Björn Vandecasteele

408 total citations
32 papers, 322 citations indexed

About

Björn Vandecasteele is a scholar working on Biomedical Engineering, Electrical and Electronic Engineering and Cellular and Molecular Neuroscience. According to data from OpenAlex, Björn Vandecasteele has authored 32 papers receiving a total of 322 indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Biomedical Engineering, 18 papers in Electrical and Electronic Engineering and 5 papers in Cellular and Molecular Neuroscience. Recurrent topics in Björn Vandecasteele's work include Advanced Sensor and Energy Harvesting Materials (13 papers), 3D IC and TSV technologies (9 papers) and Electronic Packaging and Soldering Technologies (8 papers). Björn Vandecasteele is often cited by papers focused on Advanced Sensor and Energy Harvesting Materials (13 papers), 3D IC and TSV technologies (9 papers) and Electronic Packaging and Soldering Technologies (8 papers). Björn Vandecasteele collaborates with scholars based in Belgium, Netherlands and Japan. Björn Vandecasteele's co-authors include Jan Vanfleteren, Yang Yang, Thomas Vervust, Cai Grau, Josep Marco‐Pallarés, Giulio Ruffini, S. Ravi P. Silva, E. Farrés, Lluís Fuentemilla and Paul Watts and has published in prestigious journals such as Sensors, Advanced Engineering Materials and Journal of Micromechanics and Microengineering.

In The Last Decade

Björn Vandecasteele

29 papers receiving 308 citations

Peers

Björn Vandecasteele
Comparison fields: 5 of 56
  • Biomedical Engineering 172
  • Electrical and Electronic Engineering 151
  • Mechanical Engineering 73
  • Cognitive Neuroscience 68
  • Cellular and Molecular Neuroscience 64
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R. P. Rocha Portugal
Ziyuan Che United States
Hokyung Jang South Korea
Roberto Peralta United States
Tucker Stuart United States
Haotian Guo China
Jae Chul Hwang South Korea
John Bilbily United States
Yong Ho Kwon South Korea
Lingqing Yan United States
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Citations per field, relative to Björn Vandecasteele
Björn Vandecasteele · 1×
Citations per year, relative to Björn Vandecasteele
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Countries citing papers authored by Björn Vandecasteele

Since Specialization
Citations

This map shows the geographic impact of Björn Vandecasteele's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Björn Vandecasteele with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Björn Vandecasteele more than expected).

Fields of papers citing papers by Björn Vandecasteele

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Björn Vandecasteele. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Björn Vandecasteele. The network helps show where Björn Vandecasteele may publish in the future.

Co-authorship network of co-authors of Björn Vandecasteele

This figure shows the co-authorship network connecting the top 25 collaborators of Björn Vandecasteele. A scholar is included among the top collaborators of Björn Vandecasteele based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Björn Vandecasteele. Björn Vandecasteele is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
# Work Indexed citations
1 1
2 2
3 2
4 18
5 29
6 18
7 0
8 44
9
Integration techniques and applications of thin chips on low cost foil substrates
2
10 1
11 2
12 5
13
Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils
1
14 47
15 27
16
Embedding of chips in flex and rigid substrates: impact on thermal and mechanical performance
0
17
Low temperature flip chip attachment for flexible display applications
1
18 14
19 6
20
Low temperatue flip-chip assembly for biomedical applications.
1

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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