Baldwin, D.F., et al.. (1991). An integrated computer aid for generating and evaluating assembly sequences for mechanical products. IEEE Transactions on Robotics and Automation. 7(1). 78–94. 271 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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