D.J. Walkey

578 citations

33 papers · 405 indexed · h-index 13

Impact in

Electrical and Electronic Engineering top 10%
- Advancements in Semiconductor Devices and Circuit Design
- Silicon Carbide Semiconductor Technologies
- Radio Frequency Integrated Circuit Design
- Semiconductor materials and devices
- 3D IC and TSV technologies
- Electrostatic Discharge in Electronics
Statistical and Nonlinear Physics
- Model Reduction and Neural Networks

Papers in ⓘ

Electrical and Electronic Engineering 30
- Advancements in Semiconductor Devices and Circuit Design 15
- Silicon Carbide Semiconductor Technologies 14
- Radio Frequency Integrated Circuit Design 6
- 3D IC and TSV technologies 6
- Semiconductor materials and devices 3
Materials Chemistry 7
- Thermal properties of materials 7

Co-authors: T. Smy (23 shared papers)M. Schröter (8 shared papers)D. Marchesan (6 shared papers)D. Celo (9 shared papers)S. K. Dew (2 shared papers)M.C. Maliepaard (4 shared papers)R. Surridge (2 shared papers)J.S. Brodsky (2 shared papers)
Journals: Solid-State Electronics (5 papers)IEEE Journal of Solid-State Circuits (4 papers)IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (3 papers)IEEE Transactions on Advanced Packaging (3 papers)IEEE Transactions on Components and Packaging Technologies (3 papers)
Partner nations: Canada United States Germany

In The Last Decade

D.J. Walkey

33 papers receiving 372 citations

Peers

Countries citing papers authored by D.J. Walkey

Since Specialization

Citations

This map shows the geographic impact of D.J. Walkey's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D.J. Walkey with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D.J. Walkey more than expected).

Fields of papers citing papers by D.J. Walkey

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by D.J. Walkey. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D.J. Walkey. The network helps show where D.J. Walkey may publish in the future.

Co-authors

The 23 scholars most cited alongside D.J. Walkey, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with D.J. Walkey Line = papers co-authored together D.J. Walkey links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 33 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Equivalent circuit modeling of static substrate thermal coupling using VCVS representation IEEE Journal of Solid-State Circuits ·D.J. Walkey, T. Smy, R.G. Dickson, J.S. Brodsky, D.T. Zweidinger, R.M. Fox	2002	36
2	Compact representation of temperature and power dependence of thermal resistance in Si, Inp and GaAs substrate devices using linear models Solid-State Electronics ·D.J. Walkey, T. Smy, T.W. MacElwee, M.C. Maliepaard	2002	34
3	Modeling thermal resistance in trench-isolated bipolar technologies including trench heat flow Solid-State Electronics ·D.J. Walkey, T. Smy, Chris Reimer, M. Schröter, Hai V. Tran, D. Marchesan	2002	30
4	Physical modeling of lateral scaling in bipolar transistors IEEE Journal of Solid-State Circuits ·M. Schröter, D.J. Walkey	1996	26
5	A thermal design methodology for multifinger bipolar transistor structures IEEE Transactions on Electron Devices ·D.J. Walkey, D. Celo, T. Smy, R. Surridge	2002	23
6	Simultaneous extraction of thermal and emitter series resistances in bipolar transistors Hai V. Tran, M. Schröter, D.J. Walkey, D. Marchesan, T. Smy	2002	23
7	The creation of compact thermal models of electronic components using model reduction IEEE Transactions on Advanced Packaging ·D. Celo, Xiaoming Guo, P. Gunupudi, Roni Khazaka, D.J. Walkey, T. Smy, M. Nakhla	2005	22
8	A 3D thermal simulation tool for integrated devices-Atar IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems ·T. Smy, D.J. Walkey, S. K. Dew	2001	22
9	Transient 3D heat flow analysis for integrated circuit devices using the transmission line matrix method on a quad tree mesh Solid-State Electronics ·T. Smy, D.J. Walkey, S. K. Dew	2001	21
10	Prediction of thermal resistance in trench isolated bipolar device structures D.J. Walkey, T. Smy, Hai V. Tran, D. Marchesan, M. Schröter	2002	19
11	A simulation study of IC layout effects on thermal management of die attached GaAs ICs IEEE Transactions on Components and Packaging Technologies ·Chris Reimer, T. Smy, D.J. Walkey, Bruce Beggs, R. Surridge	2000	16
12	A scalable thermal model for trench isolated bipolar devices Solid-State Electronics ·D.J. Walkey, T. Smy, D. Marchesan, Hai V. Tran, M. Schröter	2000	15
13	Short-channel effects on MOSFET subthreshold swing Solid-State Electronics ·N. G. Tarr, D.J. Walkey, M.B. Rowlandson, S. B. Hewitt, T.W. MacElwee	1995	14
14	Fast Simulation of steady-state temperature distributions in electronic components using multidimensional model reduction IEEE Transactions on Components and Packaging Technologies ·D. Celo, P. Gunupudi, Roni Khazaka, D.J. Walkey, T. Smy, M. Nakhla	2005	12
15	Extraction and modelling of thermal behavior in trench isolated bipolar structures D.J. Walkey, T. Smy, D. Marchesan, Hai V. Tran, Chris Reimer, T.C. Kleckner, M.K. Jackson, M. Schröter, J.R. Long	2003	10
16	Process- and geometry-scalable bipolar transistor and transmission line models for Si and SiGe MMICs in the 5-22 GHz range Sorin P. Voinigescu, D. Marchesan, J.L. Showell, M.C. Maliepaard, M. Cudnoch, M.G.M. Schumacher, M. Herod, D.J. Walkey, G.E. Babcock, Peter Schvan, R.A. Hadaway	2002	9
17	Modeling facet heating in ridge lasers Microelectronics Reliability ·G. Romo, T. Smy, D.J. Walkey, B. Reid	2003	9
18	Thin film microstructure and thermal transport simulation using 3D-films Thin Solid Films ·T. Smy, D.J. Walkey, Kenneth D. Harris, Michael J. Brett	2001	9
19	Linear models for temperature and power dependence of thermal resistance in Si, InP and GaAs substrate devices D.J. Walkey, T. Smy, T.W. MacElwee, M.C. Maliepaard	2002	8
20	Compact, Netlist-Based Representation of Thermal Transient Coupling Using Controlled Sources IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems ·D.J. Walkey, T. Smy, D. Celo, T.W. MacElwee, M.C. Maliepaard	2004	7

About D.J. Walkey

D.J. Walkey is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Control and Systems Engineering, Statistical and Nonlinear Physics and Atomic and Molecular Physics, and Optics, having authored 33 papers that have together received 405 indexed citations. Recurring topics across this work include Advancements in Semiconductor Devices and Circuit Design (15 papers), Silicon Carbide Semiconductor Technologies (14 papers), Thermal properties of materials (7 papers), Radio Frequency Integrated Circuit Design (6 papers), 3D IC and TSV technologies (6 papers), Semiconductor Quantum Structures and Devices (5 papers), Model Reduction and Neural Networks (5 papers) and Semiconductor materials and devices (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (368 citations), Statistical and Nonlinear Physics (37 citations), Materials Chemistry (70 citations), Atomic and Molecular Physics, and Optics (47 citations) and Statistics, Probability and Uncertainty (8 citations). D.J. Walkey has collaborated with scholars based in Canada, United States and Germany. Frequent co-authors include T. Smy, M. Schröter, D. Marchesan, D. Celo, S. K. Dew, M.C. Maliepaard, R. Surridge, J.S. Brodsky, Roni Khazaka and M. Nakhla. Their work appears in journals such as Solid-State Electronics, IEEE Journal of Solid-State Circuits, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on Advanced Packaging and IEEE Transactions on Components and Packaging Technologies.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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