Wanbin Ren
Impact in
- Mechanical Engineering top 5%
- Electrical Contact Performance and Analysis
- Advanced materials and composites
- Mechanics of Materials top 5%
- Mechanical stress and fatigue analysis
- Adhesion, Friction, and Surface Interactions
- Metal and Thin Film Mechanics
Papers in ⓘ
-
- Electrical Contact Performance and Analysis 71
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- Mechanical stress and fatigue analysis 37
- Adhesion, Friction, and Surface Interactions 31
- Metal and Thin Film Mechanics 8
- Co-authors
- Chao Zhang (24 shared papers)Guofu Zhai (17 shared papers)Jian Song (3 shared papers)Cailong Liu (11 shared papers)Yonghao Han (12 shared papers)Yanzhang Ma (8 shared papers)Li Cui (7 shared papers)Chunxiao Gao (5 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (13 papers)IEICE Transactions on Electronics (4 papers)Review of Scientific Instruments (4 papers)The Journal of Physical Chemistry C (3 papers)Tribology International (3 papers)
- Partner nations
- ChinaUnited StatesGermany
In The Last Decade
Wanbin Ren
94 papers receiving 888 citations
Peers
Comparison fields: 5 of 54
- Mechanical Engineering 601
- Mechanics of Materials 394
- Ceramics and Composites 68
- Materials Chemistry 257
- Electrical and Electronic Engineering 276
Countries citing papers authored by Wanbin Ren
This map shows the geographic impact of Wanbin Ren's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wanbin Ren with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wanbin Ren more than expected).
Fields of papers citing papers by Wanbin Ren
This network shows the impact of papers produced by Wanbin Ren. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wanbin Ren. The network helps show where Wanbin Ren may publish in the future.
Co-authors
The 25 scholars most cited alongside Wanbin Ren, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 103 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 65 | |
| 2 | 2013 | 60 | |
| 3 | 2010 | 52 | |
| 4 | 2011 | 38 | |
| 5 | 2014 | 38 | |
| 6 | 2014 | 36 | |
| 7 | 2021 | 29 | |
| 8 | 2016 | 26 | |
| 9 | 2020 | 25 | |
| 10 | 2019 | 23 | |
| 11 | 2011 | 23 | |
| 12 | 2019 | 22 | |
| 13 | 2012 | 22 | |
| 14 | 2012 | 20 | |
| 15 | 2016 | 19 | |
| 16 | 2011 | 18 | |
| 17 | 2020 | 18 | |
| 18 | 2012 | 17 | |
| 19 | 2024 | 16 | |
| 20 | 2010 | 16 |
About Wanbin Ren
Wanbin Ren is a scholar working on Mechanical Engineering, Mechanics of Materials, Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Materials Chemistry, having authored 103 papers that have together received 922 indexed citations. Recurring topics across this work include Electrical Contact Performance and Analysis (71 papers), Mechanical stress and fatigue analysis (37 papers), Adhesion, Friction, and Surface Interactions (31 papers), Electrical Fault Detection and Protection (14 papers), Vacuum and Plasma Arcs (11 papers), Force Microscopy Techniques and Applications (10 papers), Electronic Packaging and Soldering Technologies (9 papers) and Metal and Thin Film Mechanics (8 papers). The work is most often cited by research in Mechanical Engineering (601 citations), Mechanics of Materials (394 citations), Ceramics and Composites (68 citations), Materials Chemistry (257 citations) and Electrical and Electronic Engineering (276 citations). Wanbin Ren has collaborated with scholars based in China, United States and Germany. Frequent co-authors include Chao Zhang, Guofu Zhai, Jian Song, Cailong Liu, Yonghao Han, Yanzhang Ma, Li Cui, Chunxiao Gao, J.C. Feng and Zhihua Yang. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEICE Transactions on Electronics, Review of Scientific Instruments, The Journal of Physical Chemistry C and Tribology International.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.