Immediate Impact
5 standout
Citing Papers
Review of jet impingement cooling of electronic devices: Emerging role of surface engineering
2023 Standout
Research and Technologies for next-generation high-temperature data centers – State-of-the-arts and future perspectives
2022 Standout
Works of Chang-Chi Lee being referenced
Thermal characteristics evaluation for board-level high performance flip-chip package equipped with vapor chamber as heat spreader
2010
Author Peers
| Author | Last Decade | Papers | Cites | ||||
|---|---|---|---|---|---|---|---|
| Chang-Chi Lee | 129 | 76 | 13 | 40 | 13 | 161 | |
| S. Yokota | 94 | 149 | 11 | 46 | 17 | 223 | |
| Jean-Marie Dilhac | 149 | 33 | 29 | 62 | 14 | 190 | |
| Y. Nagata | 82 | 28 | 10 | 37 | 18 | 152 | |
| Josef Weber | 193 | 40 | 14 | 26 | 17 | 217 | |
| Khuram Shehzad | 175 | 77 | 7 | 55 | 21 | 197 | |
| Syed Manzoor Qasim | 72 | 30 | 17 | 9 | 15 | 135 | |
| Jieyi Long | 127 | 29 | 24 | 23 | 11 | 168 | |
| M. Rencz | 125 | 27 | 40 | 38 | 16 | 168 | |
| Kamal Garg | 78 | 37 | 17 | 16 | 19 | 158 | |
| Bob Willis | 120 | 32 | 9 | 82 | 15 | 183 |
All Works
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