Immediate Impact
5 standout
Citing Papers
Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management
2024 Standout
Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics
2013 Standout
Works of J.M. Dorkel being referenced
Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications
1998
Three-dimensional thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits
1996
Author Peers
| Author | Last Decade | Papers | Cites | |||
|---|---|---|---|---|---|---|
| J.M. Dorkel | 157 | 49 | 35 | 22 | 197 | |
| Liang Zhang | 171 | 30 | 35 | 26 | 240 | |
| P. Santos | 128 | 17 | 44 | 25 | 176 | |
| David Bame | 124 | 44 | 19 | 18 | 229 | |
| Chih‐Ming Tsai | 206 | 41 | 8 | 23 | 259 | |
| Soon Wee Ho | 223 | 33 | 20 | 19 | 256 | |
| York Christian Gerstenmaier | 171 | 91 | 62 | 22 | 261 | |
| D.J. Walkey | 230 | 21 | 47 | 25 | 259 | |
| M. Rencz | 125 | 38 | 40 | 16 | 168 | |
| F.N. Masana | 220 | 41 | 68 | 17 | 249 | |
| Wenfeng Fu | 82 | 89 | 33 | 24 | 216 |
All Works
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