Hsing‐Hua Tsai
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Mechanical Engineering
- Cardiology and Cardiovascular Medicine
- Materials Chemistry
- Co-authors
- Tung‐Han ChuangJong‐Shyan WangChih‐Chin HsuTieh‐Cheng FuYi-Ching ChenChao‐Hung WangDennis ChangPo-Chun Hsu
- Topics
- Electronic Packaging and Soldering Technologies (10 papers)Copper Interconnects and Reliability (8 papers)Microstructure and mechanical properties (7 papers)
In The Last Decade
Hsing‐Hua Tsai
24 papers receiving 400 citations
Peers
Comparison fields: 5 of 77
- Electrical and Electronic Engineering 184
- Electronic, Optical and Magnetic Materials 99
- Mechanical Engineering 84
- Cardiology and Cardiovascular Medicine 72
- Materials Chemistry 65
Countries citing papers authored by Hsing‐Hua Tsai
This map shows the geographic impact of Hsing‐Hua Tsai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hsing‐Hua Tsai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hsing‐Hua Tsai more than expected).
Fields of papers citing papers by Hsing‐Hua Tsai
This network shows the impact of papers produced by Hsing‐Hua Tsai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hsing‐Hua Tsai. The network helps show where Hsing‐Hua Tsai may publish in the future.
Co-authorship network of co-authors of Hsing‐Hua Tsai
This figure shows the co-authorship network connecting the top 25 collaborators of Hsing‐Hua Tsai. A scholar is included among the top collaborators of Hsing‐Hua Tsai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hsing‐Hua Tsai. Hsing‐Hua Tsai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 24 | |
| 2 | 23 | |
| 3 | 6 | |
| 4 | 23 | |
| 5 | 2 | |
| 6 | 36 | |
| 7 | 5 | |
| 8 | 24 | |
| 9 | 21 | |
| 10 | 7 | |
| 11 | 8 | |
| 12 | 8 | |
| 13 | 18 | |
| 14 | 45 | |
| 15 | 30 | |
| 16 | 36 | |
| 17 | 17 | |
| 18 | 3 | |
| 19 | 2 | |
| 20 | 5 |
About Hsing‐Hua Tsai
Hsing‐Hua Tsai is a scholar working on Complementary and alternative medicine, Rehabilitation and Electronic, Optical and Magnetic Materials, having authored 24 papers that have together received 405 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (10 papers), Copper Interconnects and Reliability (8 papers) and Microstructure and mechanical properties (7 papers). The work is most often cited by research in Complementary and alternative medicine (64 citations), Electronic, Optical and Magnetic Materials (99 citations) and Rehabilitation (36 citations). Hsing‐Hua Tsai has collaborated with scholars based in Taiwan, Belgium and Germany. Frequent co-authors include Tung‐Han Chuang, Jong‐Shyan Wang, Chih‐Chin Hsu, Tieh‐Cheng Fu, Yi-Ching Chen, Chao‐Hung Wang, Dennis Chang, Po-Chun Hsu, Yen‐Lin Huang and Fuh‐Sheng Shieu. Their work appears in journals such as Scientific Reports, Medicine & Science in Sports & Exercise and Journal of Alloys and Compounds.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.