Youbo Lin

581 total citations
12 papers, 487 citations indexed

About

Youbo Lin is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Mechanics of Materials. According to data from OpenAlex, Youbo Lin has authored 12 papers receiving a total of 487 indexed citations (citations by other indexed papers that have themselves been cited), including 12 papers in Electronic, Optical and Magnetic Materials, 9 papers in Electrical and Electronic Engineering and 4 papers in Mechanics of Materials. Recurrent topics in Youbo Lin's work include Copper Interconnects and Reliability (12 papers), Semiconductor materials and devices (8 papers) and Metal and Thin Film Mechanics (4 papers). Youbo Lin is often cited by papers focused on Copper Interconnects and Reliability (12 papers), Semiconductor materials and devices (8 papers) and Metal and Thin Film Mechanics (4 papers). Youbo Lin collaborates with scholars based in United States and Canada. Youbo Lin's co-authors include Joost J. Vlassak, Roy G. Gordon, Ting Y. Tsui, Damon B. Farmer, Zhengwen Li, Huazhi Li, Hoon Kim, Yong Xiang, Yiqun Liu and Eugene S. Beh and has published in prestigious journals such as Journal of The Electrochemical Society, Acta Materialia and Journal of materials research/Pratt's guide to venture capital sources.

In The Last Decade

Youbo Lin

12 papers receiving 477 citations

Peers

Countries citing papers authored by Youbo Lin

Since Specialization

Citations

This map shows the geographic impact of Youbo Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Youbo Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Youbo Lin more than expected).

Fields of papers citing papers by Youbo Lin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Youbo Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Youbo Lin. The network helps show where Youbo Lin may publish in the future.

Co-authorship network of co-authors of Youbo Lin

This figure shows the co-authorship network connecting the top 25 collaborators of Youbo Lin. A scholar is included among the top collaborators of Youbo Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Youbo Lin. Youbo Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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12 of 12 papers shown

#	Work	Indexed citations
1	Chemical Vapor Deposition of Cobalt Nitride and its Application as an Adhesion-Enhancing Layer for Advanced Copper Interconnects 2012 ·ECS Journal of Solid State Science and Technology ·Harish B. Bhandari, Jing Yang, Hoon Kim, Youbo Lin, Roy G. Gordon, Qing Wang, J.‐M. Lehn, Huazhi Li, Deo Shenai	33
2	Filling Narrow Trenches by Iodine-Catalyzed CVD of Copper and Manganese on Manganese Nitride Barrier/Adhesion Layers 2011 ·Journal of The Electrochemical Society ·(unknown), Youbo Lin, Roy G. Gordon	47
3	Selective Chemical Vapor Deposition of Manganese Self-Aligned Capping Layer for Cu Interconnections in Microelectronics 2010 ·Journal of The Electrochemical Society ·(unknown), Youbo Lin, Hoon Kim, Eugene S. Beh, Yiqun Liu, Roy G. Gordon	60
4	The effect of porogen loading on the stiffness and fracture energy of brittle organosilicates 2009 ·Journal of materials research/Pratt's guide to venture capital sources ·Han Li, Youbo Lin, Ting Y. Tsui, Joost J. Vlassak	34
5	Adhesion Degradation and Water Diffusion in Nanoporous Organosilicate Glass Thin Film Stacks 2009 ·Journal of The Electrochemical Society ·Youbo Lin, Ting Y. Tsui, Joost J. Vlassak	11
6	Chemical Vapor Deposition (CVD) of Manganese Self-Aligned Diffusion Barriers for Cu Interconnections in Microelectronics 2009 ·Digital Access to Scholarship at Harvard (DASH) (Harvard University) ·Roy G. Gordon, Hoon Kim, (unknown), Hongtao Wang, Harish B. Bhandari, Yiqun Liu, (unknown), Youbo Lin	5
7	PECVD low-permittivity organosilicate glass coatings: Adhesion, fracture and mechanical properties 2008 ·Acta Materialia ·Youbo Lin, Yong Xiang, Ting Y. Tsui, Joost J. Vlassak	48
8	Structure, mechanical properties and fracture behavior of organosilicate glass thin films 2007 ·PhDT ·Youbo Lin	2
9	Water diffusion and fracture in organosilicate glass film stacks 2007 ·Acta Materialia ·Youbo Lin, Ting Y. Tsui, Joost J. Vlassak	22
10	Vapor Deposition of Ruthenium from an Amidinate Precursor 2007 ·Journal of The Electrochemical Society ·Huazhi Li, Damon B. Farmer, Roy G. Gordon, Youbo Lin, Joost J. Vlassak	76
11	Octamethylcyclotetrasiloxane-Based, Low-Permittivity Organosilicate Coatings 2006 ·Journal of The Electrochemical Society ·Youbo Lin, Ting Y. Tsui, Joost J. Vlassak	49
12	Nucleation and Adhesion of ALD Copper on Cobalt Adhesion Layers and Tungsten Nitride Diffusion Barriers 2005 ·Electrochemical and Solid-State Letters ·Zhengwen Li, Roy G. Gordon, Damon B. Farmer, Youbo Lin, Joost J. Vlassak	100

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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