Ning Zhao

2.4k total citations
146 papers, 1.9k citations indexed

About

Ning Zhao is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Ning Zhao has authored 146 papers receiving a total of 1.9k indexed citations (citations by other indexed papers that have themselves been cited), including 133 papers in Electrical and Electronic Engineering, 91 papers in Mechanical Engineering and 22 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Ning Zhao's work include Electronic Packaging and Soldering Technologies (129 papers), 3D IC and TSV technologies (96 papers) and Intermetallics and Advanced Alloy Properties (37 papers). Ning Zhao is often cited by papers focused on Electronic Packaging and Soldering Technologies (129 papers), 3D IC and TSV technologies (96 papers) and Intermetallics and Advanced Alloy Properties (37 papers). Ning Zhao collaborates with scholars based in China, United States and Hong Kong. Ning Zhao's co-authors include Mingliang Huang, Haitao Ma, Yuanyuan Qiao, Yi Zhong, Wei Dong, Anil Kunwar, Lin Qu, Yunpeng Wang, Huijing Zhao and Fan Yang and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia.

In The Last Decade

Ning Zhao

136 papers receiving 1.9k citations

Peers

Ning Zhao
Comparison fields: 5 of 77
  • Electrical and Electronic Engineering 1.7k
  • Mechanical Engineering 1.2k
  • Aerospace Engineering 308
  • Electronic, Optical and Magnetic Materials 253
  • Materials Chemistry 233
Dhafer Abdulameer Shnawah Malaysia
Chun Yu China
Anil Kunwar China
Shun‐Tian Lin Taiwan
Donald Francis Susan United States
Ki-Tae Kim South Korea
Taek‐Soo Kim South Korea
Dongying Ju Japan
W. Jillek Germany
Dhafer Abdulameer Shnawah Malaysia View profile →
Citations per field, relative to Ning Zhao
Ning Zhao · 1×
Citations per year, relative to Ning Zhao
Ning Zhao · 1×

Countries citing papers authored by Ning Zhao

Since Specialization
Citations

This map shows the geographic impact of Ning Zhao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ning Zhao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ning Zhao more than expected).

Fields of papers citing papers by Ning Zhao

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ning Zhao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ning Zhao. The network helps show where Ning Zhao may publish in the future.

Co-authorship network of co-authors of Ning Zhao

This figure shows the co-authorship network connecting the top 25 collaborators of Ning Zhao. A scholar is included among the top collaborators of Ning Zhao based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ning Zhao. Ning Zhao is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
# Title Journal Authors Indexed citations
1 Interfacial microstructure evolution and tensile behavior of Sn-xAg micro solder joints during aging Journal of Materials Research and Technology Yuanyuan Qiao, Ning Zhao et al. 2
2 Temperature-dependent tensile behaviors and strain localization of TC17 high temperature titanium alloys with bimodal microstructure Materials Characterization Jun Zhou, Ning Zhao et al. 3
3 Long-Term Dynamic Stability of the Interfacial Cu6Sn5 Texture in SAC305/Cu Joints by Laser Jet Solder Ball Bonding for Advanced Packaging ACS Applied Materials & Interfaces Di Liu, Yuanyuan Qiao et al. 1
4 Accelerated TLPD bonding of reliable IMCs micro joints using Cu–8Ni substrate under thermal gradient: Experiments and theoretical calculations Journal of Materials Research and Technology Yanqing Lai, Mingjie Wang et al. 0
5 A review of preparation methods, friction and wear, corrosion, and biocompatibility of biomedical high-entropy alloys Journal of Materials Science Shiwen Hu, Ning Zhao et al. 24
6 Anisotropy-induced reliability issues and grain orientation control in Sn-based micro solder joints for advanced packaging Journal of Material Science and Technology Yuanyuan Qiao, Ning Zhao 5
7 Micro-cones Cu fabricated by pulse electrodeposition for solderless Cu-Cu direct bonding Applied Surface Science Li‐Yin Gao, Yu-Xi Wang et al. 6
8 Morphologies and nucleus models of β-Sn grains in SAC305-xIn freestanding solder balls and solder joints Materials Characterization Xiaolei Ren, Ning Zhao et al. 11
9 Growth behavior and morphology evolution of interfacial (Cu,Ni)6Sn5 in (001)Cu/Sn/Ni micro solder joints Materials Characterization Shi Chen, Xiaolei Ren et al. 19
10 Study of electrochemical migration based transport kinetics of metal ions in Sn-9Zn alloy Microelectronics Reliability Haoran Ma, Anil Kunwar et al. 15
11 Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding Journal of materials research/Pratt's guide to venture capital sources Yi Zhong, Ning Zhao et al. 10
12 Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and IMCs during multiple reflows Vacuum Haoran Ma, Yunpeng Wang et al. 6
13 Effect of thermomigration on the growth kinetics of Cu6Sn5 at liquid-solid interfaces in Cu/Sn/Cu solder joints Acta Physica Sinica Ning Zhao, Yi Zhong et al. 7
14 Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient Scientific Reports Ning Zhao, Yi Zhong et al. 121
15 A three-dimensional reconstruction methodology for aeroengine blade welding repair Transactions of the China Welding Institution Ning Zhao 2
16 Effect of CuNi crosssolder interaction on liquidsolid interfacial reaction in Cu/Sn/Ni solder joint The Chinese Journal of Nonferrous Metals Lei Chen, Ning Zhao et al. 1
17 Research on Innovated Social Work Talents’ Motivation Strategy Canadian social science Ning Zhao et al. 3
18 Viscosities and wetting behaviors of Sn-Cu solders Acta Physica Sinica Ning Zhao, Xuemin Pan et al. 6
19 Study on English Hotel Brochure's Discourse Structure and Writing Strategy Based on Genre Analysis Ning Zhao 0
20 Analyzing the Meaning in Interaction in Politeness Strategies in Scent of a Woman Journal of International Social Research Ning Zhao 3

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Rankless by CCL
2026