Xuemei Li
- Mechanical Engineering top 10%
- Electrical and Electronic Engineering
- Materials Chemistry
- Civil and Structural Engineering
- Molecular Biology
- Co-authors
- Fenglian SunYang LiuYuan ZhangJianzhong XuKe YangTao LiuXuecheng BianJianqun Jiang
- Topics
- Electronic Packaging and Soldering Technologies (11 papers)3D IC and TSV technologies (8 papers)Advanced Welding Techniques Analysis (5 papers)
- Partner nations
- ChinaUnited States
In The Last Decade
Xuemei Li
39 papers receiving 413 citations
Peers
Comparison fields: 5 of 68
- Mechanical Engineering 223
- Electrical and Electronic Engineering 136
- Materials Chemistry 81
- Civil and Structural Engineering 49
- Molecular Biology 45
Countries citing papers authored by Xuemei Li
This map shows the geographic impact of Xuemei Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xuemei Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xuemei Li more than expected).
Fields of papers citing papers by Xuemei Li
This network shows the impact of papers produced by Xuemei Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xuemei Li. The network helps show where Xuemei Li may publish in the future.
Co-authorship network of co-authors of Xuemei Li
This figure shows the co-authorship network connecting the top 25 collaborators of Xuemei Li. A scholar is included among the top collaborators of Xuemei Li based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Xuemei Li. Xuemei Li is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 8 | |
| 2 | 2 | |
| 3 | 2 | |
| 4 | 1 | |
| 5 | 2 | |
| 6 | 2 | |
| 7 | 0 | |
| 8 | 18 | |
| 9 | 2 | |
| 10 | 0 | |
| 11 | 15 | |
| 12 | 8 | |
| 13 | 7 | |
| 14 | 2 | |
| 15 | 29 | |
| 16 | 47 | |
| 17 | 5 | |
| 18 | 47 | |
| 19 | 1 | |
| 20 | 0 |
About Xuemei Li
Xuemei Li is a scholar working on General Engineering, Mechanical Engineering and Hematology, having authored 45 papers that have together received 428 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (5 papers). The work is most often cited by research in Mechanical Engineering (223 citations), General Engineering (5 citations) and Hematology (37 citations). Xuemei Li has collaborated with scholars based in China and United States. Frequent co-authors include Fenglian Sun, Yang Liu, Yuan Zhang, Jianzhong Xu, Ke Yang, Tao Liu, Xuecheng Bian, Jianqun Jiang, Dongdong Sun and Fucheng Zhang. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics and Scientific Reports.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.