Timothy S. Cale

1.7k total citations
79 papers, 1.3k citations indexed

About

Timothy S. Cale is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, Timothy S. Cale has authored 79 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 51 papers in Electrical and Electronic Engineering, 27 papers in Electronic, Optical and Magnetic Materials and 22 papers in Materials Chemistry. Recurrent topics in Timothy S. Cale's work include Semiconductor materials and devices (30 papers), Copper Interconnects and Reliability (27 papers) and Plasma Diagnostics and Applications (16 papers). Timothy S. Cale is often cited by papers focused on Semiconductor materials and devices (30 papers), Copper Interconnects and Reliability (27 papers) and Plasma Diagnostics and Applications (16 papers). Timothy S. Cale collaborates with scholars based in United States, Sweden and South Korea. Timothy S. Cale's co-authors include Matthias K. Gobbert, Gregory B. Raupp, R.J. Gutmann, Jongwon Seok, Hanchen Huang, Jian‐Qiang Lu, L. Borucki, T. Merchant, John Tichy and Hong Liang and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

Timothy S. Cale

77 papers receiving 1.2k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Timothy S. Cale United States	20	743	434	363	315	234	79	1.3k
T.S. Cale United States	18	706 1.0×	322 0.7×	392 1.1×	247 0.8×	223 1.0×	83	1.2k
Jin Ho Lee South Korea	18	761 1.0×	405 0.9×	160 0.4×	113 0.4×	56 0.2×	117	1.2k
Wei Jia China	17	323 0.4×	230 0.5×	221 0.6×	187 0.6×	214 0.9×	82	959
P.K. Barhai India	17	332 0.4×	553 1.3×	159 0.4×	299 0.9×	117 0.5×	73	923
John D. Williams United States	21	696 0.9×	346 0.8×	199 0.5×	259 0.8×	20 0.1×	111	1.4k
Masayuki Niino Japan	14	204 0.3×	809 1.9×	110 0.3×	507 1.6×	96 0.4×	54	1.5k
Jan‐Åke Schweitz Sweden	24	1.1k 1.5×	374 0.9×	940 2.6×	506 1.6×	169 0.7×	72	1.9k
Rongshan Qin United Kingdom	25	899 1.2×	851 2.0×	111 0.3×	198 0.6×	56 0.2×	81	1.7k
Chunping Niu China	17	782 1.1×	421 1.0×	118 0.3×	136 0.4×	87 0.4×	122	1.2k
Jean-François Coudert France	20	339 0.5×	705 1.6×	77 0.2×	592 1.9×	41 0.2×	77	1.7k

Countries citing papers authored by Timothy S. Cale

Since Specialization

Citations

This map shows the geographic impact of Timothy S. Cale's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Timothy S. Cale with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Timothy S. Cale more than expected).

Fields of papers citing papers by Timothy S. Cale

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Timothy S. Cale. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Timothy S. Cale. The network helps show where Timothy S. Cale may publish in the future.

Co-authorship network of co-authors of Timothy S. Cale

This figure shows the co-authorship network connecting the top 25 collaborators of Timothy S. Cale. A scholar is included among the top collaborators of Timothy S. Cale based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Timothy S. Cale. Timothy S. Cale is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Kwon, Yongchai, et al.. (2008). 고온 열순환 공정이 BCB와 PECVD 산화규소막 계면의 본딩 결합력에 미치는 영향에 대한 연구. Korean Journal of Chemical Engineering. 46(2). 389–396.

Kwon, Yongchai, Jongwon Seok, Jian‐Qiang Lu, Timothy S. Cale, & R.J. Gutmann. (2007). 저유전체 고분자 접착 물질을 이용한 웨이퍼 본딩을 포함하는 웨이퍼 레벨 3차원 집적회로 구현에 관한 연구. Korean Journal of Chemical Engineering. 45(5). 466–472. 1 indexed citations

Lu, Jian‐Qiang, et al.. (2007). BCB 수지로 본딩한 웨이퍼의 본딩 결합력에 관한 연구. Korean Journal of Chemical Engineering. 45(5). 479–486. 3 indexed citations

Cale, Timothy S., et al.. (2007). Stress-Induced Grain Boundary Migration in Polycrystalline Copper. Journal of Electronic Materials. 37(3). 249–263. 11 indexed citations

Kwon, Yongchai, Jongwon Seok, Jian‐Qiang Lu, Timothy S. Cale, & R.J. Gutmann. (2006). Critical Adhesion Energy of Benzocyclobutene-Bonded Wafers. Journal of The Electrochemical Society. 153(4). G347–G347. 21 indexed citations

Kwon, Yongchai, Jongwon Seok, Jian‐Qiang Lu, Timothy S. Cale, & R.J. Gutmann. (2005). Thermal Cycling Effects on Critical Adhesion Energy and Residual Stress in Benzocyclobutene-Bonded Wafers. Journal of The Electrochemical Society. 152(4). G286–G286. 18 indexed citations

Im, Yeon‐Ho, et al.. (2003). Modeling Pattern Density Dependent Bump Formation in Copper Electrochemical Deposition. Electrochemical and Solid-State Letters. 6(3). C42–C42. 21 indexed citations

Im, Yeon‐Ho, et al.. (2003). Development of microstructure in nanostructures and thin films. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5118. 378–378. 1 indexed citations

Gobbert, Matthias K., et al.. (2002). Parallel Numerical Solution of the Boltzmann Equation for Atomic Layer Deposition (Research Note). 452–456. 1 indexed citations

10.

Richards, David F., et al.. (2002). Nucleation and film growth during copper chemical vapor deposition using the precursor Cu(TMVS)(hfac). Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 20(2). 495–506. 9 indexed citations

11.

Gobbert, Matthias K., Vinay Prasad, & Timothy S. Cale. (2002). Modeling and simulation of atomic layer deposition at the feature scale. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 20(3). 1031–1043. 28 indexed citations

12.

Gobbert, Matthias K., et al.. (2002). Transient Transport and Reactant-Wafer Interactions: Adsorption and Desorption. 1 indexed citations

13.

Rajagopalan, Ganesh, et al.. (1998). Surface Evolution During Semiconductor Processing. VLSI design. 6(1-4). 379–384. 3 indexed citations

14.

Gobbert, Matthias K., Christian Ringhofer, & Timothy S. Cale. (1996). Mesoscopic Scale Modeling of Microloading during Low Pressure Chemical Vapor Deposition. Journal of The Electrochemical Society. 143(8). 2624–2631. 28 indexed citations

15.

Cale, Timothy S.. (1996). CONFORMALITY AND COMPOSITION OF FILMS DEPOSITED AT LOW PRESSURES. Chemical Engineering Communications. 152-153(1). 261–273. 2 indexed citations

16.

Zhou, Lin & Timothy S. Cale. (1995). Flux distributions and deposition profiles from hexagonal collimators during sputter deposition. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 13(4). 2183–2188. 7 indexed citations

17.

Cale, Timothy S., et al.. (1994). Numerical simulations of thin film thermal flow. Thin Solid Films. 253(1-2). 419–424. 1 indexed citations

18.

Cale, Timothy S., et al.. (1993). Thermal runaway prevention in catalytic packed bed reactor by solid temperature measurement and Control. Korean Journal of Chemical Engineering. 10(4). 195–202. 7 indexed citations

19.

Raupp, Gregory B. & Timothy S. Cale. (1993). The Impact of Gas Phase and Surface Chemical Reactions on Step Coverage in Lpcvd. MRS Proceedings. 334. 6 indexed citations

20.

Cale, Timothy S., Manoj Kumar Jain, & Gregory B. Raupp. (1990). Maximizing step coverage during blanket tungsten low pressure chemical vapor deposition. Thin Solid Films. 193-194. 51–60. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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