Y. Danto

720 total citations
72 papers, 474 citations indexed

About

Y. Danto is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Mechanical Engineering. According to data from OpenAlex, Y. Danto has authored 72 papers receiving a total of 474 indexed citations (citations by other indexed papers that have themselves been cited), including 56 papers in Electrical and Electronic Engineering, 12 papers in Atomic and Molecular Physics, and Optics and 11 papers in Mechanical Engineering. Recurrent topics in Y. Danto's work include Integrated Circuits and Semiconductor Failure Analysis (25 papers), Semiconductor materials and devices (20 papers) and Electronic Packaging and Soldering Technologies (15 papers). Y. Danto is often cited by papers focused on Integrated Circuits and Semiconductor Failure Analysis (25 papers), Semiconductor materials and devices (20 papers) and Electronic Packaging and Soldering Technologies (15 papers). Y. Danto collaborates with scholars based in France, Netherlands and Spain. Y. Danto's co-authors include J. Salardenne, G. Couturier, Jean-Yves Delétage, A.S. Barrière, Nathalie Labat, A. Touboul, H. Frémont, Jacques Pistré, Paul Hagenmuller and A. Levasseur and has published in prestigious journals such as Journal of Applied Physics, Journal of Physics D Applied Physics and Solid State Ionics.

In The Last Decade

Y. Danto

68 papers receiving 446 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Y. Danto France 12 352 95 69 64 62 72 474
F. Sabary France 11 416 1.2× 127 1.3× 35 0.5× 55 0.9× 96 1.5× 25 543
Yimin Guo China 11 223 0.6× 268 2.8× 13 0.2× 45 0.7× 45 0.7× 27 438
Sourav Das India 10 223 0.6× 352 3.7× 23 0.3× 40 0.6× 47 0.8× 22 460
T. Matsuda Japan 12 415 1.2× 254 2.7× 11 0.2× 96 1.5× 99 1.6× 88 636
Z.G Wang China 12 298 0.8× 189 2.0× 12 0.2× 179 2.8× 109 1.8× 37 483
Myung Seung Yang South Korea 13 225 0.6× 389 4.1× 70 1.0× 18 0.3× 63 1.0× 43 564
Naoki Matsui Japan 15 591 1.7× 379 4.0× 127 1.8× 64 1.0× 26 0.4× 59 895
Janusz Jaglarz Poland 12 240 0.7× 223 2.3× 8 0.1× 65 1.0× 62 1.0× 61 451
Sandeep Dalal India 8 178 0.5× 179 1.9× 10 0.1× 54 0.8× 79 1.3× 26 356
Roland Müller‐Fiedler Germany 9 230 0.7× 105 1.1× 7 0.1× 96 1.5× 123 2.0× 17 365

Countries citing papers authored by Y. Danto

Since Specialization
Citations

This map shows the geographic impact of Y. Danto's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Y. Danto with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Y. Danto more than expected).

Fields of papers citing papers by Y. Danto

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Y. Danto. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Y. Danto. The network helps show where Y. Danto may publish in the future.

Co-authorship network of co-authors of Y. Danto

This figure shows the co-authorship network connecting the top 25 collaborators of Y. Danto. A scholar is included among the top collaborators of Y. Danto based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Y. Danto. Y. Danto is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Béchou, Laurent, et al.. (2008). Challenges and potential of new approaches for reliability assessment of nanotechnologies. Comptes Rendus Physique. 9(1). 95–109. 4 indexed citations
2.
Lewis, D., et al.. (2004). Implementing Thermal Laser and Photoelectric Laser Stimulation in a failure analysis laboratory. 41. 210–212. 5 indexed citations
3.
Deshayes, Yannick, et al.. (2003). Three-dimensional FEM simulations of thermomechanical stresses in 1.55 μm laser modules. 2610. 51–56. 1 indexed citations
4.
Pellet, Claude, et al.. (2003). Moisture diffusion in BCB resins used for MEMS packaging. Microelectronics Reliability. 43(9-11). 1939–1944. 7 indexed citations
5.
Weide-Zaage, Kirsten, et al.. (2003). Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures. Microelectronics Reliability. 43(9-11). 1821–1826. 19 indexed citations
6.
Fabert, Marc, et al.. (2002). Contribution to ageing simulation of complex analogue circuit using VHDL-AMS behavioural modelling language. Microelectronics Reliability. 42(9-11). 1353–1358. 2 indexed citations
7.
Maneux, Cristell, et al.. (2002). Analysis of GaAs HBT failure mechanisms: impact on life test strategy. 182–186. 1 indexed citations
8.
Maneux, Cristell, et al.. (2001). Experimental procedure for the evaluation of GaAs-based HBT's reliability. Microelectronics Journal. 32(4). 357–371. 4 indexed citations
9.
Danto, Y., et al.. (2000). Evaluation of the Moisture Sensitivity of Molding Compounds of IC’s Packages. Journal of Electronic Packaging. 123(1). 16–18. 11 indexed citations
10.
Dallet, Dominique, et al.. (1999). Fault and diagnosis on a successive approximation ADC. Computer Standards & Interfaces. 21(2). 114–114.
11.
Maneux, Cristell, Nathalie Labat, A. Touboul, et al.. (1998). Simulation of Base Current Evolution in C-In doped GaInP/GaAs HBT Under Current Induced Stress. European Solid-State Device Research Conference. 220–223. 1 indexed citations
12.
Perdu, P., et al.. (1998). Induced damages on CMOS and bipolar integrated structures under focused ion beam irradiation. Microelectronics Reliability. 38(6-8). 901–905. 6 indexed citations
13.
Frémont, H., et al.. (1997). Evaluation of stresses in packaged ICs by In situ measurements with an assembly test chip and simulation. Microelectronics Reliability. 37(10-11). 1795–1798. 1 indexed citations
14.
Labat, Nathalie, et al.. (1996). Complementarity of Drain Current Transient Spectroscopy (DCTS) and G.R. Noise Analysis to Detect Traps in HEMTs. European Solid-State Device Research Conference. 1005–1008. 2 indexed citations
15.
Claeys, W., Véronique Quintard, S. Dilhaire, D. Lewis, & Y. Danto. (1994). Early detection of ageing in solder joints through laser probe thermal analysis of the peltier effect. Quality and Reliability Engineering International. 10(4). 289–295. 2 indexed citations
16.
Claeys, W., et al.. (1993). Thermoreflectance optical test probe for the measurement of current‐induced temperature changes in microelectronic components. Quality and Reliability Engineering International. 9(4). 303–308. 32 indexed citations
17.
Manaud, Jean-Pierre, et al.. (1989). Comparison of the properties of TiSi2 films obtained by silicon and titanium co-sputtering and by composite target sputtering. Thin Solid Films. 170(1). 71–80. 2 indexed citations
18.
19.
Couturier, G., et al.. (1981). A study of the metal-ionic conductor interface capacitances. II. Capacitance versus surface potential. Solid State Ionics. 2(2). 121–126. 1 indexed citations
20.
Couturier, G., et al.. (1981). Influence of oxygen on electrical properties of βPbF 2 thin films. Solid State Ionics. 5. 621–624. 16 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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