Yunpeng Wang
- Electrical and Electronic Engineering top 2%
- Materials Chemistry top 5%
- Mechanical Engineering top 5%
- Electronic, Optical and Magnetic Materials top 10%
- Biomedical Engineering top 10%
- Co-authors
- Haitao MaHai‐Ping ChengAnil KunwarYinghua QiuNing ZhaoZhi‐Gang ChenXiao‐Lei ShiWei‐Di Liu
- Topics
- Electronic Packaging and Soldering Technologies (61 papers)3D IC and TSV technologies (31 papers)Aluminum Alloys Composites Properties (17 papers)
- Cited by
- Materials ChemistryElectrical and Electronic EngineeringElectronic, Optical and Magnetic Materials
- Partner nations
- ChinaUnited StatesJapan
In The Last Decade
Yunpeng Wang
174 papers receiving 2.7k citations
Peers
Comparison fields: 5 of 107
- Electrical and Electronic Engineering 1.5k
- Materials Chemistry 1.4k
- Mechanical Engineering 531
- Electronic, Optical and Magnetic Materials 350
- Biomedical Engineering 313
Countries citing papers authored by Yunpeng Wang
This map shows the geographic impact of Yunpeng Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yunpeng Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yunpeng Wang more than expected).
Fields of papers citing papers by Yunpeng Wang
This network shows the impact of papers produced by Yunpeng Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yunpeng Wang. The network helps show where Yunpeng Wang may publish in the future.
Co-authorship network of co-authors of Yunpeng Wang
This figure shows the co-authorship network connecting the top 25 collaborators of Yunpeng Wang. A scholar is included among the top collaborators of Yunpeng Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yunpeng Wang. Yunpeng Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 1 | |
| 4 | 0 | |
| 5 | 2 | |
| 6 | 5 | |
| 7 | 3 | |
| 8 | 1 | |
| 9 | 16 | |
| 10 | 8 | |
| 11 | 2 | |
| 12 | 26 | |
| 13 | 36 | |
| 14 | 87 | |
| 15 | 3 | |
| 16 | 11 | |
| 17 | 14 | |
| 18 | 34 | |
| 19 | 54 | |
| 20 | 6 |
About Yunpeng Wang
Yunpeng Wang is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and General Materials Science, having authored 193 papers that have together received 2.7k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (61 papers), 3D IC and TSV technologies (31 papers) and Aluminum Alloys Composites Properties (17 papers). The work is most often cited by research in Materials Chemistry (1.4k citations), Electrical and Electronic Engineering (1.5k citations) and Electronic, Optical and Magnetic Materials (350 citations). Yunpeng Wang has collaborated with scholars based in China, United States and Japan. Frequent co-authors include Haitao Ma, Hai‐Ping Cheng, Anil Kunwar, Yinghua Qiu, Ning Zhao, Zhi‐Gang Chen, Xiao‐Lei Shi, Wei‐Di Liu, Jin Zou and Yanping Liu. Their work appears in journals such as Nature Communications, Nano Letters and Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.