Chee Yee Chung
-
- 3D IC and TSV technologies 6
- Electromagnetic Compatibility and Noise Suppression 5
- Electronic Packaging and Soldering Technologies 4
- Advanced DC-DC Converters 2
- Low-power high-performance VLSI design 1
- Advancements in Semiconductor Devices and Circuit Design 1
- Silicon Carbide Semiconductor Technologies 1
-
- Microgrid Control and Optimization 1
- Co-authors
- Shuai JiangChenhao NanXin LiStefano SagginiYuanliang LiEric K. H. ChanGregory SizikovShin Yamamoto
- Journals
- IEEE Transactions on Power Electronics (1 paper)IEEE Transactions on Advanced Packaging (1 paper)
- Partner nations
- United StatesMalaysiaItaly
In The Last Decade
Chee Yee Chung
9 papers receiving 309 citations
Peers
Comparison fields: 5 of 16
- Electrical and Electronic Engineering 315
- Automotive Engineering 30
- Control and Systems Engineering 43
- Condensed Matter Physics 13
- Mechanical Engineering 27
Countries citing papers authored by Chee Yee Chung
This map shows the geographic impact of Chee Yee Chung's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chee Yee Chung with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chee Yee Chung more than expected).
Fields of papers citing papers by Chee Yee Chung
This network shows the impact of papers produced by Chee Yee Chung. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chee Yee Chung. The network helps show where Chee Yee Chung may publish in the future.
Co-authorship network
The 13 scholars most cited alongside Chee Yee Chung, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 8 | |
| 2 | 2018 | 188 | |
| 3 | 2018 | 78 | |
| 4 | 2008 | 2 | |
| 5 | 2004 | 7 | |
| 6 | 2003 | 1 | |
| 7 | 2003 | 7 | |
| 8 | 2002 | 10 | |
| 9 | 2000 | 19 |
About Chee Yee Chung
Chee Yee Chung is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Civil and Structural Engineering, having authored 9 papers that have together received 320 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (6 papers), Electromagnetic Compatibility and Noise Suppression (5 papers), Electronic Packaging and Soldering Technologies (4 papers), Advanced DC-DC Converters (2 papers), Low-power high-performance VLSI design (1 paper), Advancements in Semiconductor Devices and Circuit Design (1 paper), Microgrid Control and Optimization (1 paper) and Silicon Carbide Semiconductor Technologies (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (315 citations), Automotive Engineering (30 citations) and Control and Systems Engineering (43 citations). Chee Yee Chung has collaborated with scholars based in United States, Malaysia and Italy. Frequent co-authors include Shuai Jiang, Chenhao Nan, Xin Li, Stefano Saggini, Xin Li, Yuanliang Li, Eric K. H. Chan, Gregory Sizikov, Xin Li and Shin Yamamoto. Their work appears in journals such as IEEE Transactions on Power Electronics and IEEE Transactions on Advanced Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.