Juergen Wilde

1.1k total citations
60 papers, 945 citations indexed

About

Juergen Wilde is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Juergen Wilde has authored 60 papers receiving a total of 945 indexed citations (citations by other indexed papers that have themselves been cited), including 48 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 12 papers in Biomedical Engineering. Recurrent topics in Juergen Wilde's work include Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (18 papers) and Advanced MEMS and NEMS Technologies (10 papers). Juergen Wilde is often cited by papers focused on Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (18 papers) and Advanced MEMS and NEMS Technologies (10 papers). Juergen Wilde collaborates with scholars based in Germany, United Kingdom and Austria. Juergen Wilde's co-authors include Karl‐Friedrich Becker, Zhilin Cheng, Peter Schubert, Johannes F. Coy, A. Lindsay Greer, Alberto Castellero, S.V. Madge, Andreas Fix, D. Bíro and Florian Clement and has published in prestigious journals such as Journal of Power Sources, Materials Science and Engineering A and Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms.

In The Last Decade

Juergen Wilde

57 papers receiving 913 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Juergen Wilde Germany 12 588 373 149 146 100 60 945
Xiaojie Zhang China 11 412 0.7× 112 0.3× 89 0.6× 370 2.5× 236 2.4× 45 881
Weiqi Yang China 20 222 0.4× 439 1.2× 76 0.5× 363 2.5× 66 0.7× 69 1.1k
Yongqian Chen China 16 135 0.2× 144 0.4× 89 0.6× 81 0.6× 183 1.8× 48 711
Yan Cui China 17 203 0.3× 380 1.0× 147 1.0× 309 2.1× 210 2.1× 53 798
Hai‐Xing Wang China 18 469 0.8× 201 0.5× 229 1.5× 292 2.0× 57 0.6× 112 1.0k
Mayu Muramatsu Japan 12 133 0.2× 116 0.3× 132 0.9× 149 1.0× 62 0.6× 69 565
Naiyi Li China 14 139 0.2× 324 0.9× 73 0.5× 233 1.6× 34 0.3× 65 656
Bian Tian China 20 755 1.3× 108 0.3× 72 0.5× 133 0.9× 583 5.8× 83 1.1k
Yi Shi China 12 197 0.3× 94 0.3× 165 1.1× 82 0.6× 405 4.0× 117 930

Countries citing papers authored by Juergen Wilde

Since Specialization
Citations

This map shows the geographic impact of Juergen Wilde's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Juergen Wilde with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Juergen Wilde more than expected).

Fields of papers citing papers by Juergen Wilde

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Juergen Wilde. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Juergen Wilde. The network helps show where Juergen Wilde may publish in the future.

Co-authorship network of co-authors of Juergen Wilde

This figure shows the co-authorship network connecting the top 25 collaborators of Juergen Wilde. A scholar is included among the top collaborators of Juergen Wilde based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Juergen Wilde. Juergen Wilde is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Wilde, Juergen, et al.. (2022). New Lifetime Model for Advanced Power Semiconductor Interconnects. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 473–477. 1 indexed citations
3.
Beckmann, Tobias, et al.. (2021). Evaluating Local Delamination of Power Electronic Devices Through Thermal-Mechanical Analysis. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–7. 1 indexed citations
4.
Wilde, Juergen, et al.. (2021). In Situ Degradation Monitoring Methods during Lifetime Testing of Power Electronic Modules. 895–903. 2 indexed citations
5.
Wilde, Juergen, et al.. (2019). Silver Sintering on Organic Substrates for the Embedding of Power Semiconductor Devices. FreiDok plus (Universitätsbibliothek Freiburg). 1443–1450. 3 indexed citations
6.
Wilde, Juergen. (2018). 30 Years of Sensors’ Assembly and Packaging 1988 to 2018. Sensors and Materials. 30(9). 1935–1935. 1 indexed citations
7.
Ghosh, Surajit, et al.. (2017). Comparison of Packaging Concepts for High-Temperature Pressure Sensors at 500 °C. 949–955. 8 indexed citations
8.
Berndt, Michael C., et al.. (2014). Mechanical Stress Analyses of Packaged Pressure Sensors for Very High Temperatures. Journal of Microelectronics and Electronic Packaging. 11(1). 30–35. 4 indexed citations
9.
Clement, Florian, et al.. (2013). Evaluation of Industrially Relevant Parameters for Contact Firing of Screen Printed Front Side Silver Contacts. Energy Procedia. 38. 737–744. 7 indexed citations
10.
Fiedler, Volker B., et al.. (2013). Reliability of flip-chip technologies for SiC-MEMS operating at 500 °C. 1538–1544. 2 indexed citations
11.
Duerrschnabel, Michael, Zainul Aabdin, Johannes Biskupek, et al.. (2013). The Nature of Screen Printed Front Side Silver Contacts - Results of the Project MikroSol. Energy Procedia. 43. 27–36. 30 indexed citations
12.
Gromala, Przemyslaw Jakub, et al.. (2013). Internal stress state measurements of the large molded electronic control units. 1–8. 18 indexed citations
13.
Wilde, Juergen, et al.. (2012). Development and Testing of Cold gas Sprayed Circuit Boards for Power Electronics Applications. 1–6. 7 indexed citations
14.
15.
Fischer, Sebastian, et al.. (2007). Analysis of Field Loads in Automotive ECUs and MEMS Sensors. 1696–1700. 7 indexed citations
16.
Fellner, Thomas, et al.. (2006). Low-cost deformable mirror for laser focussing. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6374. 63740F–63740F. 5 indexed citations
17.
18.
Fischer, Sebastian, et al.. (2004). Influence of materials data on the performance modelling in the design of MEMS packages. 16. 57–62. 5 indexed citations
19.
Greer, A. Lindsay, et al.. (2004). Nanoindentation studies of shear banding in fully amorphous and partially devitrified metallic alloys. Materials Science and Engineering A. 375-377. 1182–1185. 144 indexed citations
20.
Wilde, Juergen & G. W. Ankersmit. (1957). Derzeitige Probleme der angewandten Entomologie in den Niederlanden. Journal of Pest Science. 30(10). 161–165.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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