Todd Salamon
- Surfaces, Coatings and Films top 0.5%
- Surface Modification and Superhydrophobicity 12
- Computational Mechanics top 2%
- Fluid Dynamics and Thin Films 7
-
- Rheology and Fluid Dynamics Studies 4
- Mechanical Engineering top 5%
- Heat Transfer and Optimization 25
- Heat Transfer and Boiling Studies 23
- Refrigeration and Air Conditioning Technologies 7
- Mechanics of Materials top 5%
-
- Optical Network Technologies 5
- Semiconductor Lasers and Optical Devices 4
- Co-authors
- Paul KolodnerTom N. KrupenkinJ. Ashley TaylorEdgar LobatónMarc HodesEvelyn N. WangRobert A. BrownRobert C. Armstrong
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (5 papers)Physics of Fluids (4 papers)Journal of Electronic Packaging (2 papers)
- Partner nations
- United StatesSwitzerlandGermany
In The Last Decade
Todd Salamon
52 papers receiving 1.3k citations
Peers
Comparison fields: 5 of 77
- Surfaces, Coatings and Films 607
- Computational Mechanics 567
- Fluid Flow and Transfer Processes 129
- Mechanical Engineering 419
- Mechanics of Materials 212
Countries citing papers authored by Todd Salamon
This map shows the geographic impact of Todd Salamon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Todd Salamon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Todd Salamon more than expected).
Fields of papers citing papers by Todd Salamon
This network shows the impact of papers produced by Todd Salamon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Todd Salamon. The network helps show where Todd Salamon may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Todd Salamon, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2024 | 2 | |
| 3 | 2024 | 1 | |
| 4 | 2024 | 2 | |
| 5 | 2024 | 2 | |
| 6 | 2022 | 2 | |
| 7 | 2020 | 51 | |
| 8 | 2019 | 1 | |
| 9 | 2018 | 138 | |
| 10 | 2018 | 3 | |
| 11 | 2017 | 13 | |
| 12 | 2017 | 10 | |
| 13 | 2017 | 3 | |
| 14 | 2016 | 64 | |
| 15 | 2012 | 15 | |
| 16 | 2007 | 1 | |
| 17 | 2007 | 68 | |
| 18 | The Effects of Geometry and Wetting on Fluid Flow in Microchannels with Superhydrophobic Walls: A Numerical Study | 2005 | 3 |
| 19 | 1997 | 16 | |
| 20 | 1995 | 70 |
About Todd Salamon
Todd Salamon is a scholar working on Surfaces, Coatings and Films, Mechanical Engineering, Computational Mechanics, Fluid Flow and Transfer Processes and Metals and Alloys, having authored 54 papers that have together received 1.4k indexed citations. Recurring topics across this work include Heat Transfer and Optimization (25 papers), Heat Transfer and Boiling Studies (23 papers), Surface Modification and Superhydrophobicity (12 papers), Fluid Dynamics and Thin Films (7 papers), Refrigeration and Air Conditioning Technologies (7 papers), Optical Network Technologies (5 papers), Rheology and Fluid Dynamics Studies (4 papers) and Semiconductor Lasers and Optical Devices (4 papers). The work is most often cited by research in Surfaces, Coatings and Films (607 citations), Computational Mechanics (567 citations), Fluid Flow and Transfer Processes (129 citations), Mechanical Engineering (419 citations) and Mechanics of Materials (212 citations). Todd Salamon has collaborated with scholars based in United States, Switzerland and Germany. Frequent co-authors include Paul Kolodner, Tom N. Krupenkin, J. Ashley Taylor, Edgar Lobatón, Marc Hodes, Evelyn N. Wang, Robert A. Brown, Robert C. Armstrong, Alexander Sidorenko and Victor A. Lifton. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Physics of Fluids, Journal of Electronic Packaging, Langmuir and Bell Labs Technical Journal.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.