Giin-Shan Chen

492 total citations
61 papers, 390 citations indexed

About

Giin-Shan Chen is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, Giin-Shan Chen has authored 61 papers receiving a total of 390 indexed citations (citations by other indexed papers that have themselves been cited), including 53 papers in Electrical and Electronic Engineering, 43 papers in Electronic, Optical and Magnetic Materials and 11 papers in Mechanics of Materials. Recurrent topics in Giin-Shan Chen's work include Copper Interconnects and Reliability (42 papers), Semiconductor materials and devices (29 papers) and Electrodeposition and Electroless Coatings (20 papers). Giin-Shan Chen is often cited by papers focused on Copper Interconnects and Reliability (42 papers), Semiconductor materials and devices (29 papers) and Electrodeposition and Electroless Coatings (20 papers). Giin-Shan Chen collaborates with scholars based in Taiwan and China. Giin-Shan Chen's co-authors include Jau-Shiung Fang, Yi-Lung Cheng, Jyun‐Ting Lee, Chi‐Jung Chang, Mei‐Hui Tsai, Yung‐Pin Tsai, Yen‐Chin Chen, Ruey‐an Doong, Ku‐Fan Chen and Huan Niu and has published in prestigious journals such as Journal of The Electrochemical Society, Langmuir and Applied Catalysis B: Environmental.

In The Last Decade

Giin-Shan Chen

57 papers receiving 379 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Giin-Shan Chen Taiwan 12 253 171 133 70 62 61 390
Ho‐Jung Sun South Korea 11 386 1.5× 162 0.9× 176 1.3× 146 2.1× 26 0.4× 53 507
Biplab Chatterjee India 12 226 0.9× 117 0.7× 293 2.2× 51 0.7× 90 1.5× 20 505
C. V. Ramana United States 7 190 0.8× 88 0.5× 225 1.7× 77 1.1× 19 0.3× 9 361
Zhetong Liu China 12 196 0.8× 113 0.7× 314 2.4× 105 1.5× 29 0.5× 28 487
Qixin Wan China 11 242 1.0× 114 0.7× 301 2.3× 45 0.6× 27 0.4× 26 457
Hailing Guo China 13 278 1.1× 54 0.3× 354 2.7× 57 0.8× 86 1.4× 31 519
Changpeng Lin China 11 327 1.3× 324 1.9× 342 2.6× 84 1.2× 24 0.4× 19 664
Mehrdad Baghaie Yazdi Germany 12 136 0.5× 160 0.9× 225 1.7× 39 0.6× 15 0.2× 19 399
Somayeh Asgary Iran 10 178 0.7× 50 0.3× 196 1.5× 33 0.5× 51 0.8× 32 318
M. Anas Egypt 12 195 0.8× 263 1.5× 158 1.2× 43 0.6× 35 0.6× 27 515

Countries citing papers authored by Giin-Shan Chen

Since Specialization
Citations

This map shows the geographic impact of Giin-Shan Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Giin-Shan Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Giin-Shan Chen more than expected).

Fields of papers citing papers by Giin-Shan Chen

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Giin-Shan Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Giin-Shan Chen. The network helps show where Giin-Shan Chen may publish in the future.

Co-authorship network of co-authors of Giin-Shan Chen

This figure shows the co-authorship network connecting the top 25 collaborators of Giin-Shan Chen. A scholar is included among the top collaborators of Giin-Shan Chen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Giin-Shan Chen. Giin-Shan Chen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Chen, Giin-Shan, et al.. (2024). The impact of titanium alloying on altering nanomechanical properties and grain structures of sputter-deposited cobalt for electromigration reliability enhancement. Journal of Alloys and Compounds. 1003. 175564–175564. 1 indexed citations
3.
Cheng, Yi-Lung, et al.. (2023). Comparison of Precursors for Self-Assembled Monolayers as Cu Barriers. ECS Journal of Solid State Science and Technology. 12(6). 63001–63001.
4.
Chiu, Sheng‐Kuei, et al.. (2023). Shifting ultraviolet to visible light of photocatalytic enhancements via Au-nanoparticle decoration of TiO2/WO3 binary coatings. Vacuum. 212. 112035–112035. 1 indexed citations
5.
Fang, Jau-Shiung, et al.. (2023). Ultrasound assistance in the sensitization and activation of porous Al2O3 supports for improving the hydrogen separation of Pd/Al2O3 composite membranes. International Journal of Hydrogen Energy. 55. 1007–1016. 3 indexed citations
6.
Fang, Jau-Shiung, Kun‐Huang Chen, Yi-Lung Cheng, & Giin-Shan Chen. (2022). Layer-by-layer deposition of breakdown-strengthened Co(Ni) films by modulating termination time over the redox replacement. Materials Chemistry and Physics. 296. 127222–127222.
7.
Chen, Giin-Shan, Ching‐En Lee, Yi-Lung Cheng, et al.. (2022). Enhancement of Electromigration Reliability of Electroless-Plated Nanoscaled Copper Interconnects by Complete Encapsulation of a 1 nm-Thin Self-Assembled Monolayer. Journal of The Electrochemical Society. 169(8). 82519–82519. 3 indexed citations
8.
9.
Cheng, Yi-Lung, et al.. (2022). Enhancement of breakdown strength and electromigration reliability for cobalt lines lightly doped with boron. Materials Chemistry and Physics. 285. 126136–126136. 3 indexed citations
10.
Chen, Giin-Shan, et al.. (2021). Effects of Cu Metal Barrier on Electrical Characteristics of Porous Carbon-Doped Oxide Film. ECS Journal of Solid State Science and Technology. 10(6). 63005–63005.
11.
Fang, Jau-Shiung, Ching‐En Lee, Yi-Lung Cheng, & Giin-Shan Chen. (2021). Strengthening the Electromigration Resistance of Nanoscaled Copper Lines by (3-aminopropyl)trimethoxysilane Self-Assembled Monolayer. ECS Journal of Solid State Science and Technology. 10(8). 83007–83007. 5 indexed citations
12.
Fang, Jau-Shiung, et al.. (2021). Synthesis of Dilute Phosphorous-Embedded Co Alloy Films on a NiSi Substrate with a Superior Gap-Filling Capability for Nanoscale Interconnects. Journal of The Electrochemical Society. 168(4). 42505–42505. 5 indexed citations
13.
Cheng, Yi-Lung, et al.. (2021). Electrical and Reliability Perspectives for Self-Forming Barrier CuSc Metallization. ECS Journal of Solid State Science and Technology. 10(6). 65014–65014. 2 indexed citations
14.
Chen, Giin-Shan, et al.. (2021). Structural models and barrier properties of amine-terminated trialkoxysilane monolayers incubated in nonpolar vs. polar protic solvents. Materials Chemistry and Physics. 274. 125113–125113. 9 indexed citations
15.
Cheng, Yi-Lung, et al.. (2020). Comparison of Cu and Co Integration with Porous Low-k SiOCH Dielectrics. Thin Solid Films. 704. 138010–138010. 12 indexed citations
16.
Cheng, Yi-Lung, et al.. (2020). Reliability Improvement for Stacked Dielectric with Low-k SiOCH Dielectric and SiCN Barrier by UV-Assisted Thermal Curing. ECS Journal of Solid State Science and Technology. 9(7). 73002–73002. 2 indexed citations
17.
Chen, Giin-Shan, et al.. (2020). Anodization of Tantalum Films for the Enhancement of Monolayer Seeding and Electroless Copper Plating. Journal of The Electrochemical Society. 167(8). 82506–82506. 3 indexed citations
18.
Chen, Giin-Shan, et al.. (2020). Electrochemical Anodization of 2-nm-Thick Tantalum Films for Self-Assembling of Molecularly Thick Layer as a Barrier for Copper. Journal of The Electrochemical Society. 167(11). 112506–112506. 3 indexed citations
19.
Cheng, Yi-Lung, et al.. (2020). Effect of Post-Annealing on Reliability of Cu/Low- k Interconnects. ECS Journal of Solid State Science and Technology. 9(5). 54002–54002. 1 indexed citations
20.
Fang, Jau-Shiung, et al.. (2018). A 2-nm-Thick Mn Oxide on a Nitrogen-Stuffed Porous Carbon-Doped Organosilica as a Barrier of Cu Films. ECS Journal of Solid State Science and Technology. 7(11). N137–N142. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Ho‐Jung Sun Breakdown of academic impact, for papers by Biplab Chatterjee Breakdown of academic impact, for papers by C. V. Ramana Breakdown of academic impact, for papers by Zhetong Liu Breakdown of academic impact, for papers by Qixin Wan Breakdown of academic impact, for papers by Hailing Guo Breakdown of academic impact, for papers by Changpeng Lin Breakdown of academic impact, for papers by Mehrdad Baghaie Yazdi Breakdown of academic impact, for papers by Somayeh Asgary Breakdown of academic impact, for papers by M. Anas
Rankless by CCL
2026