Yu‐Ting Cheng
Impact in
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- Advanced MEMS and NEMS Technologies
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Radio Frequency Integrated Circuit Design
- Biomedical Engineering top 10%
- Acoustic Wave Resonator Technologies
- Nanofabrication and Lithography Techniques
- Advanced Sensor and Energy Harvesting Materials
Papers in
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- Advanced MEMS and NEMS Technologies 18
- 3D IC and TSV technologies 14
- Radio Frequency Integrated Circuit Design 8
- Microwave Engineering and Waveguides 8
- Electronic Packaging and Soldering Technologies 6
- Advanced MIMO Systems Optimization 6
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- Advanced Sensor and Energy Harvesting Materials 8
- Co-authors
- Liwei Lin (8 shared papers)K. Najafi (5 shared papers)Chien‐Ching Chiu (13 shared papers)Jin‐Lung Lin (1 shared paper)Bo Wang (3 shared papers)Wensyang Hsu (8 shared papers)Chien‐Chang Chen (1 shared paper)Weiqiao Lv (3 shared papers)
- Journals
- Electronics (3 papers)IEEE Sensors Journal (3 papers)Microsystem Technologies (2 papers)Journal of Micromechanics and Microengineering (2 papers)IEEE Transactions on Nanotechnology (2 papers)
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
Yu‐Ting Cheng
74 papers receiving 728 citations
Peers
Comparison fields: 5 of 84
- Electrical and Electronic Engineering 518
- Biomedical Engineering 261
- Automotive Engineering 54
- Developmental Biology 9
- Atomic and Molecular Physics, and Optics 97
Countries citing papers authored by Yu‐Ting Cheng
This map shows the geographic impact of Yu‐Ting Cheng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yu‐Ting Cheng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yu‐Ting Cheng more than expected).
Fields of papers citing papers by Yu‐Ting Cheng
This network shows the impact of papers produced by Yu‐Ting Cheng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yu‐Ting Cheng. The network helps show where Yu‐Ting Cheng may publish in the future.
Co-authors
The 25 scholars most cited alongside Yu‐Ting Cheng, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 84 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2000 | 157 | |
| 2 | 2005 | 55 | |
| 3 | 1998 | 34 | |
| 4 | 2023 | 27 | |
| 5 | 2023 | 25 | |
| 6 | 2016 | 25 | |
| 7 | 2011 | 23 | |
| 8 | 2002 | 19 | |
| 9 | 2011 | 19 | |
| 10 | 2012 | 17 | |
| 11 | 2012 | 17 | |
| 12 | 2005 | 17 | |
| 13 | 2009 | 17 | |
| 14 | 2017 | 16 | |
| 15 | 1999 | 15 | |
| 16 | 2012 | 15 | |
| 17 | 2007 | 13 | |
| 18 | 2011 | 13 | |
| 19 | 2012 | 13 | |
| 20 | 2002 | 11 |
About Yu‐Ting Cheng
Yu‐Ting Cheng is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Materials Chemistry and Mechanics of Materials, having authored 84 papers that have together received 765 indexed citations. Recurring topics across this work include Advanced MEMS and NEMS Technologies (18 papers), 3D IC and TSV technologies (14 papers), Antenna Design and Analysis (10 papers), Radio Frequency Integrated Circuit Design (8 papers), Microwave Engineering and Waveguides (8 papers), Advanced Sensor and Energy Harvesting Materials (8 papers), Electronic Packaging and Soldering Technologies (6 papers) and Advanced MIMO Systems Optimization (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (518 citations), Biomedical Engineering (261 citations), Automotive Engineering (54 citations), Developmental Biology (9 citations) and Atomic and Molecular Physics, and Optics (97 citations). Yu‐Ting Cheng has collaborated with scholars based in Taiwan, United States and China. Frequent co-authors include Liwei Lin, K. Najafi, Chien‐Ching Chiu, Jin‐Lung Lin, Bo Wang, Wensyang Hsu, Chien‐Chang Chen, Weiqiao Lv, Yuanliang Zhong and Kwok Siong Teh. Their work appears in journals such as Electronics, IEEE Sensors Journal, Microsystem Technologies, Journal of Micromechanics and Microengineering and IEEE Transactions on Nanotechnology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.