Immediate Impact
3 standout
Citing Papers
Recent Advances and Trends in Advanced Packaging
2022 Standout
Novel Functionalized BN Nanosheets/Epoxy Composites with Advanced Thermal Conductivity and Mechanical Properties
2020 Standout
Works of Jie Xue being referenced
Large Size Silicon Interposer and 3D IC Integration for System-in-Packaging (SiP)
2012
The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder
2008
Author Peers
| Author | Last Decade | Papers | Cites | ||||
|---|---|---|---|---|---|---|---|
| Jie Xue | 80 | 5 | 46 | 19 | 10 | 93 | |
| S. Haque | 94 | 6 | 19 | 22 | 9 | 118 | |
| Jong‐Kai Lin | 147 | 15 | 94 | 15 | 12 | 156 | |
| E. Zakel | 108 | 26 | 36 | 8 | 16 | 120 | |
| F. Madrid | 28 | 12 | 49 | 13 | 9 | 112 | |
| Ivy Qin | 93 | 13 | 62 | 13 | 12 | 126 | |
| Kazushige Toriyama | 92 | 3 | 51 | 10 | 8 | 94 | |
| Hidenori Hara | 213 | 5 | 17 | 25 | 11 | 222 | |
| J.W. Gray | 173 | 4 | 10 | 22 | 9 | 197 | |
| X. P. Xu | 172 | 1 | 61 | 8 | 10 | 178 | |
| Ra-Min Tain | 51 | 4 | 40 | 14 | 11 | 98 |
All Works
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