Immediate Impact

4 standout
Sub-graph 1 of 2

Citing Papers

Connecting the macroscopic and mesoscopic properties of sintered silver nanoparticles by crystal plasticity finite element method
2023 Standout
Recent Advances and Trends in Advanced Packaging
2022 Standout
3 intermediate papers

Works of Suk-Kyu Ryu being referenced

Thermomechanical Failure Analysis of Through-Silicon Via Interface Using a Shear-Lag Model With Cohesive Zone
2013
Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects
2010

Author Peers

Author Last Decade Papers Cites
Suk-Kyu Ryu 293 87 41 6 314
Jang‐Hi Im 281 74 1 36 11 305
Makoto Motoyoshi 238 66 51 7 289
Kenya Kikuchi 253 49 2 62 2 275
M. J. Interrante 233 45 1 34 2 252
B. Roberds 258 53 32 8 286
Kuan-Hsun Lu 305 56 36 4 309
I. Suni 209 68 1 36 8 279
Tanya Moore 247 152 1 37 9 348
Brook Raymond 239 145 1 37 11 325
Carl Prevatte 236 144 1 35 11 324

All Works

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Rankless by CCL
2026