Thomas Detzel

998 total citations
32 papers, 850 citations indexed

About

Thomas Detzel is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, Thomas Detzel has authored 32 papers receiving a total of 850 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Electrical and Electronic Engineering, 12 papers in Electronic, Optical and Magnetic Materials and 10 papers in Mechanics of Materials. Recurrent topics in Thomas Detzel's work include Semiconductor materials and devices (9 papers), Metal and Thin Film Mechanics (8 papers) and Copper Interconnects and Reliability (8 papers). Thomas Detzel is often cited by papers focused on Semiconductor materials and devices (9 papers), Metal and Thin Film Mechanics (8 papers) and Copper Interconnects and Reliability (8 papers). Thomas Detzel collaborates with scholars based in Austria, Germany and Italy. Thomas Detzel's co-authors include Gerhard Dehm, Christian Motz, Kurt Matoy, Reinhard Pıppan, Thomas Schöberl, W. Robl, Gaudenzio Meneghesso, Matteo Meneghini, Enrico Zanoni and Rui Huang and has published in prestigious journals such as Physical Review Letters, Acta Materialia and Materials Science and Engineering A.

In The Last Decade

Thomas Detzel

32 papers receiving 836 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Thomas Detzel Austria 16 363 360 331 202 180 32 850
M. Moske Germany 16 444 1.2× 157 0.4× 143 0.4× 163 0.8× 276 1.5× 50 767
A.S. Segal Russia 15 223 0.6× 292 0.8× 141 0.4× 435 2.2× 80 0.4× 38 625
Anita Madan United States 17 739 2.0× 398 1.1× 680 2.1× 136 0.7× 161 0.9× 53 1.1k
A. D. Roenkov Russia 18 297 0.8× 554 1.5× 111 0.3× 438 2.2× 103 0.6× 60 911
Pieter Ghekiere Belgium 11 374 1.0× 235 0.7× 404 1.2× 88 0.4× 75 0.4× 15 666
C.A. Carosella United States 16 444 1.2× 309 0.9× 342 1.0× 80 0.4× 133 0.7× 53 805
Sergey Grachev France 15 415 1.1× 298 0.8× 307 0.9× 74 0.4× 95 0.5× 45 759
L. C. Markert United States 10 680 1.9× 372 1.0× 702 2.1× 112 0.6× 161 0.9× 19 1.0k
Steven C. Seel United States 10 385 1.1× 367 1.0× 349 1.1× 64 0.3× 56 0.3× 11 794
M.G. Ramm Russia 16 186 0.5× 432 1.2× 107 0.3× 319 1.6× 84 0.5× 25 666

Countries citing papers authored by Thomas Detzel

Since Specialization
Citations

This map shows the geographic impact of Thomas Detzel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Thomas Detzel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Thomas Detzel more than expected).

Fields of papers citing papers by Thomas Detzel

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Thomas Detzel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Thomas Detzel. The network helps show where Thomas Detzel may publish in the future.

Co-authorship network of co-authors of Thomas Detzel

This figure shows the co-authorship network connecting the top 25 collaborators of Thomas Detzel. A scholar is included among the top collaborators of Thomas Detzel based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Thomas Detzel. Thomas Detzel is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Barbato, Alessandro, Marco Barbato, Matteo Meneghini, et al.. (2020). Fast System to measure the dynamic on‐resistance of on‐wafer 600 V normally off GaN HEMTs in hard‐switching application conditions. IET Power Electronics. 13(11). 2390–2397. 16 indexed citations
2.
3.
Ruzzarin, Maria, Matteo Meneghini, Marco Silvestri, et al.. (2018). Degradation Mechanisms of GaN HEMTs With p-Type Gate Under Forward Gate Bias Overstress. IEEE Transactions on Electron Devices. 65(7). 2778–2783. 61 indexed citations
4.
Meneghini, Matteo, Matteo Borga, Carlo De Santi, et al.. (2018). Power GaN HEMT degradation: from time-dependent breakdown to hot-electron effects. Padua Research Archive (University of Padova). 30.5.1–30.5.4. 7 indexed citations
5.
Curatola, G., S. Yuferev, G. Pozzovivo, et al.. (2014). GaN virtual prototyping: From traps modeling to system-level cascode optimization. 337–340. 7 indexed citations
6.
Meneghesso, Gaudenzio, Riccardo Silvestri, Matteo Meneghini, et al.. (2014). Threshold voltage instabilities in D-mode GaN HEMTs for power switching applications. 6C.2.1–6C.2.5. 17 indexed citations
7.
Detzel, Thomas, et al.. (2011). The effect of bias-temperature stress on Na+ incorporation into thin insulating films. Analytical and Bioanalytical Chemistry. 400(3). 649–657. 7 indexed citations
8.
Khatibi, G., et al.. (2011). Influence of titanium surface contamination on the reliability of Al wire bonds. 1–7. 2 indexed citations
9.
Detzel, Thomas, et al.. (2010). On the temperature dependence of Na migration in thin SiO2 films during ToF-SIMS O2+ depth profiling. Applied Surface Science. 257(1). 25–32. 12 indexed citations
10.
Huang, Rui, et al.. (2010). Apparatus for measuring local stress of metallic films, using an array of parallel laser beams during rapid thermal processing. Measurement Science and Technology. 21(5). 55702–55702. 5 indexed citations
11.
Lederer, M., et al.. (2010). Modeling of multi-temperature-cycle wafer curvature. 51. 1–6. 1 indexed citations
12.
Huang, Rui, W. Robl, Gerhard Dehm, H. Ceric, & Thomas Detzel. (2010). Disparate tendency of stress evolution of thin and thick electroplated Cu films at room temperature. 13. 1–6. 1 indexed citations
13.
Matoy, Kurt, et al.. (2010). Micron-sized fracture experiments on amorphous SiOx films and SiOx/SiNx multi-layers. Thin Solid Films. 518(20). 5796–5801. 20 indexed citations
14.
Lederer, M., et al.. (2010). Thermomechanical Stresses in Copper Films at Elevated Temperature. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2010(HITEC). 129–135. 4 indexed citations
15.
Detzel, Thomas, et al.. (2010). Microscopic stress simulation of non-planar chip technologies. Microelectronics Reliability. 50(9-11). 1666–1671. 2 indexed citations
16.
Matoy, Kurt, Thomas Detzel, Thomas Schöberl, et al.. (2009). A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films. Thin Solid Films. 518(1). 247–256. 219 indexed citations
17.
Detzel, Thomas, et al.. (2008). Prediction of wafer bow through thermomechanical simulation of patterned hard coated copper films. 62. 1–5. 6 indexed citations
18.
19.
Krausch, Georg, et al.. (1992). Binding and mobility of isolated indium atoms on Si(111)7×7. Physical Review Letters. 68(3). 377–380. 26 indexed citations
20.
Krausch, Georg, Thomas Detzel, H. Bielefeldt, et al.. (1991). Growth and melting behaviour of thin in films on Ge(100). Applied Physics A. 53(4). 324–329. 35 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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