Manuel Fendler

459 total citations
48 papers, 321 citations indexed

About

Manuel Fendler is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Aerospace Engineering. According to data from OpenAlex, Manuel Fendler has authored 48 papers receiving a total of 321 indexed citations (citations by other indexed papers that have themselves been cited), including 36 papers in Electrical and Electronic Engineering, 13 papers in Biomedical Engineering and 12 papers in Aerospace Engineering. Recurrent topics in Manuel Fendler's work include 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (11 papers) and Advanced Semiconductor Detectors and Materials (9 papers). Manuel Fendler is often cited by papers focused on 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (11 papers) and Advanced Semiconductor Detectors and Materials (9 papers). Manuel Fendler collaborates with scholars based in France, United States and Germany. Manuel Fendler's co-authors include Jérôme Primot, Guillaume Druart, Nicolas Guérineau, Étienne Le Coärer, Jean Taboury, Napo Bonfoh, P. Lipiński, Roland Fortunier, Céline Davoine and Riad Haïdar and has published in prestigious journals such as Optics Letters, Composite Structures and Surface and Coatings Technology.

In The Last Decade

Manuel Fendler

44 papers receiving 299 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Manuel Fendler France 10 199 131 75 45 33 48 321
Holger Moench Germany 13 442 2.2× 75 0.6× 232 3.1× 18 0.4× 28 0.8× 66 545
T. Werner Germany 12 273 1.4× 80 0.6× 154 2.1× 54 1.2× 54 1.6× 44 463
A.M. Gundlach United Kingdom 12 302 1.5× 170 1.3× 101 1.3× 59 1.3× 16 0.5× 67 488
Marc Klosner United States 10 247 1.2× 179 1.4× 116 1.5× 52 1.2× 25 0.8× 14 402
Arie J. den Boef Netherlands 10 161 0.8× 135 1.0× 183 2.4× 29 0.6× 67 2.0× 20 347
Olivier Allegre United Kingdom 11 88 0.4× 208 1.6× 238 3.2× 84 1.9× 23 0.7× 31 456
Nigel R. Farrar United States 12 246 1.2× 95 0.7× 61 0.8× 59 1.3× 65 2.0× 46 366
Chengyong Shi China 12 192 1.0× 137 1.0× 57 0.8× 14 0.3× 33 1.0× 31 339
Ł. Nieradko France 10 182 0.9× 215 1.6× 160 2.1× 37 0.8× 34 1.0× 27 401

Countries citing papers authored by Manuel Fendler

Since Specialization
Citations

This map shows the geographic impact of Manuel Fendler's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Manuel Fendler with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Manuel Fendler more than expected).

Fields of papers citing papers by Manuel Fendler

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Manuel Fendler. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Manuel Fendler. The network helps show where Manuel Fendler may publish in the future.

Co-authorship network of co-authors of Manuel Fendler

This figure shows the co-authorship network connecting the top 25 collaborators of Manuel Fendler. A scholar is included among the top collaborators of Manuel Fendler based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Manuel Fendler. Manuel Fendler is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Fendler, Manuel, et al.. (2024). Combinatorial synthesis of AlNi alloys by low-pressure cold spray deposition and post-laser alloying process. Surface and Coatings Technology. 494. 131542–131542. 1 indexed citations
2.
Bonfoh, Napo, et al.. (2022). Multiscale characterization of the mechanical behavior of a printed circuit board (PCB). Materials Today Communications. 34. 104968–104968. 7 indexed citations
3.
4.
Zhai, Min, Alexandre Locquet, Gerold A. Schneider, et al.. (2021). Diagnosis of injection-molded weld line in thermoplastic polymer by terahertz reflective imaging and scanning acoustic microscopy. SPIRE - Sciences Po Institutional REpository. 1–2. 1 indexed citations
5.
Zhai, Min, Alexandre Locquet, Gerold A. Schneider, et al.. (2021). Diagnosis of injection-molded weld lines in ABS thermoplastic by polarized terahertz reflective imaging. NDT & E International. 122. 102497–102497. 8 indexed citations
6.
Zhai, Min, Gerold A. Schneider, R. S. Kalmar, et al.. (2020). Scanning acoustic microscopy investigation of weld lines in injection-molded parts manufactured from industrial thermoplastic polymer. Micron. 138. 102925–102925. 9 indexed citations
7.
Pesci, Raphaël, et al.. (2018). X-ray Diffraction Residual Stress Measurement at Room Temperature and 77 K in a Microelectronic Multi-layered Single-Crystal Structure Used for Infrared Detection. Journal of Electronic Materials. 47(11). 6641–6648. 3 indexed citations
8.
Fendler, Manuel, et al.. (2013). Electro-mechanical studies of micro-tube insertion into Al–Cu pads for 10 μm pitch interconnection technology and 3D applications. Microelectronic Engineering. 107. 84–90. 6 indexed citations
9.
Bonfoh, Napo, et al.. (2013). 3D Modeling of high count fine pitch flip chip assemblies. 2319–2325. 1 indexed citations
10.
Bonfoh, Napo, et al.. (2013). Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies. Journal of Electronic Materials. 43(3). 671–684. 4 indexed citations
11.
Druart, Guillaume, et al.. (2012). Compact infrared cryogenic wafer-level camera: design and experimental validation. Applied Optics. 51(8). 1049–1049. 6 indexed citations
12.
Fendler, Manuel, et al.. (2012). Infrared camera based on a curved retina. Optics Letters. 37(4). 653–653. 25 indexed citations
13.
Druart, Guillaume, et al.. (2012). Integration of wide field-of-view imagery functions in a detector dewar cooler assembly. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 8353. 835322–835322. 3 indexed citations
14.
Fendler, Manuel, et al.. (2012). Curved focal plane detector array for wide field cameras. Applied Optics. 51(22). 5419–5419. 33 indexed citations
15.
Druart, Guillaume, et al.. (2011). Towards infrared DDCA with an imaging function. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 8012. 801228–801228. 10 indexed citations
16.
Druart, Guillaume, Nicolas Guérineau, Jean Taboury, et al.. (2009). Compact infrared pinhole fisheye for wide field applications. Applied Optics. 48(6). 1104–1104. 13 indexed citations
17.
Druart, Guillaume, Nicolas Guérineau, Riad Haïdar, et al.. (2009). Demonstration of an infrared microcamera inspired by Xenos peckii vision. Applied Optics. 48(18). 3368–3368. 35 indexed citations
18.
Baylet, J., P. Ballet, Pierre Castelein, et al.. (2006). TV/4 dual-band HgCdTe infrared focal plane arrays with a 25-εm pitch and spatial coherence. Journal of Electronic Materials. 35(6). 1153–1158. 15 indexed citations
19.
Davoine, Céline, et al.. (2006). Low Temperature Fluxless Flip-Chip Technology for Fine Pitch Bonding. 24–28. 9 indexed citations
20.
Ballet, P., Pierre Castelein, J. Baylet, et al.. (2005). Demonstration of a 25μm pitch TV/4 dual-band HgCdTe infrared focal plane array with spatial coherence. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5957. 595703–595703. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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