T. Hosoda

459 total citations
17 papers, 277 citations indexed

About

T. Hosoda is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Condensed Matter Physics. According to data from OpenAlex, T. Hosoda has authored 17 papers receiving a total of 277 indexed citations (citations by other indexed papers that have themselves been cited), including 14 papers in Electrical and Electronic Engineering, 9 papers in Electronic, Optical and Magnetic Materials and 3 papers in Condensed Matter Physics. Recurrent topics in T. Hosoda's work include Electronic Packaging and Soldering Technologies (10 papers), Copper Interconnects and Reliability (9 papers) and Semiconductor materials and devices (7 papers). T. Hosoda is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), Copper Interconnects and Reliability (9 papers) and Semiconductor materials and devices (7 papers). T. Hosoda collaborates with scholars based in Japan and United States. T. Hosoda's co-authors include Y. Muramoto, Nobuhisa Nagata, Ichirô KIMURA, Takashi Suzuki, Hideshi Yagi, Shun Otsuka, T. Nakamura, M. Miyajima, R. Lal and Masao Yamada and has published in prestigious journals such as Journal of Applied Physics, Journal of Hydraulic Engineering and 2022 International Electron Devices Meeting (IEDM).

In The Last Decade

T. Hosoda

16 papers receiving 257 citations

Peers

T. Hosoda
Yueqiang Li China
Tadaoki ITAKURA Japan
J. R. Richardson United States
Jingyuan Wang China
J.C. Bowers United States
Dean F. Peterson United States
P. P. Nageswara Rao India
Michael D. Furtaw United States
V. A. Snyder United States
Yueqiang Li China
T. Hosoda
Citations per year, relative to T. Hosoda T. Hosoda (= 1×) peers Yueqiang Li

Countries citing papers authored by T. Hosoda

Since Specialization
Citations

This map shows the geographic impact of T. Hosoda's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Hosoda with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Hosoda more than expected).

Fields of papers citing papers by T. Hosoda

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Hosoda. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Hosoda. The network helps show where T. Hosoda may publish in the future.

Co-authorship network of co-authors of T. Hosoda

This figure shows the co-authorship network connecting the top 25 collaborators of T. Hosoda. A scholar is included among the top collaborators of T. Hosoda based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Hosoda. T. Hosoda is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

17 of 17 papers shown
1.
Gupta, Geetak, Masahito Kanamura, Brian L. Swenson, et al.. (2022). 1200V GaN Switches on Sapphire: A low-cost, high-performance platform for EV and industrial applications. 2022 International Electron Devices Meeting (IEDM). 35.2.1–35.2.4. 11 indexed citations
2.
Neufeld, Carl J., Yifeng Wu, Steven Wienecke, et al.. (2021). 650V/780A GaN Power HEMT Enabling 10kW-Class High-efficiency Power Conversion. 24–27.
3.
Parikh, P., L. Shen, T. Hosoda, et al.. (2018). 650 Volt GaN: Highest Quality-Highest Performance Drives Market Ramp. 239–242. 1 indexed citations
4.
Suzuki, Takashi, et al.. (2007). Stress migration phenomenon in narrow copper interconnects. Journal of Applied Physics. 101(4). 16 indexed citations
5.
Suzuki, Takashi, et al.. (2007). New Degradation Phenomena of Stress-Induced Voiding Inside via in Copper Interconnects. 638–639. 8 indexed citations
6.
Suzuki, Takashi, Shun Otsuka, T. Hosoda, et al.. (2006). Stress-induced voiding under vias connected to "narrow" copper lines. 187–190. 6 indexed citations
7.
Suzuki, Takashi, et al.. (2006). Stress migration phenomena in narrow copper lines. 28–30. 3 indexed citations
8.
9.
10.
Suzuki, Takashi, Satoshi Ohtsuka, T. Hosoda, et al.. (2003). Stress induced failure analysis by stress measurements in copper dual damascene interconnects. 229–230. 6 indexed citations
11.
Hosoda, T., et al.. (2002). Effects of line size on thermal stress in aluminum conductors. 77–83. 4 indexed citations
12.
Kudo, Hiroshi, S. Yamaguchi, K. Watanabe, et al.. (2002). Copper dual damascene interconnects with very low-k dielectrics targeting for 130 nm node. 270–272. 3 indexed citations
13.
Zheng, Baolong, et al.. (2001). Thermal stress and reliability characterization of barriers for Cu interconnects. 83–85. 7 indexed citations
14.
Nagata, Nobuhisa, T. Hosoda, & Y. Muramoto. (2000). Numerical Analysis of River Channel Processes with Bank Erosion. Journal of Hydraulic Engineering. 126(4). 243–252. 137 indexed citations
15.
KIMURA, Ichirô & T. Hosoda. (1997). Fundamental Properties of Flows in Open Channels with Dead Zone. Journal of Hydraulic Engineering. 123(2). 98–107. 63 indexed citations
16.
Hosoda, T., et al.. (1989). Effects of Copper and Titanium Addition to Aluminum Interconnects on Electro- and Stress-Migration Open Circuit Failures. Reliability physics. 202–206. 7 indexed citations
17.
Nagata, Nobuhisa, T. Hosoda, Y. Muramoto, & M. M. Rahman. (1970). Numerical Analysis Of Unsteady Open Channel FlowsWith Channel Processes. WIT Transactions on Ecology and the Environment. 18. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026