IEEE Transactions on Components Packaging and Manufacturing Technology Part A

398 papers and 6.8k indexed citations i.

About

The 398 papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A in the last decades have received a total of 6.8k indexed citations. Papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A usually cover Electrical and Electronic Engineering (269 papers), Mechanical Engineering (170 papers) and Mechanics of Materials (84 papers) specifically the topics of Electronic Packaging and Soldering Technologies (141 papers), 3D IC and TSV technologies (75 papers) and Electrical Contact Performance and Analysis (66 papers). The most active scholars publishing in IEEE Transactions on Components Packaging and Manufacturing Technology Part A are Paul G. Slade, Andrew Kusiak, E. Suhir, F.N. Masana, Masakazu Nakamura, M. Lindmayer, M. Braunović, Clemens Lasance, J.W. McBride and Kyung-Wook Paik.

In The Last Decade

Fields of papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A.

Countries where authors publish in IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Since Specialization
Citations

This map shows the geographic impact of research published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites IEEE Transactions on Components Packaging and Manufacturing Technology Part A more than expected).

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar’s output or impact.

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