Tai–Ran Hsu
- Mechanics of Materials top 5%
- Mechanical Engineering top 10%
- Electrical and Electronic Engineering
- Biomedical Engineering
- Materials Chemistry
- Topics
- Fatigue and fracture mechanics (19 papers)High Temperature Alloys and Creep (10 papers)Numerical methods in engineering (10 papers)
- Journals
- Journal of Applied MechanicsAIAA JournalInternational Journal for Numerical Methods in Engineering
- Partner nations
- CanadaUnited StatesSingapore
In The Last Decade
Tai–Ran Hsu
64 papers receiving 704 citations
Peers
Comparison fields: 5 of 79
- Mechanics of Materials 322
- Mechanical Engineering 268
- Electrical and Electronic Engineering 218
- Biomedical Engineering 199
- Materials Chemistry 120
Countries citing papers authored by Tai–Ran Hsu
This map shows the geographic impact of Tai–Ran Hsu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tai–Ran Hsu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tai–Ran Hsu more than expected).
Fields of papers citing papers by Tai–Ran Hsu
This network shows the impact of papers produced by Tai–Ran Hsu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tai–Ran Hsu. The network helps show where Tai–Ran Hsu may publish in the future.
Co-authorship network of co-authors of Tai–Ran Hsu
This figure shows the co-authorship network connecting the top 25 collaborators of Tai–Ran Hsu. A scholar is included among the top collaborators of Tai–Ran Hsu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tai–Ran Hsu. Tai–Ran Hsu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 3 | |
| 4 | A Thermal Management of Electronics Course and Laboratory for Undergraduates. | 3 |
| 5 | Mems & Microsystems Desingn And Manufacture | 90 |
| 6 | 22 | |
| 7 | 17 | |
| 8 | 10 | |
| 9 | Advances in electronic packaging 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii | 2 |
| 10 | An Undergraduate Curriculum in Mechatronic Systems Engineering | 4 |
| 11 | 1 | |
| 12 | 44 | |
| 13 | 1 | |
| 14 | 14 | |
| 15 | 1 | |
| 16 | 88 | |
| 17 | 20 | |
| 18 | 17 | |
| 19 | 6 | |
| 20 | 4 |
About Tai–Ran Hsu
Tai–Ran Hsu is a scholar working on Architecture, Mechanics of Materials and Mechanical Engineering, having authored 71 papers that have together received 765 indexed citations. Recurring topics across this work include Fatigue and fracture mechanics (19 papers), High Temperature Alloys and Creep (10 papers) and Numerical methods in engineering (10 papers). The work is most often cited by research in Architecture (21 citations), Mechanics of Materials (322 citations) and Mechanical Engineering (268 citations). Tai–Ran Hsu has collaborated with scholars based in Canada, United States and Singapore. Frequent co-authors include Ning Sun, M.N. Bassim, J. R. Klepaczko, Junrong Yu, Zhi Zhai, Ji Wang, M.L. Ayari, B.J.S. Wilkins, Ragi A. Hamdy and S. Banerjee. Their work appears in journals such as Journal of Applied Mechanics, AIAA Journal and International Journal for Numerical Methods in Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.