Xuemin Pan

498 total citations
22 papers, 404 citations indexed

About

Xuemin Pan is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Civil and Structural Engineering. According to data from OpenAlex, Xuemin Pan has authored 22 papers receiving a total of 404 indexed citations (citations by other indexed papers that have themselves been cited), including 12 papers in Mechanical Engineering, 6 papers in Electrical and Electronic Engineering and 5 papers in Civil and Structural Engineering. Recurrent topics in Xuemin Pan's work include Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (5 papers) and Additive Manufacturing Materials and Processes (4 papers). Xuemin Pan is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (5 papers) and Additive Manufacturing Materials and Processes (4 papers). Xuemin Pan collaborates with scholars based in China, United States and Singapore. Xuemin Pan's co-authors include Ning Zhao, L.E. Murr, Ryan B. Wicker, S.M. Gaytan, Francisco Medina, César A. Terrazas, E. Martinez, José Adílson de Castro, David H. Abbott and Haitao Ma and has published in prestigious journals such as Acta Materialia, Journal of Materials Science and Sustainability.

In The Last Decade

Xuemin Pan

21 papers receiving 386 citations

Peers

Countries citing papers authored by Xuemin Pan

Since Specialization

Citations

This map shows the geographic impact of Xuemin Pan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xuemin Pan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xuemin Pan more than expected).

Fields of papers citing papers by Xuemin Pan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Xuemin Pan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xuemin Pan. The network helps show where Xuemin Pan may publish in the future.

Co-authorship network of co-authors of Xuemin Pan

This figure shows the co-authorship network connecting the top 25 collaborators of Xuemin Pan. A scholar is included among the top collaborators of Xuemin Pan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Xuemin Pan. Xuemin Pan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Constitutive Model and Hot Workability of 022Cr19Ni10 Nuclear-Grade Austenitic Stainless Steel 2025 ·Journal of Materials Engineering and Performance ·(unknown), Xuemin Pan, (unknown), Liqiang Wang, (unknown)	0
2	Application of Guar Gum Treatment of Basalt Residual-Soil Shallow Slope in Early Ecological Restoration 2024 ·Sustainability ·(unknown), (unknown), Xuemin Pan, (unknown), (unknown), (unknown)	2
3	Improving the Mechanical Properties of Red Clay Using Xanthan Gum Biopolymer 2021 ·International Journal of Polymer Science ·(unknown), (unknown), Qiang Liu, Tianliang Wang, Xuemin Pan, Guoyu Li, (unknown)	16
4	Improving the Unconfined Compressive Strength of Red Clay by Combining Biopolymers with Fibers 2021 ·JOURNAL OF RENEWABLE MATERIALS ·(unknown), Lina Wang, (unknown), Xuemin Pan, Yonghao Xu, Jing Li	18
5	Liquid structure of Sn-Ag-xCu solders and its effect on the formation and growth of interfacial Cu6Sn5 2020 ·Journal of Materials Science ·Ning Zhao, Xuemin Pan	5
6	Room- and service-temperature tensile properties of repeatedly welded austenitic stainless steel by Gleeble simulation of heat-affected zone 2018 ·Materials Research Express ·(unknown), Lin Li, Xuemin Pan, (unknown), Lili Liu, M.K. Lei	1
7	Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn–0.7Cu solder 2014 ·Journal of Materials Science Materials in Electronics ·Ning Zhao, Mingliang Huang, Yi Zhong, (unknown), Xuemin Pan	10
8	Viscosities and wetting behaviors of Sn-Cu solders 2013 ·Acta Physica Sinica ·Ning Zhao, (unknown), (unknown), Xuemin Pan, Xiaoying Liu	6
9	Microstructures of Rene 142 nickel-based superalloy fabricated by electron beam melting 2013 ·Acta Materialia ·L.E. Murr, E. Martinez, Xuemin Pan, S.M. Gaytan, José Adílson de Castro, César A. Terrazas, Francisco Medina, Ryan B. Wicker, David H. Abbott	106
10	Microstructures and properties of solid and reticulated mesh components of pure iron fabricated by electron beam melting 2013 ·Journal of Materials Research and Technology ·L.E. Murr, Edwin Martinez, Xuemin Pan, (unknown), Jialin Yang, Shujun Li, Fei Yang, Qinsi Xu, Jennifer Hernandez, Wenjun Zhu, S.M. Gaytan, Frank Medina, Ryan B. Wicker	15
11	Microstructures of Niobium Components Fabricated by Electron Beam Melting 2013 ·Metallography Microstructure and Analysis ·Edwin Martinez, L.E. Murr, Jennifer Hernandez, Xuemin Pan, Krista Amato, P. Frigola, César A. Terrazas, S.M. Gaytan, Emmanuel Rodriguez, Francisco Medina, Ryan B. Wicker	35
12	Stress transfer in microdroplet tensile test: PVC-coated and uncoated Kevlar-29 single fiber 2010 ·Optics and Lasers in Engineering ·Zhenkun Lei, Quan Wang, (unknown), Wei Qiu, Xuemin Pan	17
13	AUTOMATIC DETERMINATION OF FRINGE CONSTANT IN DIGITAL PHOTOELASTICITY 2009 ·Engineering Mechanics ·Zhenkun Lei, Hai Yun, (unknown), Xuemin Pan	2
14	The Growth Behavior of Interfacial IMC of Sn-0.7Cu/Cu by Laser Braze Welding 2009 ·Cailiao gongcheng ·Xuemin Pan	1
15	Study of shear transfer in Al/epoxy joint by digital photoelasticity 2009 ·Optics and Lasers in Engineering ·Zhenkun Lei, Hai Yun, Yanru Zhao, Yongming Xing, Xuemin Pan	25
16	Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders 2009 ·Journal of Electronic Materials ·Ning Zhao, Xuemin Pan, Daquan Yu, Haitao Ma, Lu Wang	42
17	The liquid structure of Sn-based lead-free solders and the correlative effect in liquid-solid interfacial reaction 2008 ·Journal of Physics Conference Series ·Ning Zhao, Xuemin Pan, Haitao Ma, Chuang Dong, (unknown), (unknown), Lai Wang	13
18	Exploration of Designable Exoteric Teaching Mode in Experiment Course 2006 ·Xuemin Pan	1
19	Laser-induced combustion synthesis of Zr–Ti–Al–Ni amorphous-based alloys 2005 ·Materials Letters ·Yanfang Wang, Cunshan Wang, Xuemin Pan, Chuang Dong	8
20	Microstructure of Liquid CuAlNi Shape Memory Alloy 2002 ·Acta Physico-Chimica Sinica ·Xuemin Pan, Bian Xiufang, Wang Li	2

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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