Timothy S. Cale
Impact in
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- Semiconductor materials and devices
- 3D IC and TSV technologies
- Plasma Diagnostics and Applications
- Electronic Packaging and Soldering Technologies
- Mechanics of Materials top 5%
- Metal and Thin Film Mechanics
Papers in
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- Semiconductor materials and devices 30
- Plasma Diagnostics and Applications 16
- 3D IC and TSV technologies 8
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- Copper Interconnects and Reliability 27
- Co-authors
- Matthias K. Gobbert (14 shared papers)Gregory B. Raupp (10 shared papers)R.J. Gutmann (11 shared papers)Jongwon Seok (10 shared papers)Hanchen Huang (3 shared papers)Jian‐Qiang Lu (9 shared papers)L. Borucki (3 shared papers)T. Merchant (3 shared papers)
- Journals
- Journal of The Electrochemical Society (11 papers)Thin Solid Films (11 papers)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (8 papers)Korean Journal of Chemical Engineering (4 papers)Chemical Engineering Communications (3 papers)
- Partner nations
- United StatesSouth KoreaSweden
In The Last Decade
Timothy S. Cale
77 papers receiving 1.2k citations
Peers
Comparison fields: 5 of 67
- Electrical and Electronic Engineering 743
- Mechanics of Materials 315
- Electronic, Optical and Magnetic Materials 234
- Surfaces, Coatings and Films 67
- Materials Chemistry 434
Countries citing papers authored by Timothy S. Cale
This map shows the geographic impact of Timothy S. Cale's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Timothy S. Cale with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Timothy S. Cale more than expected).
Fields of papers citing papers by Timothy S. Cale
This network shows the impact of papers produced by Timothy S. Cale. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Timothy S. Cale. The network helps show where Timothy S. Cale may publish in the future.
Co-authors
The 25 scholars most cited alongside Timothy S. Cale, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 79 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 105 | |
| 2 | 2003 | 68 | |
| 3 | 2004 | 64 | |
| 4 | 2005 | 63 | |
| 5 | 1992 | 62 | |
| 6 | 2006 | 56 | |
| 7 | 1997 | 48 | |
| 8 | 1992 | 48 | |
| 9 | 2000 | 44 | |
| 10 | 2000 | 40 | |
| 11 | 2005 | 40 | |
| 12 | 2008 | 33 | |
| 13 | 2002 | 28 | |
| 14 | 1996 | 28 | |
| 15 | 2003 | 28 | |
| 16 | 2002 | 27 | |
| 17 | 2004 | 27 | |
| 18 | 2003 | 22 | |
| 19 | 2006 | 21 | |
| 20 | 2003 | 21 |
About Timothy S. Cale
Timothy S. Cale is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry, Mechanics of Materials and Biomedical Engineering, having authored 79 papers that have together received 1.3k indexed citations. Recurring topics across this work include Semiconductor materials and devices (30 papers), Copper Interconnects and Reliability (27 papers), Plasma Diagnostics and Applications (16 papers), Metal and Thin Film Mechanics (14 papers), Gas Dynamics and Kinetic Theory (10 papers), Advanced Surface Polishing Techniques (10 papers), 3D IC and TSV technologies (8 papers) and Adhesion, Friction, and Surface Interactions (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (743 citations), Mechanics of Materials (315 citations), Electronic, Optical and Magnetic Materials (234 citations), Surfaces, Coatings and Films (67 citations) and Materials Chemistry (434 citations). Timothy S. Cale has collaborated with scholars based in United States, South Korea and Sweden. Frequent co-authors include Matthias K. Gobbert, Gregory B. Raupp, R.J. Gutmann, Jongwon Seok, Hanchen Huang, Jian‐Qiang Lu, L. Borucki, T. Merchant, John Tichy and Hong Liang. Their work appears in journals such as Journal of The Electrochemical Society, Thin Solid Films, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films, Korean Journal of Chemical Engineering and Chemical Engineering Communications.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.