Wei He

3.3k total citations · 1 hit paper
174 papers, 2.5k citations indexed

About

Wei He is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Biomedical Engineering. According to data from OpenAlex, Wei He has authored 174 papers receiving a total of 2.5k indexed citations (citations by other indexed papers that have themselves been cited), including 121 papers in Electrical and Electronic Engineering, 61 papers in Materials Chemistry and 44 papers in Biomedical Engineering. Recurrent topics in Wei He's work include Electrodeposition and Electroless Coatings (53 papers), Electronic Packaging and Soldering Technologies (39 papers) and Corrosion Behavior and Inhibition (36 papers). Wei He is often cited by papers focused on Electrodeposition and Electroless Coatings (53 papers), Electronic Packaging and Soldering Technologies (39 papers) and Corrosion Behavior and Inhibition (36 papers). Wei He collaborates with scholars based in China, United States and Macao. Wei He's co-authors include Shouxu Wang, Guoyun Zhou, Yuanming Chen, Chong Wang, Zhihua Tao, Yan Hong, Catherine Prentice, Yongdong Shi, Yao Tang and Ole Øystein Knudsen and has published in prestigious journals such as Advanced Energy Materials, Journal of The Electrochemical Society and Langmuir.

In The Last Decade

Wei He

169 papers receiving 2.4k citations

Hit Papers

Insight into the anti-corrosion mechanism of crop waste A... 2024 2026 2025 2024 20 40 60

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Wei He China 25 1.4k 1.1k 527 422 385 174 2.5k
Feifei Huang China 22 1.0k 0.7× 806 0.7× 255 0.5× 692 1.6× 167 0.4× 90 1.9k
Göran Sundholm Finland 32 2.0k 1.4× 1.2k 1.1× 637 1.2× 144 0.3× 555 1.4× 136 3.5k
D.C. Trivedi India 27 1.4k 1.0× 1.1k 1.0× 837 1.6× 1.1k 2.6× 1.6k 4.2× 63 3.5k
Jun‐Young Park South Korea 36 2.2k 1.5× 2.4k 2.2× 670 1.3× 700 1.7× 368 1.0× 249 4.3k
Zhongheng Fu China 34 4.2k 2.9× 2.5k 2.3× 218 0.4× 513 1.2× 238 0.6× 106 5.8k
Ting Hei Wan China 22 1.8k 1.3× 1.3k 1.2× 272 0.5× 447 1.1× 370 1.0× 34 3.0k
Yunpeng Wang China 27 1.5k 1.1× 1.4k 1.3× 313 0.6× 350 0.8× 184 0.5× 193 2.7k
Rongsheng Chen China 31 2.1k 1.5× 944 0.9× 409 0.8× 370 0.9× 1.1k 2.9× 134 3.3k
Yanqiang Li China 36 2.3k 1.6× 2.0k 1.9× 342 0.6× 1.0k 2.4× 289 0.8× 143 4.5k

Countries citing papers authored by Wei He

Since Specialization
Citations

This map shows the geographic impact of Wei He's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wei He with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wei He more than expected).

Fields of papers citing papers by Wei He

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Wei He. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wei He. The network helps show where Wei He may publish in the future.

Co-authorship network of co-authors of Wei He

This figure shows the co-authorship network connecting the top 25 collaborators of Wei He. A scholar is included among the top collaborators of Wei He based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Wei He. Wei He is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Xiao, B.L., Xing Sun, Lei Zhu, et al.. (2025). Microscale characterization of small fatigue crack propagation behavior using in situ SEM-DIC. Measurement Science and Technology. 36(10). 105201–105201.
2.
Hai, Chunxi, Xiaopeng Li, Yuan Zhou, et al.. (2025). Unblocking the Li+ transporting ways of granulated LiAl·LDHs with polyvinyl chloride by sodium alginate. Separation and Purification Technology. 376. 134084–134084. 1 indexed citations
3.
Guo, He, Yuming Lu, Xinyuan Wang, et al.. (2025). Study on the synergistic effect of Y and Nd to significantly improve the corrosion resistance of Mg-Zn-Gd series alloy. Journal of Alloys and Compounds. 1036. 181917–181917. 1 indexed citations
4.
Wang, Chong, Liang Li, Zhiqiang Lai, et al.. (2024). Bromine-enhanced polarization for strengthening ultra-thin copper foil in lithium-ion battery. Journal of Materials Research and Technology. 30. 3831–3839. 9 indexed citations
6.
He, Wei, et al.. (2024). CuNi alloy anchored on dual-substrate TiOx/N-doped carbon nanofibers as a bifunctional electrocatalyst for rechargeable zinc-air batteries. Journal of Colloid and Interface Science. 675. 1021–1031. 2 indexed citations
7.
Li, Lintao, Libin Huang, Yating Zhang, et al.. (2024). Radial SERS acquisition on coffee ring for Serum-based breast cancer diagnosis through Multilayer Perceptron. Spectrochimica Acta Part A Molecular and Biomolecular Spectroscopy. 330. 125692–125692. 2 indexed citations
8.
He, Wei, Xiya Yang, Jialong Duan, et al.. (2023). Liquid buried interface to slide lattice and heal defects in inorganic perovskite solar cells. Journal of Colloid and Interface Science. 646. 695–702. 6 indexed citations
9.
Chen, Yuanming, et al.. (2023). UV-induced graft polymerization of polyamide-6 for electroless copper deposition. Applied Surface Science. 639. 158178–158178. 5 indexed citations
11.
Peng, Chuan, Xianming Chen, Chong Wang, et al.. (2023). Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects. Molecules. 28(6). 2783–2783. 10 indexed citations
12.
13.
Zhou, Guoyun, Yan Hong, Wei He, et al.. (2022). Direct additive copper plating on polyimide surface with silver ammonia via plasma modification. Applied Surface Science. 587. 152848–152848. 11 indexed citations
14.
Wang, Chong, Yuanzhang Su, Yilin Ye, et al.. (2022). Effect of 3-mercapto-1-propane sulfonate sulfonic acid and polyvinylpyrrolidone on the growth of cobalt pillar by electrodeposition. Nanotechnology Reviews. 11(1). 1209–1218. 12 indexed citations
15.
Wang, Chong, et al.. (2021). Research and Application of Copper Electroplating in Interconnection of Printed Circuit Board. Journal of Electrochemistry. 27(3). 257. 6 indexed citations
16.
He, Wei, Valentina Spampinato, Alexis Franquet, et al.. (2020). Area-Selective Atomic Layer Deposition of TiN Using Trimethoxy(octadecyl)silane as a Passivation Layer. Langmuir. 36(44). 13144–13154. 14 indexed citations
17.
Wang, Jinshu, Qiang Zhao, Tao Liu, & Wei He. (2020). Reduction behavior of tungsten oxide with and without scandia doping. Rare Metals. 40(3). 687–692. 5 indexed citations
19.
Chen, Yuanming, Yongqiang Li, Shouxu Wang, et al.. (2016). Bottom-up copper plating to form stacked interconnection of HDI printed circuit board for optical module application. 1 indexed citations
20.
He, Wei, et al.. (2012). In-situ Synthesis of Pt Nanoparticles on Graphene Nanosheets and Its Electrocatalysis for the Oxygen Reduction Reaction. Gaodeng xuexiao huaxue xuebao. 33(1). 133. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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