Immediate Impact
1 standout
Citing Papers
Recent Advances and Trends in Advanced Packaging
2022 Standout
Works of K. Soejima being referenced
Vertical Integration of Stacked DRAM and High-Speed Logic Device Using SMAFTI Technology
2009
Three-Dimensional Packaging Technology for Stacked DRAM With 3-Gb/s Data Transfer
2008
Author Peers
| Author | Last Decade | Papers | Cites | ||||
|---|---|---|---|---|---|---|---|
| K. Soejima | 72 | 8 | 20 | 17 | 6 | 86 | |
| Douglas Yu | 100 | 20 | 10 | 11 | 8 | 115 | |
| King Jien Chui | 106 | 22 | 7 | 17 | 6 | 120 | |
| W.C. Chiou | 77 | 14 | 9 | 8 | 4 | 92 | |
| David Ho | 77 | 25 | 7 | 8 | 7 | 91 | |
| C. Penny | 38 | 9 | 13 | 16 | 6 | 63 | |
| Prasanna Khare | 69 | 15 | 14 | 15 | 8 | 94 | |
| R.S. McFadden | 46 | 3 | 13 | 28 | 6 | 63 | |
| Zhangsong Mao | 86 | 7 | 4 | 8 | 6 | 90 | |
| V. Balan | 50 | 15 | 6 | 26 | 10 | 65 | |
| P. Brun | 55 | 14 | 11 | 18 | 6 | 65 |
All Works
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